Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > EV Group's GEMINI® Wafer Bonder Selected by MEMS Pioneer

Abstract:
Order from Sensonor Enables EVG to Leverage Decades-long Expertise in Wafer Bonding to Support Emerging, High-growth MEMS Market

EV Group's GEMINI® Wafer Bonder Selected by MEMS Pioneer

St. Florian, FL | Posted on October 18th, 2010

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its GEMINI® fully automated wafer bonding system from Sensonor Technologies AS--a pioneer in the manufacture of MEMS sensors. The GEMINI system will be installed at Sensonor's wafer fab in Horten, Norway, where it will be used in the production of microbolometers--sensors used for thermal imaging.

According to market research firm, Yole Developpement, the microbolometer market is projected to grow in revenue from $220 million in 2010 to $380 million in 2015--a compound annual growth rate (CAGR) of 11.4 percent. This growth is being fueled by demand for a variety of thermal imaging applications, such as thermal cameras for pedestrian protection systems in automobiles, night vision systems for military and security use, imaging systems to improve building construction, and process monitoring systems for a number of commercial and industrial applications. To achieve the unit cost reductions required to meet this rising demand, MEMS manufacturers need advanced process equipment and expertise that will enable them to produce microbolometers at high throughput and high yield. EVG's fully automated GEMINI wafer bonder provides an integral component in the manufacturing process to enable cost-effective production of microbolometers.

"As a leading manufacturer of MEMS sensors, it is critical that our suppliers have extensive MEMS process know-how and solutions that can support our latest product development and manufacturing efforts. This is particularly important for wafer bonding, which is an integral part of our advanced MEMS manufacturing process," stated Gjermund Kittilsland, senior manager, technology development, Sensonor. "As with the pioneering days, we've again leveraged EVG's leading-edge wafer bonding solutions and appreciate EVG's continued process support and expertise in high-vacuum bonding technology to help us in becoming a world-class supplier in thermal imagers as well."

EVG's GEMINI platform is a field-proven, production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D IC integration, advanced packaging and compound semiconductor applications. The system is configured for high-vacuum low-temperature fusion bonding and high-vacuum metal bonding, which is critical for bolometer/thermal imaging device production. Unmatched heating, cooling and vacuum performance—including highly uniform heat distribution across the wafer—provides the high throughput and high bond yields needed to support current and future MEMS device manufacturing applications.

"EVG and Sensonor--two MEMS pioneers--have had a long history of working together to enable new technologies and applications. We're pleased to have the opportunity to work with them again in helping them to expand into the microbolometer market," stated Paul Lindner, EVG's executive technology director. "Microbolometer manufacturing is an exciting new market for EVG. Moreover, it provides a unique opportunity to extend our leadership in the MEMS arena with our enabling, production-worthy wafer bonding solutions."

The GEMINI's modular design offers customers a highly flexible and extendible platform that allows them to incorporate pre-processing options such as cleaning and plasma activation modules, as well as additional bond chambers to augment throughput. Additionally, this fully automated wafer bonding system integrates EVG's SmartView®NT aligner, which yields precision alignment accuracy, as well as wafer handling expertise into one wafer bonding platform. EVG has an installed base of more than 150 automated wafer bonding systems in the field.

EVG will be exhibiting at SEMICON Europa 2010, which is being held October 19-21 at the Messe Dresden in Dresden, Germany. Editors and analysts interested in learning more about the company, its latest-generation wafer bonding solutions and other recent developments are invited to visit EVG's booth #1568 (Hall 1).

####

About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

About Sensonor Technologies AS
Sensonor is a global leader in high precision MEMS technology; designing and manufacturing advanced, integrated gyro and pressure sensors for harsh environments. Based on a continuous MEMS activity since 1965, Sensonor pioneered the introduction of MEMS accelerometers and gyros to the automotive market and also became the leading supplier of tire pressure sensors. Sensonor Technologies is now developing un-cooled infrared sensors (FPA) for thermal imaging cameras. More information is available at www.sensonor.com

For more information, please click here

Contacts:
Clemens Schütte
Director, Marketing and Communications
EV Group .
Tel: +43 7712 5311 0


Brandy Lee
Account Director
MCA, Inc
Tel: +1.650.968.8900, ext. 129

Copyright © EV Group

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

In borophene, boundaries are no barrier: Rice U., Northwestern researchers make and test atom-thick boron's unique domains July 17th, 2018

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits July 16th, 2018

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication July 13th, 2018

UMBC researchers develop nanoparticles to reduce internal bleeding caused by blast trauma July 13th, 2018

MEMS

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication July 13th, 2018

Cleaning or Etching Items with Unique Geometries Requires Specialized Expertise June 27th, 2018

Executives Explore Key Megatrends and Innovations in MEMS, Sensors, Imaging Tech at SEMI-MSIG European Summits: Speakers to share developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018 in Grenoble, France June 19th, 2018

HTA to Present European Strategy for Competitive Micro- and Nanotechnologies & Smart Systems: Special Event in Brussels on April 24 Gathers Research Institutes’ CEOs, European Commissioners and Key European Industrials April 17th, 2018

Announcements

In borophene, boundaries are no barrier: Rice U., Northwestern researchers make and test atom-thick boron's unique domains July 17th, 2018

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits July 16th, 2018

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication July 13th, 2018

UMBC researchers develop nanoparticles to reduce internal bleeding caused by blast trauma July 13th, 2018

Tools

Oxford Instruments’ 22 Tesla superconducting magnet system commissioned at the UAM, making it the most intense magnetic field available outside a large international facility July 12th, 2018

Nanometrics to Announce Second Quarter Financial Results on July 31, 2018 July 12th, 2018

Nanometrics to Participate in the 10th Annual CEO Investor Summit 2018: Accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2018 in San Francisco June 28th, 2018

The Institute of Applied Physics at the University of Tsukuba near Tokyo in Japan uses Deben's ARM2 detector to better understand catalytic reaction mechanisms June 27th, 2018

New-Contracts/Sales/Customers

Barium ruthenate: A high-yield, easy-to-handle perovskite catalyst for the oxidation of sulfides July 13th, 2018

Oxford Instruments’ 22 Tesla superconducting magnet system commissioned at the UAM, making it the most intense magnetic field available outside a large international facility July 12th, 2018

The first PE blown films with nanotubes hit the Chinese market April 26th, 2018

Deep Space Industries to provide Comet satellite propulsion for BlackSky, LeoStella April 3rd, 2018

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project