Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Abstract:
CEA-Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES On Advanced Chip-to-Wafer Technologies for 3D Integration

Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Grenoble, France | Posted on February 22nd, 2011

CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.

Leti has acquired a customized 300mm FC300 pick-and-place tool from SET, Smart Equipment Technology, to demonstrate the technology.

The customized system will be used by the Minalogic PROCEED project. Minalogic is the global competitive cluster specialized in micro- and nanotechnologies and embedded intelligence. In addition to Leti and SET, partners are STMicroelectronics, ALES and the CNRS-CEMES. The PROCEED Minalogic project is a 4.2 million-euro, 24-month project that began in December 2009 and is supported by French FIU (Fond Interministeriel Unique).

The chip-to-wafer direct-metallic-bonding technology was developed at Leti to break through certain 3D-integration limitations. For example, the technology allows chips to be attached to a substrate at low temperature and with low bonding pressure. This technology also allows interconnecting the chip and the substrate electrically through local metallic bonding.

"This collaboration puts Leti in a very good worldwide position for 3D-technologies development," said Leti CEO Laurent Malier. "We will identify the key challenges of 3D product engineering, and chip-to-wafer strategy with direct-metallic bonding is a very promising option for overcoming those challenges."

The equipment was developed by SET based on its high placement accuracy FC300 system to adapt it to direct-metallic-bonding requirements.

"SET is proud to be leading the Minalogic project, PROCEED, in collaboration with STMicroelectronics, CEA-Leti, ALES and the CNRS-CEMES," said Gaël Schmidt, managing director of SET. "It provides cutting-edge equipment solutions enabling the CEA-Leti process integration. SET has a strong interest for this non-thermocompression metal-to-metal bonding, which may be a key to throughput improvement required for the adoption of 3D-IC integration."

####

About CEA-Leti
CEA is a French research and technology organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 190 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,700 patent families.

About SET
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder to the automated FC150 and FC300, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. SET is a wholly owned subsidiary of Replisaurus Technologies. Further information is available on www.set-sas.fr.

For more information, please click here

Contacts:
Press Contacts:
CEA-Leti
Thierry Bosc
+33 4 38 78 31 95


Agency
Amélie Ravier
+33 1 58 18 59 30


SET
Gilbert Lecarpentier
International Product Manager
+33 (0) 686 28 1224

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Protein Building Blocks for Nanosystems: Scientists develop method for producing bio-based materials with new properties April 17th, 2015

Oxford Instruments commissions high field outsert magnet system for the National High Magnetic Field Laboratory 32 Tesla magnet program April 17th, 2015

QD Vision Expands Product Line with Two-Millimeter Color LCD Display Optic: Color IQ™ Optic Enables Full-Color Gamut for Ultra-Thin Displays and All-in-One Computers April 16th, 2015

The National Science Foundation names engineering researcher Andrea Alú its Alan T. Waterman awardee for 2015: Alú is a pioneer in the field of metamaterials who has developed "cloaking" technology to make objects invisible to sensors April 16th, 2015

Govt.-Legislation/Regulation/Funding/Policy

Oxford Instruments commissions high field outsert magnet system for the National High Magnetic Field Laboratory 32 Tesla magnet program April 17th, 2015

The National Science Foundation names engineering researcher Andrea Alú its Alan T. Waterman awardee for 2015: Alú is a pioneer in the field of metamaterials who has developed "cloaking" technology to make objects invisible to sensors April 16th, 2015

Long Island Capital Alliance Announces Participants for Brookhaven National Laboratory Technology Transfer Capital Forum on May 8: Keynote Speaker Dr. Doon Gibbs, Director of Brookhaven National Laboratory April 16th, 2015

Major advance in artificial photosynthesis poses win/win for the environment: Berkeley Lab researchers perform solar-powered green chemistry with captured CO2 April 16th, 2015

MEMS

Iranian Scientists Evaluate Dynamic Interaction between 2 Carbon Nanotubes April 14th, 2015

ASIC Development for MEMS Applications: A Platform Approach March 25th, 2015

STMicroelectronics Executive Vice-President Benedetto Vigna Awarded IEEE Frederik Philips Award March 12th, 2015

MIG Takes a Roll-Up-Your-Sleeves Approach with Revamped MEMS/Sensors Technical Event -- MIG welcomes technologists to MEMS Technical Congress, emphasizes working groups and breakout sessions on emerging MEMS & sensors, tech transfer and integration March 6th, 2015

Chip Technology

Nanotubes with two walls have singular qualities: Rice University lab calculates unique electronic qualities of double-walled carbon nanotubes April 16th, 2015

Graphenea embarks on a new era April 16th, 2015

Quantization of 'surface Dirac states' could lead to exotic applications April 15th, 2015

Study shows novel pattern of electrical charge movement through DNA April 14th, 2015

Nanoelectronics

Nanotubes with two walls have singular qualities: Rice University lab calculates unique electronic qualities of double-walled carbon nanotubes April 16th, 2015

Solution-grown nanowires make the best lasers April 14th, 2015

Water makes wires even more nano: Rice University lab extends meniscus-mask process to make sub-10 nanometer paths April 6th, 2015

Demonstration of 50GHz Ge Waveguide Electro-Absorption Modulator April 2nd, 2015

Announcements

Protein Building Blocks for Nanosystems: Scientists develop method for producing bio-based materials with new properties April 17th, 2015

Oxford Instruments commissions high field outsert magnet system for the National High Magnetic Field Laboratory 32 Tesla magnet program April 17th, 2015

Newly-Developed Nanocatalysts Increase Performance of Fuel Cells April 16th, 2015

Lanthanide-Organic Framework Nanothermometers Prepared by Spray-Drying April 16th, 2015

Tools

Oxford Instruments commissions high field outsert magnet system for the National High Magnetic Field Laboratory 32 Tesla magnet program April 17th, 2015

Lanthanide-Organic Framework Nanothermometers Prepared by Spray-Drying April 16th, 2015

Combined effort for structural determination April 15th, 2015

JPK reports on the use of the NanoWizard® 3 AFM system at the Hebrew University of Jerusalem April 14th, 2015

Photonics/Optics/Lasers

Protein Building Blocks for Nanosystems: Scientists develop method for producing bio-based materials with new properties April 17th, 2015

Light in a spin: Researchers demonstrate angular accelerating light April 15th, 2015

Graphene pushes the speed limit of light-to-electricity conversion: Researchers from ICFO, MIT and UC Riverside have been able to develop a graphene-based photodetector capable of converting absorbed light into an electrical voltage at ultrafast timescales April 14th, 2015

Scientists create invisible objects without metamaterial cloaking April 14th, 2015

Alliances/Partnerships/Distributorships

How can you see an atom? (video) April 10th, 2015

FibeRio and VF Corporation Form Strategic Partnership to Lead the Apparel and Footwear Markets in Nanofiber Technology April 8th, 2015

UK National Graphene Institute Selects Bruker as Official Partner: World-Leading Graphene Research Facility Purchases Multiple Bruker AFMs April 7th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE