Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Dow Corning Joins the imec GaN Affiliation Program

GaN-on-Si wafer processed at imec with Au-free MOSHEMT flow
GaN-on-Si wafer processed at imec with Au-free MOSHEMT flow

Abstract:
Dow Corning has formalized an agreement to enter the imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies.

Dow Corning Joins the imec GaN Affiliation Program

Leuven, Belgium | Posted on January 20th, 2011

The program focuses on the development of the next generation GaN power devices and LEDs. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.

Due to the combination of superior electron mobility, higher breakdown voltage and good thermal conductivity properties, GaN/AIGaN heterostructures offer a high switching efficiency for the next generation power and RF devices compared to the current devices based on silicon (Si). A process for high quality GaN epi-layers on Si substrates is key in obtaining superior power & RF devices. Accurate control of the epi-growth process to master substrate bow, epi-layer defectivity and uniformity while maintaining high epi-reactor throughput are needed to reduce the overall technology cost. Imec has pioneered GaN epi-growth on sapphire, SiC and Si substrates from 2 to 6 inch substrate sizes and currently focuses on developing GaN epi-layers on 8 inch Si substrates. Leveraging the economics of scale and compatibility with high throughput and high capacity 8 inch Si wafer based process technology will further reduce the cost of GaN devices and LEDs.

As a leading producer of SiC wafers and epitaxy, Dow Corning is leveraging its capability in electronic materials technology and quality supply to bring next generation materials technology to global device manufacturers. We work closely with our customers to develop innovative solutions throughout the value chain. "By joining the imec GaN Affiliation Program, Dow Corning will rapidly expand its substrate product portfolio with high quality and affordable GaN epi-wafers for power, RF and LED markets" says Tom Zoes, Global Director, Dow Corning Compound Semiconductor Solutions.

Dow Corning is also the majority shareholder in the Hemlock Semiconductor Group joint ventures which is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules.

"We are delighted to welcome Dow Corning as a partner in our GaN Affiliation Program. Teaming up with imec's epitaxy and device researchers within our multi-partner environment creates a strong momentum to bring this technology to market," says Rudi Cartuyvels, Vice President Process Technology at imec.

####

About imec
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of more than 1,750 people includes over 550 industrial residents and guest researchers. In 2009, imec's revenue (P&L) was 275 million euro. Further information on imec can be found at www.imec.be.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.).

About Dow Corning
Dow Corning provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and XIAMETER® brands. Formed in 1943 to explore and develop the potential of silicones, Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative.

About Hemlock Semiconductor Group
The Hemlock Semiconductor Group (hscpoly.com) – Hemlock Semiconductor – is comprised of two joint ventures: Hemlock Semiconductor Corporation and Hemlock Semiconductor, L.L.C. The companies are joint ventures of Dow Corning Corporation, Shin-Etsu Handotai and Mitsubishi Materials Corporation. Hemlock Semiconductor is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules. Hemlock Semiconductor began its Michigan operations in 1961 and broke ground at its Tennessee location in 2009.

HSC and HEMLOCK SEMICONDUCTOR are trademarks of Dow Corning Corporation.

For more information, please click here

Contacts:
imec:
Katrien Marent
Director of External Communications
T: +32 16 28 18 80
M: +32 474 30 28 66


Barbara Kalkis
Maestro Marketing & PR (for imec)
T: +1 408 996 9975


Dow Corning:
Melanie Oliver
Marketing Communications
T: (989) 496-6477

Copyright © imec

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Innovation in Nanotechnology is Focus of Symposium: Annual event brings international experts to Northwestern Oct. 6 September 29th, 2016

Cambrios at CEATEC - Japan 2016 September 29th, 2016

Picosun patents ALD nanolaminate to prevent electronics from overheating September 28th, 2016

Leti and Taiwanese Tech Organizations Sponsoring Workshop in Taipei on MEMS, IoT, Smart Lighting Applications, System Reliability & Security September 28th, 2016

Chip Technology

Picosun patents ALD nanolaminate to prevent electronics from overheating September 28th, 2016

Researchers at the Catalan Institute of Nanoscience and Nanotechnology show that bending semiconductors generates electricity September 26th, 2016

Mexican scientist in the Netherlands seeks to achieve data transmission ... speed of light September 20th, 2016

Towards Stable Propagation of Light in Nano-Photonic Fibers September 20th, 2016

Nanoelectronics

Mexican scientist in the Netherlands seeks to achieve data transmission ... speed of light September 20th, 2016

GLOBALFOUNDRIES to Deliver Industry’s Leading-Performance Offering of 7nm FinFET Technology: Company extends its leading-edge roadmap for products demanding the ultimate processing power September 15th, 2016

Semiconducting inorganic double helix: New flexible semiconductor for electronics, solar technology and photo catalysis September 15th, 2016

A versatile method to pattern functionalized nanowires: A team of researchers from Hokkaido University has developed a versatile method to pattern the structure of 'nanowires,' providing a new tool for the development of novel nanodevices September 9th, 2016

Announcements

Innovation in Nanotechnology is Focus of Symposium: Annual event brings international experts to Northwestern Oct. 6 September 29th, 2016

Cambrios at CEATEC - Japan 2016 September 29th, 2016

Picosun patents ALD nanolaminate to prevent electronics from overheating September 28th, 2016

Leti and Taiwanese Tech Organizations Sponsoring Workshop in Taipei on MEMS, IoT, Smart Lighting Applications, System Reliability & Security September 28th, 2016

Alliances/Trade associations/Partnerships/Distributorships

PHENOMEN is a FET-Open Research Project aiming to lay the foundations a new information technology September 19th, 2016

SEMI and MSIG Join Together in Strategic Association Partnership: MEMS & Sensors Industry Group Brings New MEMS and Sensors Community to SEMI to Increase Combined Member Value September 15th, 2016

Leti and Oberthur Technologies Partner to Explore New Solutions in Fast-growing Digital Era September 12th, 2016

Synopsys Joins GLOBALFOUNDRIES’ FDXcelerator Partner Program to Enable Innovative Designs Using the FD-SOI Process: Program Gives Synopsys Access to GLOBALFOUNDRIES’ FDX Portfolio and Provides Customers with Tools that Support the Differentiated Features of FD-SOI September 8th, 2016

Research partnerships

Crystalline Fault Lines Provide Pathway for Solar Cell Current: New tomographic AFM imaging technique reveals that microstructural defects, generally thought to be detrimental, actually improve conductivity in cadmium telluride solar cells September 26th, 2016

Tattoo therapy could ease chronic disease: Rice-made nanoparticles tested at Baylor College of Medicine may help control autoimmune diseases September 23rd, 2016

Graphene nanoribbons show promise for healing spinal injuries: Rice University scientists develop Texas-PEG to help knit severed, damaged spinal cords September 19th, 2016

NIST Patents Single-Photon Detector for Potential Encryption and Sensing Apps September 16th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic