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Nanometrics Incorporated (Nasdaq: NANO), a leading provider of advanced process control metrology systems, today announced that a leading manufacturer of advanced logic devices has taken delivery of its next generation UniFire™ 7900IR metrology system for 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.
"Careful control of lithography and etching in the Through Silicon Via (TSV) flow, bumping, and wafer-to-wafer bonding processes is critical to enable high yielding devices for next generation advanced packaging. This latest system offers a new 3D inspection capability as well as an infra-red (IR) microscope option allowing direct measurement of features and structures in bonded wafer stacks, effectively seeing through the wafers," commented Dr. Michael Darwin, Vice President of the UniFire and Materials Characterization Groups at Nanometrics. "The UniFire's full surface topography metrology capability has secured it as the tool of choice for process control metrology in wafer scale packaging. With this new capability, Nanometrics expands the market and applications for the Unifire to include full 3D inspection of devices fabricated using advanced packaging technologies."
Existing UniFire systems can be field upgraded with both IR and 3D inspection options to further extend the capability of installed tools.
To learn more about the UniFire 7900IR and Nanometrics process control metrology solutions, visit Nanometrics at SPIE Advanced Lithography, San Jose Convention Center, March 1st-2nd.
About Nanometrics Incorporated
Nanometrics is a leading provider of advanced, high-performance process control metrology systems used primarily in the fabrication of semiconductors, high-brightness LEDs, data storage devices and solar photovoltaics. Nanometrics’ automated and integrated metrology systems measure critical dimensions, device structures, overlay registration, topography and various thin film properties, including film thickness as well as optical, electrical and material properties. The company’s process control solutions are deployed throughout the fabrication process, from front-end-of-line substrate manufacturing, to high-volume production of semiconductors and other devices, to advanced wafer-scale packaging applications. Nanometrics’ systems enable device manufacturers to improve yields, increase productivity and lower their manufacturing costs. The company maintains its headquarters in Milpitas, California, with sales and service offices worldwide. Nanometrics is traded on NASDAQ Global Select Market under the symbol NANO.
Forward Looking Statements
This press release contains forward-looking statements including, but not limited to, statements regarding the capabilities of the company’s metrology products and technological leadership. Although Nanometrics believes that the expectations reflected in the forward-looking statements are reasonable, expectations regarding product capabilities are subject to a number of risks, including changes in customer spending plans, worldwide economic conditions and the continued technological leadership of our products. For additional information and considerations regarding the risks faced by Nanometrics, see its annual report on Form 10-K for the year ended January 2, 2010 as filed with the Securities and Exchange Commission, as well as other periodic reports filed with the SEC from time to time. Nanometrics disclaims any obligation to update information contained in any forward-looking statement.
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