Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

android tablet pc

Home > Press > CEA-Leti to Highlight Developments in Lithography, FDSOI and 3D Integration at SEMICON Europa, Oct. 19-21 in Dresden

CEA-Leti will highlight its programs and recent developments in lithography, FDSOI and 3D design and integration at SEMICON Europa, Oct. 19-21 in Dresden, Germany.

Leti experts will be in Hall 4 - Booth 026.

CEA-Leti to Highlight Developments in Lithography, FDSOI and 3D Integration at SEMICON Europa, Oct. 19-21 in Dresden

Grenoble | Posted on October 13th, 2010


Working with IBM, ST, Nikon, TSMC and other technology pioneers, CEA-Leti's Lithography Laboratory is developing production-oriented patterning for several generations of future semiconductor technology.

Lithography processes based on optical technology will likely not be effective beyond the 22nm node, and the most-discussed alternative, extreme ultraviolet, is still not ready for production after more than 15 years of development. Today, a cloud of uncertainty hangs over the semiconductor industry's ability to continue its historic progress to ever-smaller features.

Leti's Lithography Laboratory is addressing this challenge in several areas. The Imagine Program is cultivating maskless electron-beam lithographic approaches originally developed in Leti's ML2 maskless lithography program. Meanwhile, ongoing research into optical double-patterning techniques was applied to a spacer process for advanced logic chip production.

These efforts have placed Leti at the forefront of e-beam lithography, with one of the most advanced equipment sets in the world, including two shaped e-beam systems, two Gaussian-beam systems, and the alpha version of Mapper Lithography's multi-beam tool, which has the potential to bring huge boosts in productivity. The Lithography Laboratory also maintains a complete 193nm lithography capability, including data preparation and resist characterization.


Leti is focusing on the development of fully depleted silicon-on-insulator (FDSOI) technology, which potentially will enable fabrication of smaller, denser and faster integrated circuits.

FDSOI devices typically require a much thinner active silicon layer than standard complimentary metal-oxide semiconductor (CMOS) devices, while also enabling significantly reduced threshold voltage variability and enhanced speed/power tradeoff. These and other performance advantages suggest that FDSOI CMOS devices have the potential to be scaled down to the 10nm-technology node by tuning the buried-oxide and silicon-layer thicknesses.

Since pioneering SOI technology in the early 1990s, Leti has produced the most advanced research in FDSOI, assessing its key advantages for low-power, high-performance applications with several industrial partners.

Last year, Leti focused on developing 22nm FDSOI devices and models, while working locally with STMicroelectronics and the Soitec Group, as well as with IBM's semiconductor Joint Development Alliance in Albany, N.Y. In addition, Leti and CMP (Circuits Multi Projects®) launched an exploratory multi-project-wafer initiative based on FDSOI 20nm process, opening access to Leti's 300mm infrastructure to the design community.


Leti is offering wafer-to-wafer 3D integration support for customers' prototype development.

Leti researchers have been developing 3D design and integration technologies for more than two decades. Today, more than 60 researchers across several laboratories are working on various ways to make electrical connections between integrated circuit layers and between vertically stacked computer chips.

Potential uses for 3D integration span the electronics spectrum, from 3D networks-on-a-chip to memory-on-logic stacking to silicon-board technologies that could eventually replace printed-circuit-board packaging. 3D-IC technology plays a key role in enabling cost-effective performance for the entire microelectronics industry.

Leti is developing technologies that enable even higher-density vertical interconnects and recently integrated high-density, fine-pitch TSVs into a 65nm technology process, with very encouraging preliminary results.

Leti also started new 300mm TSV production processes in 300mm clean room facilities through a major partnership with SPP Process Technology Systems (SPTS). Leti will inaugurate its 3D integration 300mm on Jan. 18, 2011.


For more information, please click here

Amélie Ravier
account executive

Loomis Group
phone +33 (0)1 58 18 59 30

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Organometallics welcomes new editor-in-chief: Paul Chirik, Ph.D. July 22nd, 2014

The Hiden EQP Plasma Diagnostic with on-board MCA July 22nd, 2014

Iran to Hold 3rd Int'l Forum on Nanotechnology Economy July 22nd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Chip Technology

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

NUS scientists use low cost technique to improve properties and functions of nanomaterials: By 'drawing' micropatterns on nanomaterials using a focused laser beam, scientists could modify properties of nanomaterials for effective applications in photonic and optoelectric applicat July 22nd, 2014

Dongbu HiTek Unveils Low-Voltage BCDMOS Process for Efficient Power Management in Smart Phones and Tablet Computers July 21st, 2014


3-D nanostructure could benefit nanoelectronics, gas storage: Rice U. researchers predict functional advantages of 3-D boron nitride July 15th, 2014

IBM Announces $3 Billion Research Initiative to Tackle Chip Grand Challenges for Cloud and Big Data Systems: Scientists and engineers to push limits of silicon technology to 7 nanometers and below and create post-silicon future July 10th, 2014

Carbodeon enables 20 percent increase in polymer thermal filler conductivity with 0.03 wt.% nanodiamond additive at a lower cost than with traditional fillers: Improved materials and processes enable nanodiamond cost reductions of up to 70 percent for electronics and LED app July 9th, 2014

Nanotechnology that will impact the Security & Defense sectors to be discussed at NanoSD2014 conference July 8th, 2014


Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Bruker Awarded Fourth PeakForce Tapping Patent: AFM Mode Uniquely Combines Highest Resolution Imaging and Material Property Mapping July 22nd, 2014

NIST shows ultrasonically propelled nanorods spin dizzyingly fast July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014


EPFL Research on the use of AFM based nanoscale IR spectroscopy for the study of single amyloid molecules wins poster competition at Swiss Physics Society meeting July 22nd, 2014

Iran to Hold 3rd Int'l Forum on Nanotechnology Economy July 22nd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Iran to Host 1st Asian Congress on Nanostructures on Kish Island July 21st, 2014


Martini Tech Inc. becomes the exclusive distributor for Yoshioka Seiko Co. porous chucks for Europe and North America July 20th, 2014

University of Illinois researchers demonstrate novel, tunable nanoantennas July 14th, 2014

Haydale Announces Collaboration Agreement with Swansea University’s Welsh Centre for Printing and Coatings (WCPC) July 12th, 2014

Leti to Present Technological Platforms Targeting Industry’s Needs for the Future at Semicon West Workshop: Presentation at STS Session to Focus on Leti Advanced Lithography Programs for 1x Nodes and on Silicon Photonics at TechXPot June 25th, 2014

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project

© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE