Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Abstract:
CEA-Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES On Advanced Chip-to-Wafer Technologies for 3D Integration

Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Grenoble, France | Posted on February 22nd, 2011

CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.

Leti has acquired a customized 300mm FC300 pick-and-place tool from SET, Smart Equipment Technology, to demonstrate the technology.

The customized system will be used by the Minalogic PROCEED project. Minalogic is the global competitive cluster specialized in micro- and nanotechnologies and embedded intelligence. In addition to Leti and SET, partners are STMicroelectronics, ALES and the CNRS-CEMES. The PROCEED Minalogic project is a 4.2 million-euro, 24-month project that began in December 2009 and is supported by French FIU (Fond Interministeriel Unique).

The chip-to-wafer direct-metallic-bonding technology was developed at Leti to break through certain 3D-integration limitations. For example, the technology allows chips to be attached to a substrate at low temperature and with low bonding pressure. This technology also allows interconnecting the chip and the substrate electrically through local metallic bonding.

"This collaboration puts Leti in a very good worldwide position for 3D-technologies development," said Leti CEO Laurent Malier. "We will identify the key challenges of 3D product engineering, and chip-to-wafer strategy with direct-metallic bonding is a very promising option for overcoming those challenges."

The equipment was developed by SET based on its high placement accuracy FC300 system to adapt it to direct-metallic-bonding requirements.

"SET is proud to be leading the Minalogic project, PROCEED, in collaboration with STMicroelectronics, CEA-Leti, ALES and the CNRS-CEMES," said Gaël Schmidt, managing director of SET. "It provides cutting-edge equipment solutions enabling the CEA-Leti process integration. SET has a strong interest for this non-thermocompression metal-to-metal bonding, which may be a key to throughput improvement required for the adoption of 3D-IC integration."

####

About CEA-Leti
CEA is a French research and technology organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 190 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,700 patent families.

About SET
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder to the automated FC150 and FC300, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. SET is a wholly owned subsidiary of Replisaurus Technologies. Further information is available on www.set-sas.fr.

For more information, please click here

Contacts:
Press Contacts:
CEA-Leti
Thierry Bosc
+33 4 38 78 31 95


Agency
Amélie Ravier
+33 1 58 18 59 30


SET
Gilbert Lecarpentier
International Product Manager
+33 (0) 686 28 1224

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Video captures bubble-blowing battery in action: Researchers propose how bubbles form, could lead to smaller lithium-air batteries April 26th, 2017

New Product Nanoparticle preparation from Intertronics with new Thinky NP-100 Nano Pulveriser April 26th, 2017

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

Affordable STM32 Cloud-Connectable Kit from STMicroelectronics Puts More Features On-Board for Fast and Flexible IoT-Device Development April 26th, 2017

Govt.-Legislation/Regulation/Funding/Policy

Graphene holds up under high pressure: Used in filtration membranes, ultrathin material could help make desalination more productive April 24th, 2017

Nanoparticle vaccine shows potential as immunotherapy to fight multiple cancer types April 24th, 2017

NanoMONITOR shares its latest developments concerning the NanoMONITOR Software and the Monitoring stations April 21st, 2017

Better living through pressure: Functional nanomaterials made easy April 19th, 2017

MEMS

Smart multi-layered magnetic material acts as an electric switch: New study reveals characteristic of islands of magnetic metals between vacuum gaps, displaying tunnelling electric current March 1st, 2017

Engineers shrink microscope to dime-sized device February 17th, 2017

Leti Coordinating Project to Adapt Obstacle-Detection Technology Used in Autonomous Cars for Portable and Wearable Systems: INSPEX to Combine Knowhow of Nine European Organizations to Create Portable and Wearable Spatial-Exploration Systems February 2nd, 2017

Manufacturing platform makes intricate biocompatible micromachines January 7th, 2017

Chip Technology

Geoffrey Beach: Drawn to explore magnetism: Materials researcher is working on the magnetic memory of the future April 25th, 2017

'Neuron-reading' nanowires could accelerate development of drugs for neurological diseases April 12th, 2017

Nanometrics to Announce First Quarter Financial Results on May 2, 2017 April 11th, 2017

AIM Photonics Presents Cutting-Edge Integrated Photonics Technology Developments to Packed House at OFC 2017, the Optical Networking and Communication Conference & Exhibition April 11th, 2017

Nanoelectronics

Researchers “iron out” graphene’s wrinkles: New technique produces highly conductive graphene wafers April 3rd, 2017

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

UC researchers use gold coating to control luminescence of nanowires: University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper March 17th, 2017

Announcements

Video captures bubble-blowing battery in action: Researchers propose how bubbles form, could lead to smaller lithium-air batteries April 26th, 2017

New Product Nanoparticle preparation from Intertronics with new Thinky NP-100 Nano Pulveriser April 26th, 2017

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

Affordable STM32 Cloud-Connectable Kit from STMicroelectronics Puts More Features On-Board for Fast and Flexible IoT-Device Development April 26th, 2017

Tools

New Product Nanoparticle preparation from Intertronics with new Thinky NP-100 Nano Pulveriser April 26th, 2017

Affordable STM32 Cloud-Connectable Kit from STMicroelectronics Puts More Features On-Board for Fast and Flexible IoT-Device Development April 26th, 2017

Geoffrey Beach: Drawn to explore magnetism: Materials researcher is working on the magnetic memory of the future April 25th, 2017

NanoMONITOR shares its latest developments concerning the NanoMONITOR Software and the Monitoring stations April 21st, 2017

Photonics/Optics/Lasers

Using light to propel water : With new method, MIT engineers can control and separate fluids on a surface using only visible light April 25th, 2017

Method improves semiconductor fiber optics, paves way for developing devices April 16th, 2017

AIM Photonics Presents Cutting-Edge Integrated Photonics Technology Developments to Packed House at OFC 2017, the Optical Networking and Communication Conference & Exhibition April 11th, 2017

Photonics breakthough paving the way for improved wireless communication systems: The work could bolster the wireless revolution underway with efficiencies several orders of magnitude April 5th, 2017

Alliances/Trade associations/Partnerships/Distributorships

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

BASF and Landa partner to create revolutionary pigments for automotive coatings: The alliance combines BASF innovations with Landa nano-pigment technology April 5th, 2017

Leti Announces EU/South Korean Project for World’s First 5G-system Prototype: Coinciding with the 2018 Winter Games in PyeongChang, Korea, Prototype Will Be First Time State-of-the-art Terrestrial Wireless Communication Is Seamlessly Combined with Disruptive Satellite Communicati April 4th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project