Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Alchimer Product Extension Provides Metallization For Interposer and Via Last in 3D Packaging: AquiVantage Enhances Interposer Metallization and Via Last, Cuts Processing Costs in Half for Chip-to-Board Interconnect and Eliminates CMP, Litho Process Steps

Abstract:
Alchimer, a leading provider of nanometric film deposition for advanced 3D packaging applications as well as semiconductor interconnects, MEMS and other electronic technologies, today announced a new wet-deposition process, AquiVantage, that grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects.

Alchimer Product Extension Provides Metallization For Interposer and Via Last in 3D Packaging: AquiVantage Enhances Interposer Metallization and Via Last, Cuts Processing Costs in Half for Chip-to-Board Interconnect and Eliminates CMP, Litho Process Steps

Massy, France | Posted on May 18th, 2011

AquiVantage uses the same cost-saving technology as Alchimer's wet processes for through-silicon vias (TSVs). It provides extremely high-quality films, while also eliminating several process steps, including two costly photolithography steps. It therefore marks a fundamental shift in the construction of interposer for 3D chip packages. Overall, interposer cost savings of more than 50 percent are achievable with AquiVantage; in addition, the technology accommodates thicker wafers, eliminating the need for wafer carriers and allows for highly scalloped viastructures and faster etching times, allowing users to gain cost advantages.

AquiVantage is also well suited for via-last 3D packaging process flows, with similar savings in complexity and cost.

Interposers, an intermediate connecting layer between stacked-chip packages and printed circuit boards, are key to the migration of 3D packaging into high-volume production. They provide a reliable interface for data, power, and other connections between increasingly complex packaged semiconductors and the circuit boards that serve as the backbone of smartphones, tablet computers, and other electronic systems.

Interposers incorporate a TSV structure, as well as front-side redistribution circuitry (for attachment to the chip stack) and back-side redistribution and bumping (for attachment to the circuit board).

The AquiVantage process provides concurrent wet deposition of TSV and front-side isolation, barrier, and copper fill/RDL, while eliminating CMP and dry deposition steps. It also supports smaller vias with higher aspect ratios. On the backside, the AquiVantage process allows selective maskless growth of the on-silicon isolation layer, completely eliminating an entire expose/develop/etch/clean lithography-process cycle.

AquiVantage offers significant potential for cost savings and improved margins at multiple levels of the supply chain, from IDMs to OSATs and foundries. In addition to savings from process simplification, there are also significant economies from eliminating several dry-process tools and their associated cleanroom space, infrastructure and power consumption.

"This extension of our product suite is another step towards Alchimer's goal of providing the electronics industry with its first truly new metallization alternative in decades. We are applying fundamental molecular-materials science to the grand challenges of cost and film quality, and are now able to offer a unified approach to film deposition that can extend all the way to wafer bumping," said Alchimer CEO Steve Lerner. "We are confident that AquiVantage can have a tremendous positive impact on the business models of manufacturing enterprises all along the electronics value chain, through simplification, economy, efficiency, and environmentalresponsibility."

####

About Alchimer
Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films used in a variety of microelectronic and MEMS applications, including wafer-level interconnects and TSVs (through-silicon vias) for 3D packaging. The company’s breakthrough technology, Electrografting (eG™), is an electrochemical-based process that enables the growth of very thin coatings, of various types, onboth conducting and semiconducting surfaces. Alchimer’s potential was initially recognized by the Strategic Industrial Innovation Programme of OSEO, which supports state-of-the-art technologies with a high likelihood of commercialization, and the company was spun off from the Commissariat à l’Energie Atomique (CEA) in 2001. Based in Massy, France, it won the First National Award for the Creation of High Tech Companies from the French Minister of Research and Industry and is a Red Herring Top 100 European Company.

For more information, please click here

Contacts:
Jana Yuen
Loomis Group
Phone: +33 1 58 18 59 30

Copyright © Alchimer S.A.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Researchers develop artificial building blocks of life March 8th, 2024

How surface roughness influences the adhesion of soft materials: Research team discovers universal mechanism that leads to adhesion hysteresis in soft materials March 8th, 2024

Two-dimensional bimetallic selenium-containing metal-organic frameworks and their calcinated derivatives as electrocatalysts for overall water splitting March 8th, 2024

Curcumin nanoemulsion is tested for treatment of intestinal inflammation: A formulation developed by Brazilian researchers proved effective in tests involving mice March 8th, 2024

MEMS

Bosch launches longevity program for industrial and IoT applications: High-performance accelerometer, IMU and pressure sensor with 10-year availability July 23rd, 2020

CEA-Leti Develops Tiny Photoacoustic-Spectroscopy System For Detecting Chemicals & Gases: Paper at Photonics West to Present Detector that Could Cost 10x Less Than Existing Systems and Prompt Widespread Use of the Technology February 4th, 2020

MEMS & Sensors Executive Congress Technology Showcase Finalists Highlight Innovations in Automotive, Biomedical and Consumer Electronics: MSIG MEMS & Sensors Executive Congress – October 22-24, 2019, Coronado, Calif. October 1st, 2019

ULVAC Launches Revolutionary PZT Piezoelectric Thin-film Process Technology and HVM Solution for MEMS Sensors/Actuators: Enabling Reliable, High-quality Film Production for Next Generation Devices August 16th, 2019

Chip Technology

New chip opens door to AI computing at light speed February 16th, 2024

HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024

Electrons screen against conductivity-killer in organic semiconductors: The discovery is the first step towards creating effective organic semiconductors, which use significantly less water and energy, and produce far less waste than their inorganic counterparts February 16th, 2024

NRL discovers two-dimensional waveguides February 16th, 2024

Announcements

What heat can tell us about battery chemistry: using the Peltier effect to study lithium-ion cells March 8th, 2024

Curcumin nanoemulsion is tested for treatment of intestinal inflammation: A formulation developed by Brazilian researchers proved effective in tests involving mice March 8th, 2024

The Access to Advanced Health Institute receives up to $12.7 million to develop novel nanoalum adjuvant formulation for better protection against tuberculosis and pandemic influenza March 8th, 2024

Nanoscale CL thermometry with lanthanide-doped heavy-metal oxide in TEM March 8th, 2024

Tools

First direct imaging of small noble gas clusters at room temperature: Novel opportunities in quantum technology and condensed matter physics opened by noble gas atoms confined between graphene layers January 12th, 2024

New laser setup probes metamaterial structures with ultrafast pulses: The technique could speed up the development of acoustic lenses, impact-resistant films, and other futuristic materials November 17th, 2023

Ferroelectrically modulate the Fermi level of graphene oxide to enhance SERS response November 3rd, 2023

The USTC realizes In situ electron paramagnetic resonance spectroscopy using single nanodiamond sensors November 3rd, 2023

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project