- About Us
- Nano-Social Network
- Nano Consulting
- My Account
Breakthrough Designed to Increase Power Generation, Cut Costs for Commercial and Residential Solar Power Systems
Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, and Spelsberg, in conjunction with its partner, the Fraunhofer Institute for Solar Energy Systems ISE,announced the development of a disruptive new technology for photovoltaic (PV) solar modules. The technology was demonstrated at InterSolar 2010, July 13-15, 2010, in San Francisco, California. Spelsberg ELS is a German based expert in connection systems for PV modules, and Fraunhofer ISE is the largest solar energy research institute in Europe.
Microsemi has worked with Spelsberg ELS and Fraunhofer ISE to develop a breakthrough solar bypass technology that significantly increases reliability while reducing power dissipation in the critical bypass diode by up to ninety percent as compared to today's typical solutions. Microsemi products based on the technology will implement Microsemi's patented, ultra-low-power CoolRUN(TM) technology that enables increased power generation efficiency and significantly reduces operating temperatures while slashing the operational expense, reliability problems and associated warranty costs of traditional solutions using Schottky diodes.
"Microsemi is excited to bring this new, ground-breaking technology to the solar PV industry," said Paul Pickle, General Manager of Microsemi's Analog Mixed Signal Group. "Our new solar bypass solution will be the first of its kind to address thermal reliability, operational cost and efficiency issues common in solar installations, which will enable improved profitability, a faster break-even time, and improved energy efficiency. Our successful demonstrations at the Photovoltaic Symposium in Bad Staffelstein, Germany, ASES National Solar Conference, and InterSolar shows in Munich and San Francisco are key steps toward deployment of this breakthrough technology."
"Spelsberg is pleased that our partnership with Microsemi has resulted in this breakthrough product offering," said Holger Spelsberg, Managing Director. "We selected Microsemi for their expertise and experience developing solutions for the photovoltaic industry as well as high reliability, aerospace and satellite solutions. Our pooling of unique Microsemi and Spelsberg intellectual property enabled this groundbreaking development."
"We are pleased that Microsemi's new solar bypass solution leverages our system-level knowledge and intellectual property," said Dr. Heribert Schmidt of Fraunhofer ISE. "By combining Microsemi's IC design expertise with our knowledge of solar-energy scientific fundamentals, prototyping, and demonstration-system development, we have achieved a key milestone on the road to significantly more reliable and power-efficient PV modules."
Microsemi's newly developed technology will be used in solar modules for commercial, residential and industrial applications. The technology, in conjunction with Microsemi's high-reliability, 40-year design rule methodology will enable support for demanding industry warranty requirements and extreme environment survivability.
Microsemi and its partners believe that this breakthrough diode technology will have a particularly significant impact on the economic models of large-scale solar-energy providers in the power purchase agreement (PPA) market. The resulting reduction in thermal dissipation greatly improves reliability essential to solar powered systems' operational expenses and return on investment.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning the development of a disruptive new technology for photovoltaic (PV) solar modules, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
For more information, please click here
Gunther Spelsberg GmbH + Co. KG
Im Gewerbepark 1, D-58579 Schalksmuhle
Phone +49 2355 892 552 Fax +49 2355 892 869
John Hohener, Executive Vice President and CFO
Corporate Communications Manager
Copyright © MicrosemiIf you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
News and information
Explaining how 2-D materials break at the atomic level January 20th, 2017
GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions: Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES’ FDX™ portfolio December 15th, 2016
Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016