Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > CEA-Leti to Highlight Developments in Lithography, FDSOI and 3D Integration at SEMICON Europa, Oct. 19-21 in Dresden

Abstract:
CEA-Leti will highlight its programs and recent developments in lithography, FDSOI and 3D design and integration at SEMICON Europa, Oct. 19-21 in Dresden, Germany.

Leti experts will be in Hall 4 - Booth 026.

CEA-Leti to Highlight Developments in Lithography, FDSOI and 3D Integration at SEMICON Europa, Oct. 19-21 in Dresden

Grenoble | Posted on October 13th, 2010

Lithography

Working with IBM, ST, Nikon, TSMC and other technology pioneers, CEA-Leti's Lithography Laboratory is developing production-oriented patterning for several generations of future semiconductor technology.

Lithography processes based on optical technology will likely not be effective beyond the 22nm node, and the most-discussed alternative, extreme ultraviolet, is still not ready for production after more than 15 years of development. Today, a cloud of uncertainty hangs over the semiconductor industry's ability to continue its historic progress to ever-smaller features.

Leti's Lithography Laboratory is addressing this challenge in several areas. The Imagine Program is cultivating maskless electron-beam lithographic approaches originally developed in Leti's ML2 maskless lithography program. Meanwhile, ongoing research into optical double-patterning techniques was applied to a spacer process for advanced logic chip production.

These efforts have placed Leti at the forefront of e-beam lithography, with one of the most advanced equipment sets in the world, including two shaped e-beam systems, two Gaussian-beam systems, and the alpha version of Mapper Lithography's multi-beam tool, which has the potential to bring huge boosts in productivity. The Lithography Laboratory also maintains a complete 193nm lithography capability, including data preparation and resist characterization.

FDSOI

Leti is focusing on the development of fully depleted silicon-on-insulator (FDSOI) technology, which potentially will enable fabrication of smaller, denser and faster integrated circuits.

FDSOI devices typically require a much thinner active silicon layer than standard complimentary metal-oxide semiconductor (CMOS) devices, while also enabling significantly reduced threshold voltage variability and enhanced speed/power tradeoff. These and other performance advantages suggest that FDSOI CMOS devices have the potential to be scaled down to the 10nm-technology node by tuning the buried-oxide and silicon-layer thicknesses.

Since pioneering SOI technology in the early 1990s, Leti has produced the most advanced research in FDSOI, assessing its key advantages for low-power, high-performance applications with several industrial partners.

Last year, Leti focused on developing 22nm FDSOI devices and models, while working locally with STMicroelectronics and the Soitec Group, as well as with IBM's semiconductor Joint Development Alliance in Albany, N.Y. In addition, Leti and CMP (Circuits Multi Projects®) launched an exploratory multi-project-wafer initiative based on FDSOI 20nm process, opening access to Leti's 300mm infrastructure to the design community.

3D

Leti is offering wafer-to-wafer 3D integration support for customers' prototype development.

Leti researchers have been developing 3D design and integration technologies for more than two decades. Today, more than 60 researchers across several laboratories are working on various ways to make electrical connections between integrated circuit layers and between vertically stacked computer chips.

Potential uses for 3D integration span the electronics spectrum, from 3D networks-on-a-chip to memory-on-logic stacking to silicon-board technologies that could eventually replace printed-circuit-board packaging. 3D-IC technology plays a key role in enabling cost-effective performance for the entire microelectronics industry.

Leti is developing technologies that enable even higher-density vertical interconnects and recently integrated high-density, fine-pitch TSVs into a 65nm technology process, with very encouraging preliminary results.

Leti also started new 300mm TSV production processes in 300mm clean room facilities through a major partnership with SPP Process Technology Systems (SPTS). Leti will inaugurate its 3D integration 300mm on Jan. 18, 2011.

####

For more information, please click here

Contacts:
Amélie Ravier
account executive


Loomis Group
www.loomisgroup.com
phone +33 (0)1 58 18 59 30

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Nanoparticles Increase Durability of Concrete Decorations in Cold Areas January 26th, 2015

Iranian Researchers Boost Solar Cells Efficiency Using Anti-Aggregates January 26th, 2015

Detection of Heavy Metals in Samples with Naked Eye January 26th, 2015

Engineering self-assembling amyloid fibers January 26th, 2015

Chip Technology

Electronic circuits with reconfigurable pathways closer to reality January 26th, 2015

The latest fashion: Graphene edges can be tailor-made: Rice University theory shows it should be possible to tune material's properties January 24th, 2015

New method to generate arbitrary optical pulses January 21st, 2015

New signal amplification process set to transform communications, imaging, computing: UC San Diego researchers discover a mechanism to amplify signals in optoelectronic systems that is far more efficient than standard processes January 21st, 2015

Nanoelectronics

Electronic circuits with reconfigurable pathways closer to reality January 26th, 2015

Rice-sized laser, powered one electron at a time, bodes well for quantum computing January 15th, 2015

Rapid journey through a crystal lattice: Researchers measure how fast electrons move through single atomic layers January 14th, 2015

A new step towards using graphene in electronic applications January 14th, 2015

Announcements

Nanoparticles Increase Durability of Concrete Decorations in Cold Areas January 26th, 2015

Iranian Researchers Boost Solar Cells Efficiency Using Anti-Aggregates January 26th, 2015

Detection of Heavy Metals in Samples with Naked Eye January 26th, 2015

Engineering self-assembling amyloid fibers January 26th, 2015

Events/Classes

Toyocolor to Launch New Carbon Nanotube Materials at nano tech 2015 January 24th, 2015

NANOPOSTER 2015 - 5th Virtual Nanotechnology Conference - call for abstracts January 24th, 2015

New conductive coatings for flexible touchscreens – presentation at nano tech 2015 in Japan January 22nd, 2015

Teijin to Participate in Nano Tech 2015 January 22nd, 2015

Printing/Lithography/Inkjet/Inks

Toyocolor to Launch New Carbon Nanotube Materials at nano tech 2015 January 24th, 2015

Teijin to Participate in Nano Tech 2015 January 22nd, 2015

A new step towards using graphene in electronic applications January 14th, 2015

Nanoshaping method points to future manufacturing technology December 11th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE