Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > EV Group's GEMINI® Wafer Bonder Selected by MEMS Pioneer

Abstract:
Order from Sensonor Enables EVG to Leverage Decades-long Expertise in Wafer Bonding to Support Emerging, High-growth MEMS Market

EV Group's GEMINI® Wafer Bonder Selected by MEMS Pioneer

St. Florian, FL | Posted on October 18th, 2010

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its GEMINI® fully automated wafer bonding system from Sensonor Technologies AS--a pioneer in the manufacture of MEMS sensors. The GEMINI system will be installed at Sensonor's wafer fab in Horten, Norway, where it will be used in the production of microbolometers--sensors used for thermal imaging.

According to market research firm, Yole Developpement, the microbolometer market is projected to grow in revenue from $220 million in 2010 to $380 million in 2015--a compound annual growth rate (CAGR) of 11.4 percent. This growth is being fueled by demand for a variety of thermal imaging applications, such as thermal cameras for pedestrian protection systems in automobiles, night vision systems for military and security use, imaging systems to improve building construction, and process monitoring systems for a number of commercial and industrial applications. To achieve the unit cost reductions required to meet this rising demand, MEMS manufacturers need advanced process equipment and expertise that will enable them to produce microbolometers at high throughput and high yield. EVG's fully automated GEMINI wafer bonder provides an integral component in the manufacturing process to enable cost-effective production of microbolometers.

"As a leading manufacturer of MEMS sensors, it is critical that our suppliers have extensive MEMS process know-how and solutions that can support our latest product development and manufacturing efforts. This is particularly important for wafer bonding, which is an integral part of our advanced MEMS manufacturing process," stated Gjermund Kittilsland, senior manager, technology development, Sensonor. "As with the pioneering days, we've again leveraged EVG's leading-edge wafer bonding solutions and appreciate EVG's continued process support and expertise in high-vacuum bonding technology to help us in becoming a world-class supplier in thermal imagers as well."

EVG's GEMINI platform is a field-proven, production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D IC integration, advanced packaging and compound semiconductor applications. The system is configured for high-vacuum low-temperature fusion bonding and high-vacuum metal bonding, which is critical for bolometer/thermal imaging device production. Unmatched heating, cooling and vacuum performance—including highly uniform heat distribution across the wafer—provides the high throughput and high bond yields needed to support current and future MEMS device manufacturing applications.

"EVG and Sensonor--two MEMS pioneers--have had a long history of working together to enable new technologies and applications. We're pleased to have the opportunity to work with them again in helping them to expand into the microbolometer market," stated Paul Lindner, EVG's executive technology director. "Microbolometer manufacturing is an exciting new market for EVG. Moreover, it provides a unique opportunity to extend our leadership in the MEMS arena with our enabling, production-worthy wafer bonding solutions."

The GEMINI's modular design offers customers a highly flexible and extendible platform that allows them to incorporate pre-processing options such as cleaning and plasma activation modules, as well as additional bond chambers to augment throughput. Additionally, this fully automated wafer bonding system integrates EVG's SmartView®NT aligner, which yields precision alignment accuracy, as well as wafer handling expertise into one wafer bonding platform. EVG has an installed base of more than 150 automated wafer bonding systems in the field.

EVG will be exhibiting at SEMICON Europa 2010, which is being held October 19-21 at the Messe Dresden in Dresden, Germany. Editors and analysts interested in learning more about the company, its latest-generation wafer bonding solutions and other recent developments are invited to visit EVG's booth #1568 (Hall 1).

####

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

About Sensonor Technologies AS
Sensonor is a global leader in high precision MEMS technology; designing and manufacturing advanced, integrated gyro and pressure sensors for harsh environments. Based on a continuous MEMS activity since 1965, Sensonor pioneered the introduction of MEMS accelerometers and gyros to the automotive market and also became the leading supplier of tire pressure sensors. Sensonor Technologies is now developing un-cooled infrared sensors (FPA) for thermal imaging cameras. More information is available at www.sensonor.com

For more information, please click here

Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group .
Tel: +43 7712 5311 0


Brandy Lee
Account Director
MCA, Inc
Tel: +1.650.968.8900, ext. 129

Copyright © EV Group

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Atomic imperfections move quantum communication network closer to reality June 25th, 2017

Research accelerates quest for quicker, longer-lasting electronics: UC Riverside-led research makes topological insulators magnetic well above room temperatures June 25th, 2017

U.S. Air Force Research Lab Taps IBM to Build Brain-Inspired AI Supercomputing System: Equal to 64 million neurons, new neurosynaptic supercomputing system will power complex AI tasks at unprecedented speed and energy efficiency June 23rd, 2017

Rice U. chemists create 3-D printed graphene foam June 22nd, 2017

MEMS

Smart multi-layered magnetic material acts as an electric switch: New study reveals characteristic of islands of magnetic metals between vacuum gaps, displaying tunnelling electric current March 1st, 2017

Engineers shrink microscope to dime-sized device February 17th, 2017

Leti Coordinating Project to Adapt Obstacle-Detection Technology Used in Autonomous Cars for Portable and Wearable Systems: INSPEX to Combine Knowhow of Nine European Organizations to Create Portable and Wearable Spatial-Exploration Systems February 2nd, 2017

Manufacturing platform makes intricate biocompatible micromachines January 7th, 2017

Announcements

Atomic imperfections move quantum communication network closer to reality June 25th, 2017

Research accelerates quest for quicker, longer-lasting electronics: UC Riverside-led research makes topological insulators magnetic well above room temperatures June 25th, 2017

U.S. Air Force Research Lab Taps IBM to Build Brain-Inspired AI Supercomputing System: Equal to 64 million neurons, new neurosynaptic supercomputing system will power complex AI tasks at unprecedented speed and energy efficiency June 23rd, 2017

Rice U. chemists create 3-D printed graphene foam June 22nd, 2017

Tools

Researchers developed nanoparticle based contrast agent for dual modal imaging of cancer June 21st, 2017

Oxford Instruments congratulates Lancaster University for inaugurating the IsoLab, built for studying quantum systems June 20th, 2017

Changing the color of laser light on the femtosecond time scale: How BiCoO3 achieves second harmonic generation June 14th, 2017

Leti Announces Two New Tools for Improving Transportation Comfort, Safety and Efficiency: Wearable Device Measures Stress Responses for Travelers, Pilots and Truck Drivers, While Smartphone App Provides Transit Agencies Broad Data on Transport Modes June 13th, 2017

New-Contracts/Sales/Customers

Park Systems Introduces Park NX12 for Unsurpassed Affordable High Resolution NanoScale Imaging Required for Advanced Analytical Chemistry, Materials Research, and Multi-User Facility June 5th, 2017

UnitySC Announces Wafer Thinning Inspection System; Win from Power Semiconductor IDM for Automotive: Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications May 11th, 2017

JPK selects compact tensile stage from Deben for their NanoWizard® AFM platform to broaden capabilities for materials characterisation February 22nd, 2017

Cetim Facility Receives Bruker Contour CMM Dimensional Analysis System: New Optical Coordinate Measurement Technology Enables High-Precision 3D Scanning November 16th, 2016

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project