Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > CEA-Leti to Highlight Developments in Lithography, FDSOI and 3D Integration at SEMICON Europa, Oct. 19-21 in Dresden

Abstract:
CEA-Leti will highlight its programs and recent developments in lithography, FDSOI and 3D design and integration at SEMICON Europa, Oct. 19-21 in Dresden, Germany.

Leti experts will be in Hall 4 - Booth 026.

CEA-Leti to Highlight Developments in Lithography, FDSOI and 3D Integration at SEMICON Europa, Oct. 19-21 in Dresden

Grenoble | Posted on October 13th, 2010

Lithography

Working with IBM, ST, Nikon, TSMC and other technology pioneers, CEA-Leti's Lithography Laboratory is developing production-oriented patterning for several generations of future semiconductor technology.

Lithography processes based on optical technology will likely not be effective beyond the 22nm node, and the most-discussed alternative, extreme ultraviolet, is still not ready for production after more than 15 years of development. Today, a cloud of uncertainty hangs over the semiconductor industry's ability to continue its historic progress to ever-smaller features.

Leti's Lithography Laboratory is addressing this challenge in several areas. The Imagine Program is cultivating maskless electron-beam lithographic approaches originally developed in Leti's ML2 maskless lithography program. Meanwhile, ongoing research into optical double-patterning techniques was applied to a spacer process for advanced logic chip production.

These efforts have placed Leti at the forefront of e-beam lithography, with one of the most advanced equipment sets in the world, including two shaped e-beam systems, two Gaussian-beam systems, and the alpha version of Mapper Lithography's multi-beam tool, which has the potential to bring huge boosts in productivity. The Lithography Laboratory also maintains a complete 193nm lithography capability, including data preparation and resist characterization.

FDSOI

Leti is focusing on the development of fully depleted silicon-on-insulator (FDSOI) technology, which potentially will enable fabrication of smaller, denser and faster integrated circuits.

FDSOI devices typically require a much thinner active silicon layer than standard complimentary metal-oxide semiconductor (CMOS) devices, while also enabling significantly reduced threshold voltage variability and enhanced speed/power tradeoff. These and other performance advantages suggest that FDSOI CMOS devices have the potential to be scaled down to the 10nm-technology node by tuning the buried-oxide and silicon-layer thicknesses.

Since pioneering SOI technology in the early 1990s, Leti has produced the most advanced research in FDSOI, assessing its key advantages for low-power, high-performance applications with several industrial partners.

Last year, Leti focused on developing 22nm FDSOI devices and models, while working locally with STMicroelectronics and the Soitec Group, as well as with IBM's semiconductor Joint Development Alliance in Albany, N.Y. In addition, Leti and CMP (Circuits Multi Projects®) launched an exploratory multi-project-wafer initiative based on FDSOI 20nm process, opening access to Leti's 300mm infrastructure to the design community.

3D

Leti is offering wafer-to-wafer 3D integration support for customers' prototype development.

Leti researchers have been developing 3D design and integration technologies for more than two decades. Today, more than 60 researchers across several laboratories are working on various ways to make electrical connections between integrated circuit layers and between vertically stacked computer chips.

Potential uses for 3D integration span the electronics spectrum, from 3D networks-on-a-chip to memory-on-logic stacking to silicon-board technologies that could eventually replace printed-circuit-board packaging. 3D-IC technology plays a key role in enabling cost-effective performance for the entire microelectronics industry.

Leti is developing technologies that enable even higher-density vertical interconnects and recently integrated high-density, fine-pitch TSVs into a 65nm technology process, with very encouraging preliminary results.

Leti also started new 300mm TSV production processes in 300mm clean room facilities through a major partnership with SPP Process Technology Systems (SPTS). Leti will inaugurate its 3D integration 300mm on Jan. 18, 2011.

####

For more information, please click here

Contacts:
Amélie Ravier
account executive


Loomis Group
www.loomisgroup.com
phone +33 (0)1 58 18 59 30

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Gold shines through properties of nano biosensors: Researchers discover that fluorescence in ligand-protected gold nanoclusters is an intrinsic property of the gold particles themselves August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Scientists from the University of Manchester and Diamond Light Source work with Deben to develop and test a new compression stage to study irradiated graphite at elevated temperatures August 15th, 2017

Chip Technology

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Surprise discovery in the search for energy efficient information storage August 10th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Nanoelectronics

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles: Silicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, ene August 3rd, 2017

Scientists discover new magnet with nearly massless charge carriers July 29th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

Announcements

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Gold shines through properties of nano biosensors: Researchers discover that fluorescence in ligand-protected gold nanoclusters is an intrinsic property of the gold particles themselves August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Scientists from the University of Manchester and Diamond Light Source work with Deben to develop and test a new compression stage to study irradiated graphite at elevated temperatures August 15th, 2017

Events/Classes

FRITSCH • Milling and Sizing! Innovations at POWTECH 2017 - Hall 2 • Stand 227 August 9th, 2017

Thermo Fisher Scientific Showcases Innovations in Electron Microscopy and Spectroscopy at M&M 2017: New analytical technologies improve workflows for life sciences and materials science researchers August 8th, 2017

Nanometrics Announces Upcoming Investor Events August 3rd, 2017

Arrowhead Pharmaceuticals to Webcast Fiscal 2017 Third Quarter Results July 27th, 2017

Printing/Lithography/Inkjet/Inks/Bio-printing

Simultaneous Design and Nanomanufacturing Speeds Up Fabrication: Method enhances broadband light absorption in solar cells August 5th, 2017

Meniscus-assisted technique produces high efficiency perovskite PV films July 7th, 2017

Carbodeon demonstrates NanoDiamond nickel coatings with enhanced tribological properties June 7th, 2017

Liquid metal nano printing set to revolutionize electronics: Creating integrated circuits just atoms thick February 18th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project