Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Dow Corning Joins the imec GaN Affiliation Program

GaN-on-Si wafer processed at imec with Au-free MOSHEMT flow
GaN-on-Si wafer processed at imec with Au-free MOSHEMT flow

Abstract:
Dow Corning has formalized an agreement to enter the imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies.

Dow Corning Joins the imec GaN Affiliation Program

Leuven, Belgium | Posted on January 20th, 2011

The program focuses on the development of the next generation GaN power devices and LEDs. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.

Due to the combination of superior electron mobility, higher breakdown voltage and good thermal conductivity properties, GaN/AIGaN heterostructures offer a high switching efficiency for the next generation power and RF devices compared to the current devices based on silicon (Si). A process for high quality GaN epi-layers on Si substrates is key in obtaining superior power & RF devices. Accurate control of the epi-growth process to master substrate bow, epi-layer defectivity and uniformity while maintaining high epi-reactor throughput are needed to reduce the overall technology cost. Imec has pioneered GaN epi-growth on sapphire, SiC and Si substrates from 2 to 6 inch substrate sizes and currently focuses on developing GaN epi-layers on 8 inch Si substrates. Leveraging the economics of scale and compatibility with high throughput and high capacity 8 inch Si wafer based process technology will further reduce the cost of GaN devices and LEDs.

As a leading producer of SiC wafers and epitaxy, Dow Corning is leveraging its capability in electronic materials technology and quality supply to bring next generation materials technology to global device manufacturers. We work closely with our customers to develop innovative solutions throughout the value chain. "By joining the imec GaN Affiliation Program, Dow Corning will rapidly expand its substrate product portfolio with high quality and affordable GaN epi-wafers for power, RF and LED markets" says Tom Zoes, Global Director, Dow Corning Compound Semiconductor Solutions.

Dow Corning is also the majority shareholder in the Hemlock Semiconductor Group joint ventures which is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules.

"We are delighted to welcome Dow Corning as a partner in our GaN Affiliation Program. Teaming up with imec's epitaxy and device researchers within our multi-partner environment creates a strong momentum to bring this technology to market," says Rudi Cartuyvels, Vice President Process Technology at imec.

####

About imec
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of more than 1,750 people includes over 550 industrial residents and guest researchers. In 2009, imec's revenue (P&L) was 275 million euro. Further information on imec can be found at www.imec.be.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.).

About Dow Corning
Dow Corning provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and XIAMETER® brands. Formed in 1943 to explore and develop the potential of silicones, Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative.

About Hemlock Semiconductor Group
The Hemlock Semiconductor Group (hscpoly.com) – Hemlock Semiconductor – is comprised of two joint ventures: Hemlock Semiconductor Corporation and Hemlock Semiconductor, L.L.C. The companies are joint ventures of Dow Corning Corporation, Shin-Etsu Handotai and Mitsubishi Materials Corporation. Hemlock Semiconductor is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules. Hemlock Semiconductor began its Michigan operations in 1961 and broke ground at its Tennessee location in 2009.

HSC and HEMLOCK SEMICONDUCTOR are trademarks of Dow Corning Corporation.

For more information, please click here

Contacts:
imec:
Katrien Marent
Director of External Communications
T: +32 16 28 18 80
M: +32 474 30 28 66


Barbara Kalkis
Maestro Marketing & PR (for imec)
T: +1 408 996 9975


Dow Corning:
Melanie Oliver
Marketing Communications
T: (989) 496-6477

Copyright © imec

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Making graphene work for real-world devices: Fundamental research in phonon scattering helps researchers design graphene materials for applications April 24th, 2014

Return on investment for kit and promotion materials April 24th, 2014

Protecting olive oil from counterfeiters April 24th, 2014

NanoSafe, Inc. announces the addition of the Labconco Protector® Glove Box to its NanoSafe Tested™ registry April 23rd, 2014

Chip Technology

Making graphene work for real-world devices: Fundamental research in phonon scattering helps researchers design graphene materials for applications April 24th, 2014

Return on investment for kit and promotion materials April 24th, 2014

Harris & Harris Group Notes the Receipt of Proceeds From the Sale of Molecular Imprints' Semiconductor Business to Canon April 22nd, 2014

Progress made in developing nanoscale electronics: New research directs charges through single molecules April 21st, 2014

Nanoelectronics

Progress made in developing nanoscale electronics: New research directs charges through single molecules April 21st, 2014

Better solar cells, better LED light and vast optical possibilities April 12th, 2014

Catching the (Invisible) Wave: UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications April 11th, 2014

Nanotech Business Review 2013-2014 April 9th, 2014

Announcements

Making graphene work for real-world devices: Fundamental research in phonon scattering helps researchers design graphene materials for applications April 24th, 2014

Return on investment for kit and promotion materials April 24th, 2014

Protecting olive oil from counterfeiters April 24th, 2014

High-Performance, Low-Cost Ultracapacitors Built with Graphene and Carbon Nanotubes: Future devices based on technology could bridge gap between batteries and conventional capacitors in portable electronics and hybrid electric vehicles April 23rd, 2014

Alliances/Partnerships/Distributorships

Economics = MC2 -- A portrait of the modern physics startup: Successful companies founded by physicists often break the Silicon Valley model, according to new American Institute of Physics report April 23rd, 2014

Global leader in solar cell manufacturing eyes New York for major expansion outside of Japan: CNSE and Solar Frontier Explore $700 Million Investment, Job Creation in New York State April 22nd, 2014

ASM International Repositions Brand and Introduces New Logo; Looks to Future of Materials Science Innovation: New logo celebrates organization’s history and provides fresh elements for future growth April 21st, 2014

Virus structure inspires novel understanding of onion-like carbon nanoparticles April 10th, 2014

Research partnerships

University of Waterloo Visits China to Strengthen Bonds With Research Partners April 21st, 2014

Novel stapled peptide nanoparticle combination prevents RSV infection, study finds April 17th, 2014

Scientists Capture Ultrafast Snapshots of Light-Driven Superconductivity: X-rays reveal how rapidly vanishing 'charge stripes' may be behind laser-induced high-temperature superconductivity April 16th, 2014

Scalable CVD process for making 2-D molybdenum diselenide: Rice, NTU scientists unveil CVD production for coveted 2-D semiconductor April 8th, 2014

NanoNews-Digest
The latest news from around the world, FREE







  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE