Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Broadening Uses Put MEMS Technology on the Map(s)

Abstract:
Behind the smart phone's continuing transformation into the quintessential multipurpose tool is the rise and diversification of microelectromechanical systems (MEMS), tiny machines that work the speakers, projectors, gyroscopes and other built-in gadgets that are inspiring a profusion of mobile applications.

Broadening Uses Put MEMS Technology on the Map(s)

Gaithersburg, MD | Posted on May 25th, 2011

To date, the MEMS industry has earned the bulk of its global revenue—about $7 billion in 2010—from sales of accelerometers (for airbags) and other sensors for the automotive industry along with components for ink-jet printers, displays and hard-disk drives. But it's a sign of their rise in status that MEMS are getting singled out for recognition by both the semiconductor and electronics industries in their respective technology roadmaps. Industry roadmaps are forecasts of technology advances and processing improvements necessary to sustain progress in enhancing the performance of products while minimizing manufacturing costs.

"Until only recently, MEMS devices have been viewed as distant cousins to computer chip technologies and consumer electronics," says Michael Gaitan, leader of the Enabling Devices Group at the National Institute of Standards and Technology (NIST). "But with the rapid growth of mobile computing devices like smart phones and tablets, MEMS devices are becoming the indispensable 'eyes and ears' of information technology products."

Gaitan chaired the MEMS Technology Working Group that participated in drafting the 1,800-page technology roadmap just issued by the International Electronics Manufacturing Initiative (iNEMI). For the first time since 1994, when the consortium began producing biennnial roadmaps for the electronics industry, this year's installment contains a chapter devoted to understanding the evolution of MEMS technology and the technical challenges to achieving the manufacturing capabilities that will be required over the next 10 years.

The working group has identified key challenges and gaps in device and reliability testing, wafer-level testing, modeling and simulation tools to support MEMS design, and standardization of assembly processes and packaging.

"The MEMS industry faces a set of common technical challenges that may be solved more efficiently through cooperation," says Gaitan, who is currently working on assignment to the NIST Technology Innovation Program. "The cost of testing, for example, is rising. It now accounts for up to half of the total cost of making some MEMS devices. If this trend isn't reversed, sales and market growth will be at risk."

Gaitan now chairs a newly launched MEMS Technology Working Group that will contribute to the next version of the International Technology Roadmap for Semiconductors (ITRS). This working group is focusing on MEMS devices integrated into today's smart phones, including accelerometers, gyroscopes and microphones, as well as emerging MEMS that will enable new uses of mobile information technologies. Projecting 15 years into the future, the working group is assessing requirements for device performance, design and simulation tools, packaging and integration, and testing. Their assessment will be included in the 2011 edition of the ITRS, which will be issued later this year. The ITRS has helped the semiconductor industry continue the decades-long trend of doubling the number of transistors on a computer chip about every two years.

The MEMS Industry Group, a trade association focused on advancing MEMS across global markets, has contributed to both roadmapping activities.

NIST's participation in the iNEMI and ITRS efforts helps to guide its laboratory programs aimed at developing the measurement capabilities that industry will require to make current and next-generation technologies.

####

About NIST
The National Institute of Standards and Technology (NIST) is an agency of the U.S. Department of Commerce.

For more information, please click here

Contacts:
Mark Bello
(301) 975-3776

Copyright © NIST

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Laboratories

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Landscapes give latitude to 2-D material designers: Rice University, Oak Ridge scientists show growing atom-thin sheets on cones allows control of defects August 9th, 2017

'Perfect Liquid' Quark-Gluon Plasma is the Most Vortical Fluid: Swirling soup of matter's fundamental building blocks spins ten billion trillion times faster than the most powerful tornado, setting new record for "vorticity" August 4th, 2017

Govt.-Legislation/Regulation/Funding/Policy

Researchers printed graphene-like materials with inkjet August 17th, 2017

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

2-faced 2-D material is a first at Rice: Rice University materials scientists create flat sandwich of sulfur, molybdenum and selenium August 14th, 2017

Engineers pioneer platinum shell formation process – and achieve first-ever observation August 11th, 2017

MEMS

First Capacitive Transducer with 13nm Gap July 27th, 2017

Bosch announces high-performance MEMS acceleration sensors for wearables June 27th, 2017

Smart multi-layered magnetic material acts as an electric switch: New study reveals characteristic of islands of magnetic metals between vacuum gaps, displaying tunnelling electric current March 1st, 2017

Engineers shrink microscope to dime-sized device February 17th, 2017

Chip Technology

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Surprise discovery in the search for energy efficient information storage August 10th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Announcements

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Alliances/Trade associations/Partnerships/Distributorships

Oxford Instruments Plasma Technology announces a new partner in Korea August 15th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Technology Companies Join Forces for TEM Imaging and Analysis August 3rd, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project