Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Atrenta and CEA-Leti Sign a Multi-Year Collaboration Agreement

Abstract:
Focus will be advanced power reduction and 3D design

Atrenta and CEA-Leti Sign a Multi-Year Collaboration Agreement

Grenoble, France | Posted on October 27th, 2010

Atrenta Inc., the leading provider of Early Design Closure® solutions to radically improve design efficiency throughout the IC design flow, announced today the signing of a multi-year collaboration agreement with CEA-Leti, the Electronics and Information Technology Laboratory of the French Atomic Energy Commission. The joint development work defined in the collaboration agreement will take place at Atrenta's R&D center in Grenoble that was recently announced by Atrenta France SAS.

"3D design and advanced power reduction represent two areas of significant interest for the microelectronics community that CEA-Leti serves," said Dr. Ahmed Jerraya, head of design programs and research director at CEA-Leti. "We look forward to collaborating with Atrenta France SAS to advance the state of the art in these areas."

The work defined by the collaboration agreement will focus on two primary development areas. First, techniques to analyze, predict and reduce the power consumption of advanced microelectronic devices at the early stages of design, including the architectural and register transfer language (RTL) levels. And second, the analysis and partitioning of 3D stacked die devices, also at the architectural and RTL levels. Stacked die devices are now being made possible in part by through silicon via (TSV) semiconductor process technology advances.

"Atrenta has a long history of collaborating with our customers in the Grenoble area," said Dr. Ajoy Bose, chairman, president and CEO of Atrenta. "We look forward to working with those customers alongside the substantial technical resources of CEA-Leti. This organization provides an excellent environment for advanced research."

Atrenta, the Atrenta logo and Early Design Closure are registered trademarks of Atrenta Inc. All others are the property of their respective holders.

This press release contains forward-looking statements. Atrenta disclaims any obligation and does not undertake to update or revise the forward-looking statements in this press release.

####

About CEA-Leti
CEA is a French research and technology public organisation, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000-m˛ state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,500 patent families.

About Atrenta
Atrenta is the leading provider of Early Design Closure® solutions to radically improve design efficiency throughout the IC design flow. Customers benefit from Atrenta tools and methodologies to capture design intent, explore implementation alternatives, validate RTL and optimize designs early, before expensive and time-consuming detailed implementation. With over 150 customers, including the world’s top 10 semiconductor companies, Atrenta provides the most comprehensive solution in the industry for Early Design Closure. For more information, visit www.atrenta.com. Atrenta, Right from the Start!

For more information, please click here

Contacts:
CEA-Leti
Thierry Bosc
+33 4 38 78 31 95


Agency
Amelie Ravier
+33 (0)1 58 18 59 30


Atrenta Corporate:
Charu Puri, Corporate Marketing
Atrenta Inc.

+1-408-467-4254

Atrenta PR Agency:
Ed Lee
Lee PR

+1-650-363-0142

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Measuring the Smallest Magnets July 28th, 2014

WITec to host the 11th Confocal Raman Imaging Symposium from September 29th - October 1st in Ulm, Germany July 28th, 2014

FEI adds Phase Plate Technology and Titan Halo TEM to its Structural Biology Product Portfolio: New solutions provide the high-quality imaging and contrast necessary to analyze the 3D structure of molecules and molecular complexes July 28th, 2014

Production of Toxic Gas Sensor Based on Nanorods July 28th, 2014

MEMS

Carbyne morphs when stretched: Rice University calculations show carbon-atom chain would go metal to semiconductor July 21st, 2014

Leti to Present Technological Platforms Targeting Industry’s Needs for the Future at Semicon West Workshop: Presentation at STS Session to Focus on Leti Advanced Lithography Programs for 1x Nodes and on Silicon Photonics at TechXPot June 25th, 2014

Mirrorcle Technologies Opens New Company Headquarters May 27th, 2014

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs May 27th, 2014

Chip Technology

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

Nanoelectronics

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

3-D nanostructure could benefit nanoelectronics, gas storage: Rice U. researchers predict functional advantages of 3-D boron nitride July 15th, 2014

IBM Announces $3 Billion Research Initiative to Tackle Chip Grand Challenges for Cloud and Big Data Systems: Scientists and engineers to push limits of silicon technology to 7 nanometers and below and create post-silicon future July 10th, 2014

Announcements

Measuring the Smallest Magnets July 28th, 2014

WITec to host the 11th Confocal Raman Imaging Symposium from September 29th - October 1st in Ulm, Germany July 28th, 2014

FEI adds Phase Plate Technology and Titan Halo TEM to its Structural Biology Product Portfolio: New solutions provide the high-quality imaging and contrast necessary to analyze the 3D structure of molecules and molecular complexes July 28th, 2014

Production of Toxic Gas Sensor Based on Nanorods July 28th, 2014

Alliances/Partnerships/Distributorships

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

Organometallics welcomes new editor-in-chief: Paul Chirik, Ph.D. July 22nd, 2014

Haydale and Goodfellow Announce Major Distribution Agreement for Functionalised Graphene Materials July 21st, 2014

SentiMag® Now Available in Australia and New Zealand July 21st, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE