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Home > Press > Nanoplas Extends Line of Dry Processing Systems With Tool for 200mm MEMS and 3D TSV Packaging

Abstract:
DSB 9000A Offers Component Manufacturers High Throughput, Lower Cost of Ownership and Flexibility of Process Choice

Nanoplas Extends Line of Dry Processing Systems With Tool for 200mm MEMS and 3D TSV Packaging

Orsay, France | Posted on October 26th, 2010

Nanoplas, a fast-growing global supplier of HDRF® plasma processing equipment for MEMS, 3D through-silicon vias (TSVs), IC packaging and III-V compounds, today introduced a fully automatic dry-processing batch system for high-volume 200mm production.

The DSB 9000A is based on Nanoplas's High Density Radical Flux (HDRF) technology and performs, in one tool, key production steps in microelectronic manufacturing, including:

• Removal of Bosch-process polymers, residues and photoresist from 80-250° C

• Isotropic etching of organic sacrificial layers, and

• Pre-wafer bonding activation

"The DSB 9000A, the newest tool in our growing line of plasma processing equipment, outperforms conventional radio-frequency plasma and microwave systems, while greatly reducing the risk of surface damage," said Gilles Baujon, CEO of Nanoplas. "This flexible, high-throughput, 200mm system offers MEMS manufacturers damage free dry processing, while eliminating costly steps, resulting in lower cost of ownership."

With 100 percent gas disassociation, the DSB 9000A ICP source produces free-radical concentration levels of up to 1,000 times greater than conventional plasma sources, thus providing enhanced process performance, including higher cleaning performance for high aspect ratio structures. The system's proprietary technology eliminates the charging effects and UV radiation normally associated with conventional plasma, allowing stiction-free processing and low-temperature operation.

HDRF gives process engineers outstanding flexibility, offering three distinct modes of operation covering a wide range of processes, from ultra-sensitive surface cleaning to removal of non-reactive residues. Typical throughput for photoresist stripping is 60-70 WPH, and greater than 100 WPH, per process module, for post-Bosch cleaning and surface activation.

####

About Nanoplas
Nanoplas is an innovator of specialized production solutions that deliver low-cost, green alternatives for treating wafer surfaces in next-generation devices, advanced MEMS, 3D TSVs, advanced packaging, power ICs, optoelectronic components and III-V compounds. The company’s High Density Radical Flux (HDRF®) plasma-processing technology delivers sophisticated cleaning techniques for removing Bosch polymers, resistant residues, and photoresist at low temperatures, while providing exceptional process quality, high yields and low cost of ownership. The company, which won a Best Process award in 2008 from EuroAsia Semiconductor, is based in Orsay, France. Its wholly owned subsidiary, Nanoplas North America Inc., operates a lab in Dallas, TX, and is headquartered in San Francisco, CA. Visit www.nanoplas.eu for more information.

For more information, please click here

Contacts:
Jana Yuen
Account Coordinator

loomis::group
www.loomisgroup.com
phone +33 (0)1 58 18 59 30

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