Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Imec and Renesas Electronics Announce Development of an Innovative SAW-Less Reconfigurable Transceiver

Imec’s SAW-less reconfigurable transceiver in 40nm CMOS
Click on the picture to download the high-res version.
Imec’s SAW-less reconfigurable transceiver in 40nm CMOS Click on the picture to download the high-res version.

Abstract:
At this week's International Solid-State Circuit Conference (ISSCC2011), imec and Renesas Electronics Corporation (TSE: 6723) present a highly-linear reconfigurable transceiver, eliminating the need of surface acoustic wave (SAW) filters. The unique approach is a major breakthrough towards fully reconfigurable radios by relaxing the requirements of the antenna filters, which suffered today from limited flexibility due to the high filtering specs. The fully reconfigurable transceiver ‘Scaldio' is compatible with multiple wireless standards including the fourth generation mobile broadband standard 3GPP-LTE.

Imec and Renesas Electronics Announce Development of an Innovative SAW-Less Reconfigurable Transceiver

Leuven, Belgium and Tokyo, Japan | Posted on February 23rd, 2011

The trend in wireless communication where terminals give their users ubiquitous access to a multitude of services drives the development of reconfigurable radios in deep-submicron CMOS. For emerging standards such as 3GPP-LTE, which use a broad range of operating frequencies and bandwidths, multi-mode capabilities of the radio are a must. Scaldio provides a solution to the handset manufacturers, which face the challenge of developing fully reconfigurable radios for a wide range of networks.

One of the major obstacles today in designing fully reconfigurable radios is making the antenna filters reconfigurable due to their stringent requirements. By making the Scaldio receiver highly linear, more out-of-band blocker interference can be allowed in the RF receiver, avoiding the need of SAW filters and consequently enabling a simplified antenna interface. With 3dB noise figure and capable of handling a 0dBm blocker at 20MHz offset, the receiver has the highest blocker resilience for low noise figures. The fully reconfigurable receiver also achieves the highest linearity (+10dBm IIP3, +70dBm IIP2), and frequency range reported up to now and handles blockers well in any mode.

The transmitter combines adaptive out-of-band noise filtering with voltage-sampling up-conversion to achieve RX band noise down to -162dBc/Hz allowing also here SAW-less operation. SAW-less transmitters become more and more important with the evolution towards future standards such as 3GPP-LTE where transmitters will need to operate in multiple FDD (frequency division duplex) bands.

The reconfigurable receiver and transmitter technology is suitable for mobile handsets and all kind of battery-powered wireless connectivity devices, as well as for base-stations for small cells, and can be programmed to meet the requirements for many standards and dedicated needs.

"We are pleased to have contributed to this major milestone of imec's research program on fully reconfigurable radios using state-of-the-art CMOS technology;" said Yoshinobu Nakagome, associate general manager of Mixed Signal Core Development Division Technology Development Unit at Renesas Electronics Corporation. "This accomplishment is an important step towards our integrated RF solution for next generation multimode wireless communication systems. Based on these impressive results, we extended our research partnership with imec for 3 years."

"We are honored that Renesas Electronics will continue to collaborate within our wireless communication program the coming 3 years. As one of the leading companies in next generation wireless communication, Renesas is an ideal partner to collaborate on the strategy and developing the technologies for future wireless communication systems;" said Liesbet Van der Perre, director green radio programs at imec.

####

About IMEC
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of more than 1,750 people includes over 550 industrial residents and guest researchers. In 2009, imec's revenue (P&L) was 275 million euro. Further information on imec can be found at www.imec.be.

About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723), the world's number one supplier of microcontrollers, is a premier supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad-range of analog and power devices. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. Headquartered in Japan, Renesas Electronics has subsidiaries in 20 countries worldwide. More information can be found at www.renesas.com.

(Remarks) Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.). All product and service names that appear in this press release are trademarks or registered trademarks of their respective owners.

For more information, please click here

Contacts:
imec
Katrien Marent
Director of External Communications
T: +32 16 28 18 80
Mobile: +32 474 30 28 66


Renesas Electronics
Kyoko Okamoto
T:+ 81-3-6756-5555

Copyright © IMEC

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Hardware

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

First Capacitive Transducer with 13nm Gap July 27th, 2017

Nanoelectronics

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles: Silicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, ene August 3rd, 2017

Scientists discover new magnet with nearly massless charge carriers July 29th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

Announcements

The power of perovskite: OIST researchers improve perovskite-based technology in the entire energy cycle, from solar cells harnessing power to LED diodes to light the screens of future electronic devices and other lighting applications August 18th, 2017

Gold nanostars and immunotherapy vaccinate mice against cancer: New treatment cures, vaccinates mouse in small proof-of-concept study August 18th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Events/Classes

FRITSCH • Milling and Sizing! Innovations at POWTECH 2017 - Hall 2 • Stand 227 August 9th, 2017

Thermo Fisher Scientific Showcases Innovations in Electron Microscopy and Spectroscopy at M&M 2017: New analytical technologies improve workflows for life sciences and materials science researchers August 8th, 2017

Nanometrics Announces Upcoming Investor Events August 3rd, 2017

Arrowhead Pharmaceuticals to Webcast Fiscal 2017 Third Quarter Results July 27th, 2017

Alliances/Trade associations/Partnerships/Distributorships

Oxford Instruments Plasma Technology announces a new partner in Korea August 15th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Technology Companies Join Forces for TEM Imaging and Analysis August 3rd, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project