Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > 4DS and SEMATECH Collaborate on Next Generation Non-volatile Memory Devices

Abstract:
4DS, Inc., a Silicon Valley RRAM technology company has joined SEMATECH's Front End Processes (FEP) to partner on efforts in non-volatile memory technology development.

4DS and SEMATECH Collaborate on Next Generation Non-volatile Memory Devices

Fremont, CA | Posted on April 12th, 2011

4DS will closely collaborate with engineers from SEMATECH's memory program to build a full transistor-memory to demonstrate a working prototype of a low power RRAM device based on 4DS' proprietary material processes and device structures.

RRAM is a next generation non-volatile memory gaining momentum with industrial and academic efforts worldwide. RRAM is attractive as a replacement for FLASH memory and as a complement for non-volatile memory applications due to its speed, power profile and scaling. One of the published obstacles in deploying robust RRAM has been establishing a stable memory element. The race to develop circuits has left a gap for development of reliable materials and deposition techniques for low cost manufacturing.

"SEMATECH is pleased to welcome 4DS as a partner," said Raj Jammy, vice president of emerging technologies at SEMATECH. "4DS' unique expertise in RRAM materials technology will complement our device, process and characterization expertise. The joint partnership will expand on SEMATECH's current collaborative efforts to develop suitable materials and process techniques for future non-volatile memory applications."

The 4DS platform for non-volatile memory is a low temperature CMOS compatible, back end of line (BEOL) process with a simple structure that requires significantly fewer mask steps than FLASH memory. It potentially operates with significantly lower power and writes faster than conventional flash memories. The Company spent years developing materials and processes with a promising combination of simplified structures for manufacturing with low power performance. The 4DS team is comprised of Silicon Valley veterans in material science, processing, equipment and memory device engineering. "This novel structure and simplified process reflects 4DS know-how in materials processing and manufacturing", said 4DS' Chief Scientist, Dongmin Chen, a nanoscale quantum physicist and former Harvard Rowland Institute Fellow. "The SEMATECH collaboration will produce further validation of the 4DS offering," said Chen.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About 4DS

4DS, Inc. is a privately held company leading the development of RRAM materials, processes and equipment for production of RRAM. The Company has attracted the attention of a wide range of device manufacturers and partners to develop both stand alone and embedded memory applications.

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Composite Pipe Long Term Testing Facility February 10th, 2016

Scientists take nanoparticle snapshots February 10th, 2016

Chemical cages: New technique advances synthetic biology February 10th, 2016

New thin film transistor may lead to flexible devices: Researchers engineer an electronics first, opening door to flexible electronics February 10th, 2016

Chip Technology

New thin film transistor may lead to flexible devices: Researchers engineer an electronics first, opening door to flexible electronics February 10th, 2016

SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology: Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly February 9th, 2016

Electron's 1-D metallic surface state observed: A step for the prediction of electronic properties of extremely-fine metal nanowires in next-generation semiconductors February 9th, 2016

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

Memory Technology

A step towards keeping up with Moore's Law: POSTECH researchers develop a novel and efficient fabrication technology for cross-shaped memristor January 30th, 2016

Scientists build a neural network using plastic memristors: A group of Russian and Italian scientists have created a neural network based on polymeric memristors -- devices that can potentially be used to build fundamentally new computers January 28th, 2016

LC.300 Series Nanopositioning Controller from nPoint January 28th, 2016

First all-antiferromagnetic memory device could get digital data storage in a spin January 16th, 2016

Announcements

Composite Pipe Long Term Testing Facility February 10th, 2016

Scientists take nanoparticle snapshots February 10th, 2016

Chemical cages: New technique advances synthetic biology February 10th, 2016

New thin film transistor may lead to flexible devices: Researchers engineer an electronics first, opening door to flexible electronics February 10th, 2016

Alliances/Trade associations/Partnerships/Distributorships

SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology: Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly February 9th, 2016

Vesper Collaborates with GLOBALFOUNDRIES to Deliver First Piezoelectric MEMS Microphones: Acoustic sensing company works with top foundry to support mass-market consumer products January 21st, 2016

Imec and Cloudtag Collaborate on High Quality Frictionless Wearables for Lifestyle Coaching: Next-generation health and fitness tracker Cloudtag TrackTM launched at CES 2016 January 7th, 2016

Technical partnership at the top – Oxford Instruments and Zurich Instruments announce a technical collaboration for low temperature physics January 7th, 2016

Research partnerships

Chemical cages: New technique advances synthetic biology February 10th, 2016

SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology: Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly February 9th, 2016

Making sense of metallic glass February 9th, 2016

Nanoscale cavity strongly links quantum particles: Single photons can quickly modify individual electrons embedded in a semiconductor chip and vice versa February 8th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic