Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Abstract:
CEA-Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES On Advanced Chip-to-Wafer Technologies for 3D Integration

Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Grenoble, France | Posted on February 22nd, 2011

CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.

Leti has acquired a customized 300mm FC300 pick-and-place tool from SET, Smart Equipment Technology, to demonstrate the technology.

The customized system will be used by the Minalogic PROCEED project. Minalogic is the global competitive cluster specialized in micro- and nanotechnologies and embedded intelligence. In addition to Leti and SET, partners are STMicroelectronics, ALES and the CNRS-CEMES. The PROCEED Minalogic project is a 4.2 million-euro, 24-month project that began in December 2009 and is supported by French FIU (Fond Interministeriel Unique).

The chip-to-wafer direct-metallic-bonding technology was developed at Leti to break through certain 3D-integration limitations. For example, the technology allows chips to be attached to a substrate at low temperature and with low bonding pressure. This technology also allows interconnecting the chip and the substrate electrically through local metallic bonding.

"This collaboration puts Leti in a very good worldwide position for 3D-technologies development," said Leti CEO Laurent Malier. "We will identify the key challenges of 3D product engineering, and chip-to-wafer strategy with direct-metallic bonding is a very promising option for overcoming those challenges."

The equipment was developed by SET based on its high placement accuracy FC300 system to adapt it to direct-metallic-bonding requirements.

"SET is proud to be leading the Minalogic project, PROCEED, in collaboration with STMicroelectronics, CEA-Leti, ALES and the CNRS-CEMES," said Gaël Schmidt, managing director of SET. "It provides cutting-edge equipment solutions enabling the CEA-Leti process integration. SET has a strong interest for this non-thermocompression metal-to-metal bonding, which may be a key to throughput improvement required for the adoption of 3D-IC integration."

####

About CEA-Leti
CEA is a French research and technology organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m˛ state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 190 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,700 patent families.

About SET
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder to the automated FC150 and FC300, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. SET is a wholly owned subsidiary of Replisaurus Technologies. Further information is available on www.set-sas.fr.

For more information, please click here

Contacts:
Press Contacts:
CEA-Leti
Thierry Bosc
+33 4 38 78 31 95


Agency
Amélie Ravier
+33 1 58 18 59 30


SET
Gilbert Lecarpentier
International Product Manager
+33 (0) 686 28 1224

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

NMTI announces breakthrough solutions for HAMR nanoantenna for next-generation ultra-high density magnetic storage November 21st, 2014

Leica Microsystems Presents Universal Hybrid Detector for Single Molecule Detection and Imaging at SfN and ASCB: Leica HyD SMD - the Optimal Detector for Precise and Reliable SMD data November 20th, 2014

Silver Nanoparticles Produced in Iran from Forest Plants Extract November 20th, 2014

Nano Sorbents Able to Remove Pollutions Caused by Oil Derivatives November 20th, 2014

Govt.-Legislation/Regulation/Funding/Policy

NMTI announces breakthrough solutions for HAMR nanoantenna for next-generation ultra-high density magnetic storage November 21st, 2014

Sustainable Nanotechnologies Project November 20th, 2014

Quantum mechanical calculations reveal the hidden states of enzyme active sites November 20th, 2014

NRL Scientists Discover Novel Metamaterial Properties within Hexagonal Boron Nitride November 20th, 2014

MEMS

MEMS Industry Group's 10th Annual Executive Conference Showcases Rapid Innovation in MEMS/Sensors: Emphasizes Spirit of Collaboration, Supporting First Open-Source Algorithm Community, New Standardization Efforts November 10th, 2014

MEMS & Sensors Technology Showcase: Finalists Announced for MEMS Executive Congress US 2014 October 23rd, 2014

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

Carbyne morphs when stretched: Rice University calculations show carbon-atom chain would go metal to semiconductor July 21st, 2014

Chip Technology

Nanometrics Announces Upcoming Investor Events November 19th, 2014

A novel method for identifying the body’s ‘noisiest’ networks November 19th, 2014

Researchers create & control spin waves, lifting prospects for enhanced info processing November 17th, 2014

VDMA Electronics Production Equipment: Growth track for 2014 and 2015 confirmed: Business climate survey shows robust industry sector November 14th, 2014

Nanoelectronics

Leti Will Present 17 Papers at 2014 IEDM; the Highest-ever Total Includes Four Invited Papers: Institute also Will Present its Latest Results in Key Technologies and Its Roadmap for Silicon Nano-technologies at Workshop November 13th, 2014

Breakthrough in molecular electronics paves the way for DNA-based computer circuits in the future: DNA-based programmable circuits could be more sophisticated, cheaper and simpler to make October 27th, 2014

NIST offers electronics industry 2 ways to snoop on self-organizing molecules October 22nd, 2014

Materials for the next generation of electronics and photovoltaics: MacArthur Fellow develops new uses for carbon nanotubes October 21st, 2014

Announcements

NMTI announces breakthrough solutions for HAMR nanoantenna for next-generation ultra-high density magnetic storage November 21st, 2014

Leica Microsystems Presents Universal Hybrid Detector for Single Molecule Detection and Imaging at SfN and ASCB: Leica HyD SMD - the Optimal Detector for Precise and Reliable SMD data November 20th, 2014

Silver Nanoparticles Produced in Iran from Forest Plants Extract November 20th, 2014

Nano Sorbents Able to Remove Pollutions Caused by Oil Derivatives November 20th, 2014

Tools

Leica Microsystems Presents Universal Hybrid Detector for Single Molecule Detection and Imaging at SfN and ASCB: Leica HyD SMD - the Optimal Detector for Precise and Reliable SMD data November 20th, 2014

Nanometrics Announces Upcoming Investor Events November 19th, 2014

Two sensors in one: Nanoparticles that enable both MRI and fluorescent imaging could monitor cancer, other diseases November 18th, 2014

Field-emission plug-and-play solution for microwave electron guns: To simplify the electron emission mechanism involved in microwave electron guns, a team of researchers has created and demonstrated a field-emission plug-and-play solution based on ultrananocrystalline diamond November 18th, 2014

Photonics/Optics/Lasers

NRL Scientists Discover Novel Metamaterial Properties within Hexagonal Boron Nitride November 20th, 2014

Penn engineers efficiently 'mix' light at the nanoscale November 17th, 2014

'Direct writing' of diamond patterns from graphite a potential technological leap November 5th, 2014

Outsmarting Thermodynamics in Self-assembly of Nanostructures: Berkeley Lab reports method for symmetry-breaking in feedback-driven self-assembly of optical metamaterials November 4th, 2014

Alliances/Partnerships/Distributorships

UO-industry collaboration points to improved nanomaterials: University of Oregon microscope puts spotlight on the surface structure of quantum dots for designing new solar devices November 20th, 2014

A novel method for identifying the body’s ‘noisiest’ networks November 19th, 2014

Field-emission plug-and-play solution for microwave electron guns: To simplify the electron emission mechanism involved in microwave electron guns, a team of researchers has created and demonstrated a field-emission plug-and-play solution based on ultrananocrystalline diamond November 18th, 2014

VDMA Electronics Production Equipment: Growth track for 2014 and 2015 confirmed: Business climate survey shows robust industry sector November 14th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More












ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE