Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Dow Corning Joins the imec GaN Affiliation Program

GaN-on-Si wafer processed at imec with Au-free MOSHEMT flow
GaN-on-Si wafer processed at imec with Au-free MOSHEMT flow

Abstract:
Dow Corning has formalized an agreement to enter the imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies.

Dow Corning Joins the imec GaN Affiliation Program

Leuven, Belgium | Posted on January 20th, 2011

The program focuses on the development of the next generation GaN power devices and LEDs. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.

Due to the combination of superior electron mobility, higher breakdown voltage and good thermal conductivity properties, GaN/AIGaN heterostructures offer a high switching efficiency for the next generation power and RF devices compared to the current devices based on silicon (Si). A process for high quality GaN epi-layers on Si substrates is key in obtaining superior power & RF devices. Accurate control of the epi-growth process to master substrate bow, epi-layer defectivity and uniformity while maintaining high epi-reactor throughput are needed to reduce the overall technology cost. Imec has pioneered GaN epi-growth on sapphire, SiC and Si substrates from 2 to 6 inch substrate sizes and currently focuses on developing GaN epi-layers on 8 inch Si substrates. Leveraging the economics of scale and compatibility with high throughput and high capacity 8 inch Si wafer based process technology will further reduce the cost of GaN devices and LEDs.

As a leading producer of SiC wafers and epitaxy, Dow Corning is leveraging its capability in electronic materials technology and quality supply to bring next generation materials technology to global device manufacturers. We work closely with our customers to develop innovative solutions throughout the value chain. "By joining the imec GaN Affiliation Program, Dow Corning will rapidly expand its substrate product portfolio with high quality and affordable GaN epi-wafers for power, RF and LED markets" says Tom Zoes, Global Director, Dow Corning Compound Semiconductor Solutions.

Dow Corning is also the majority shareholder in the Hemlock Semiconductor Group joint ventures which is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules.

"We are delighted to welcome Dow Corning as a partner in our GaN Affiliation Program. Teaming up with imec's epitaxy and device researchers within our multi-partner environment creates a strong momentum to bring this technology to market," says Rudi Cartuyvels, Vice President Process Technology at imec.

####

About imec
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of more than 1,750 people includes over 550 industrial residents and guest researchers. In 2009, imec's revenue (P&L) was 275 million euro. Further information on imec can be found at www.imec.be.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.).

About Dow Corning
Dow Corning provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and XIAMETER® brands. Formed in 1943 to explore and develop the potential of silicones, Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative.

About Hemlock Semiconductor Group
The Hemlock Semiconductor Group (hscpoly.com) – Hemlock Semiconductor – is comprised of two joint ventures: Hemlock Semiconductor Corporation and Hemlock Semiconductor, L.L.C. The companies are joint ventures of Dow Corning Corporation, Shin-Etsu Handotai and Mitsubishi Materials Corporation. Hemlock Semiconductor is a leading provider of polycrystalline silicon and other silicon-based products used in the manufacturing of semiconductor devices and solar cells and modules. Hemlock Semiconductor began its Michigan operations in 1961 and broke ground at its Tennessee location in 2009.

HSC and HEMLOCK SEMICONDUCTOR are trademarks of Dow Corning Corporation.

For more information, please click here

Contacts:
imec:
Katrien Marent
Director of External Communications
T: +32 16 28 18 80
M: +32 474 30 28 66


Barbara Kalkis
Maestro Marketing & PR (for imec)
T: +1 408 996 9975


Dow Corning:
Melanie Oliver
Marketing Communications
T: (989) 496-6477

Copyright © imec

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Australian startup creates world’s first 100% cotton hydrophobic T-Shirts November 26th, 2014

The mysterious 'action at a distance' between liquid containers November 26th, 2014

'Giant' charge density disturbances discovered in nanomaterials: Juelich researchers amplify Friedel oscillations in thin metallic films November 26th, 2014

Lawrence Livermore researchers develop efficient method to produce nanoporous metals November 25th, 2014

Chip Technology

'Giant' charge density disturbances discovered in nanomaterials: Juelich researchers amplify Friedel oscillations in thin metallic films November 26th, 2014

Nanometrics Announces Upcoming Investor Events November 19th, 2014

A novel method for identifying the body’s ‘noisiest’ networks November 19th, 2014

Researchers create & control spin waves, lifting prospects for enhanced info processing November 17th, 2014

Nanoelectronics

'Giant' charge density disturbances discovered in nanomaterials: Juelich researchers amplify Friedel oscillations in thin metallic films November 26th, 2014

Leti Will Present 17 Papers at 2014 IEDM; the Highest-ever Total Includes Four Invited Papers: Institute also Will Present its Latest Results in Key Technologies and Its Roadmap for Silicon Nano-technologies at Workshop November 13th, 2014

Breakthrough in molecular electronics paves the way for DNA-based computer circuits in the future: DNA-based programmable circuits could be more sophisticated, cheaper and simpler to make October 27th, 2014

NIST offers electronics industry 2 ways to snoop on self-organizing molecules October 22nd, 2014

Announcements

Australian startup creates world’s first 100% cotton hydrophobic T-Shirts November 26th, 2014

The mysterious 'action at a distance' between liquid containers November 26th, 2014

'Giant' charge density disturbances discovered in nanomaterials: Juelich researchers amplify Friedel oscillations in thin metallic films November 26th, 2014

Research yields material made of single-atom layers that snap together like Legos November 25th, 2014

Alliances/Partnerships/Distributorships

New research project supports internationalisation in nano-research: Launch of new “Baltic Sea Network” November 22nd, 2014

UO-industry collaboration points to improved nanomaterials: University of Oregon microscope puts spotlight on the surface structure of quantum dots for designing new solar devices November 20th, 2014

A novel method for identifying the body’s ‘noisiest’ networks November 19th, 2014

Field-emission plug-and-play solution for microwave electron guns: To simplify the electron emission mechanism involved in microwave electron guns, a team of researchers has created and demonstrated a field-emission plug-and-play solution based on ultrananocrystalline diamond November 18th, 2014

Research partnerships

The mysterious 'action at a distance' between liquid containers November 26th, 2014

Lawrence Livermore researchers develop efficient method to produce nanoporous metals November 25th, 2014

Vegetable oil ingredient key to destroying gastric disease bacteria: In mice, therapeutic nanoparticles dampen H. pylori bacteria and inflammation that lead to ulcers and gastric cancer November 25th, 2014

Characterization of X-ray flashes open new perspectives in X-ray science: Ultra-short X-ray pulses explore the nano world November 24th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More












ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE