Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Abstract:
CEA-Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES On Advanced Chip-to-Wafer Technologies for 3D Integration

Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Grenoble, France | Posted on February 22nd, 2011

CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.

Leti has acquired a customized 300mm FC300 pick-and-place tool from SET, Smart Equipment Technology, to demonstrate the technology.

The customized system will be used by the Minalogic PROCEED project. Minalogic is the global competitive cluster specialized in micro- and nanotechnologies and embedded intelligence. In addition to Leti and SET, partners are STMicroelectronics, ALES and the CNRS-CEMES. The PROCEED Minalogic project is a 4.2 million-euro, 24-month project that began in December 2009 and is supported by French FIU (Fond Interministeriel Unique).

The chip-to-wafer direct-metallic-bonding technology was developed at Leti to break through certain 3D-integration limitations. For example, the technology allows chips to be attached to a substrate at low temperature and with low bonding pressure. This technology also allows interconnecting the chip and the substrate electrically through local metallic bonding.

"This collaboration puts Leti in a very good worldwide position for 3D-technologies development," said Leti CEO Laurent Malier. "We will identify the key challenges of 3D product engineering, and chip-to-wafer strategy with direct-metallic bonding is a very promising option for overcoming those challenges."

The equipment was developed by SET based on its high placement accuracy FC300 system to adapt it to direct-metallic-bonding requirements.

"SET is proud to be leading the Minalogic project, PROCEED, in collaboration with STMicroelectronics, CEA-Leti, ALES and the CNRS-CEMES," said Gaël Schmidt, managing director of SET. "It provides cutting-edge equipment solutions enabling the CEA-Leti process integration. SET has a strong interest for this non-thermocompression metal-to-metal bonding, which may be a key to throughput improvement required for the adoption of 3D-IC integration."

####

About CEA-Leti
CEA is a French research and technology organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m˛ state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 190 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,700 patent families.

About SET
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder to the automated FC150 and FC300, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. SET is a wholly owned subsidiary of Replisaurus Technologies. Further information is available on www.set-sas.fr.

For more information, please click here

Contacts:
Press Contacts:
CEA-Leti
Thierry Bosc
+33 4 38 78 31 95


Agency
Amélie Ravier
+33 1 58 18 59 30


SET
Gilbert Lecarpentier
International Product Manager
+33 (0) 686 28 1224

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Iran to Hold 3rd Int'l Engineering Materials, Metallurgy Conference October 25th, 2014

Haydale Secures Exclusive Development and Supply Agreement with Tantec A/S: New reactors to be built and commissioned by Tantec A/S represent another step forward towards the commercialisation of graphene October 24th, 2014

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

SUNY Polytechnic Institute Invites the Public to Attend its Popular Statewide 'NANOvember' Series of Outreach and Educational Events October 23rd, 2014

Govt.-Legislation/Regulation/Funding/Policy

Novel Rocket Design Flight Tested: New Rocket Propellant and Motor Design Offers High Performance and Safety October 23rd, 2014

Strengthening thin-film bonds with ultrafast data collection October 23rd, 2014

Brookhaven Lab Launches Computational Science Initiative:Leveraging computational science expertise and investments across the Laboratory to tackle "big data" challenges October 22nd, 2014

Bipolar Disorder Discovery at the Nano Level: Tiny structures found in brain synapses help scientists better understand disorder October 22nd, 2014

MEMS

MEMS & Sensors Technology Showcase: Finalists Announced for MEMS Executive Congress US 2014 October 23rd, 2014

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

Carbyne morphs when stretched: Rice University calculations show carbon-atom chain would go metal to semiconductor July 21st, 2014

Leti to Present Technological Platforms Targeting Industry’s Needs for the Future at Semicon West Workshop: Presentation at STS Session to Focus on Leti Advanced Lithography Programs for 1x Nodes and on Silicon Photonics at TechXPot June 25th, 2014

Chip Technology

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

Strengthening thin-film bonds with ultrafast data collection October 23rd, 2014

NIST offers electronics industry 2 ways to snoop on self-organizing molecules October 22nd, 2014

Materials for the next generation of electronics and photovoltaics: MacArthur Fellow develops new uses for carbon nanotubes October 21st, 2014

Nanoelectronics

NIST offers electronics industry 2 ways to snoop on self-organizing molecules October 22nd, 2014

Materials for the next generation of electronics and photovoltaics: MacArthur Fellow develops new uses for carbon nanotubes October 21st, 2014

Crystallizing the DNA nanotechnology dream: Scientists have designed the first large DNA crystals with precisely prescribed depths and complex 3D features, which could create revolutionary nanodevices October 20th, 2014

Imaging electric charge propagating along microbial nanowires October 20th, 2014

Announcements

Iran to Hold 3rd Int'l Engineering Materials, Metallurgy Conference October 25th, 2014

Haydale Secures Exclusive Development and Supply Agreement with Tantec A/S: New reactors to be built and commissioned by Tantec A/S represent another step forward towards the commercialisation of graphene October 24th, 2014

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

Strengthening thin-film bonds with ultrafast data collection October 23rd, 2014

Tools

Haydale Secures Exclusive Development and Supply Agreement with Tantec A/S: New reactors to be built and commissioned by Tantec A/S represent another step forward towards the commercialisation of graphene October 24th, 2014

National Synchrotron Light Source II Achieves 'First Light' October 23rd, 2014

Advancing thin film research with nanostructured AZO: Innovnano’s unique and cost-effective AZO sputtering targets for the production of transparent conducting oxides October 23rd, 2014

NIST offers electronics industry 2 ways to snoop on self-organizing molecules October 22nd, 2014

Photonics/Optics/Lasers

Physicists build reversible laser tractor beam October 20th, 2014

Magnetic mirrors enable new technologies by reflecting light in uncanny ways October 16th, 2014

New VDMA Association "Electronics, Micro and Nano Technologies" founded: Inaugural Meeting in Frankfurt/Main, Germany October 15th, 2014

Nanodevices for clinical diagnostic with potential for the international market: The development is based on optical principles and provides precision and allows saving vital time for the patient October 15th, 2014

Alliances/Partnerships/Distributorships

European Commission opens the gate towards the implementation of Nanomedicine Translation Hub October 16th, 2014

IRLYNX and CEA-Leti to Streamline New CMOS-based Infrared Sensing Modules Dedicated to Human-activities Characterization October 15th, 2014

New VDMA Association "Electronics, Micro and Nano Technologies" founded: Inaugural Meeting in Frankfurt/Main, Germany October 15th, 2014

VDMA photonics steering committee with new members stronger than ever October 14th, 2014

NanoNews-Digest
The latest news from around the world, FREE





  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE