Nanotechnology Now





Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Abstract:
CEA-Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES On Advanced Chip-to-Wafer Technologies for 3D Integration

Chip-to-Wafer Direct-Metallic-Bonding Technology Developed at Leti Used In Customized 300mm Device Bonder

Grenoble, France | Posted on February 22nd, 2011

CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.

Leti has acquired a customized 300mm FC300 pick-and-place tool from SET, Smart Equipment Technology, to demonstrate the technology.

The customized system will be used by the Minalogic PROCEED project. Minalogic is the global competitive cluster specialized in micro- and nanotechnologies and embedded intelligence. In addition to Leti and SET, partners are STMicroelectronics, ALES and the CNRS-CEMES. The PROCEED Minalogic project is a 4.2 million-euro, 24-month project that began in December 2009 and is supported by French FIU (Fond Interministeriel Unique).

The chip-to-wafer direct-metallic-bonding technology was developed at Leti to break through certain 3D-integration limitations. For example, the technology allows chips to be attached to a substrate at low temperature and with low bonding pressure. This technology also allows interconnecting the chip and the substrate electrically through local metallic bonding.

"This collaboration puts Leti in a very good worldwide position for 3D-technologies development," said Leti CEO Laurent Malier. "We will identify the key challenges of 3D product engineering, and chip-to-wafer strategy with direct-metallic bonding is a very promising option for overcoming those challenges."

The equipment was developed by SET based on its high placement accuracy FC300 system to adapt it to direct-metallic-bonding requirements.

"SET is proud to be leading the Minalogic project, PROCEED, in collaboration with STMicroelectronics, CEA-Leti, ALES and the CNRS-CEMES," said Gaël Schmidt, managing director of SET. "It provides cutting-edge equipment solutions enabling the CEA-Leti process integration. SET has a strong interest for this non-thermocompression metal-to-metal bonding, which may be a key to throughput improvement required for the adoption of 3D-IC integration."

####

About CEA-Leti
CEA is a French research and technology organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m˛ state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 190 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,700 patent families.

About SET
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder to the automated FC150 and FC300, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. SET is a wholly owned subsidiary of Replisaurus Technologies. Further information is available on www.set-sas.fr.

For more information, please click here

Contacts:
Press Contacts:
CEA-Leti
Thierry Bosc
+33 4 38 78 31 95


Agency
Amélie Ravier
+33 1 58 18 59 30


SET
Gilbert Lecarpentier
International Product Manager
+33 (0) 686 28 1224

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Conversion of Greenhouse Gases to Syngas in Presence of Nanocatalysts in Iran May 22nd, 2015

New Antibacterial Wound Dressing in Iran Can Display Replacement Time May 22nd, 2015

Haydale Named Lead Sponsor for Cambridge Graphene Festival May 22nd, 2015

Simulations predict flat liquid May 21st, 2015

Govt.-Legislation/Regulation/Funding/Policy

Nanotherapy effective in mice with multiple myeloma May 21st, 2015

Turn that defect upside down: Twin boundaries in lithium-ion batteries May 21st, 2015

INSIDDE: Uncovering the real history of art using a graphene scanner May 21st, 2015

SUNY Poly CNSE and NIOSH Launch Federal Nano Health and Safety Consortium: May 20th, 2015

MEMS

Janusz Bryzek Joins MEMS Industry Group to Lead New TSensors Division - New Division will Focus on Accelerating Development of Emerging Ultra-high Volume Sensors Supporting Abundance, mHealth and IoT May 14th, 2015

Phonons, arise! Small electric voltage alters conductivity in key materials April 22nd, 2015

Iranian Scientists Evaluate Dynamic Interaction between 2 Carbon Nanotubes April 14th, 2015

ASIC Development for MEMS Applications: A Platform Approach March 25th, 2015

Chip Technology

Nanometrics Announces Live Webcast of Upcoming Investor and Analyst Day May 20th, 2015

Sandia researchers first to measure thermoelectric behavior by 'Tinkertoy' materials May 20th, 2015

Defects can 'Hulk-up' materials: Berkeley lab study shows properly managed damage can boost material thermoelectric performances May 20th, 2015

GLOBALFOUNDRIES Offers New Low-Power 28nm Solution for High-Performance Mobile and IoT Applications: Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs May 20th, 2015

Nanoelectronics

Random nanowire configurations increase conductivity over heavily ordered configurations May 16th, 2015

Channeling valleytronics in graphene: Berkeley Lab researchers discover 1-D conducting channels in bilayer graphene May 6th, 2015

A better way to build DNA scaffolds: McGill researchers devise new technique to produce long, custom-designed DNA strands May 6th, 2015

Surface matters: Huge reduction of heat conduction observed in flat silicon channels April 23rd, 2015

Announcements

Conversion of Greenhouse Gases to Syngas in Presence of Nanocatalysts in Iran May 22nd, 2015

New Antibacterial Wound Dressing in Iran Can Display Replacement Time May 22nd, 2015

Haydale Named Lead Sponsor for Cambridge Graphene Festival May 22nd, 2015

INSIDDE: Uncovering the real history of art using a graphene scanner May 21st, 2015

Tools

Nanometrics Announces Live Webcast of Upcoming Investor and Analyst Day May 20th, 2015

Taking control of light emission: Researchers find a way of tuning light waves by pairing 2 exotic 2-D materials May 20th, 2015

DELMIC announces a workshop hosted by Phenom World on Integrated CLEM to be held on Wednesday June 24th at the Francis Crick Institute (Lincoln Inn Fields Laboratory). May 19th, 2015

DiATOME enables surface preparation for AFM and FIB May 19th, 2015

Photonics/Optics/Lasers

Samtec, Global Provider of Interconnect Systems, Joins IRT Nanoelec Silicon Photonics Program May 21st, 2015

Taking control of light emission: Researchers find a way of tuning light waves by pairing 2 exotic 2-D materials May 20th, 2015

Computing at the speed of light: Utah engineers take big step toward much faster computers May 18th, 2015

Wearables may get boost from boron-infused graphene: Rice U. researchers flex muscle of laser-written microsupercapacitors May 18th, 2015

Alliances/Partnerships/Distributorships

Samtec, Global Provider of Interconnect Systems, Joins IRT Nanoelec Silicon Photonics Program May 21st, 2015

SUNY Poly CNSE and NIOSH Launch Federal Nano Health and Safety Consortium: May 20th, 2015

Industrial Nanotech, Inc. Announces Official Launch of the Eagle Platinum Tile™ May 19th, 2015

DiATOME enables surface preparation for AFM and FIB May 19th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project