Nanotechnology Now - Press Release: "Altatech Semiconductor Receives Order for 300 mm CVD System From Fraunhofer Research Center"

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Abstract:
AltaCVD Tool to Process 3D Semiconductor Devices in Dresden, Germany

Altatech Semiconductor Receives Order for 300 mm CVD System From Fraunhofer Research Center

Montbonnot, France | Posted on June 15th, 2010

To advance its work in next-generation 3D semiconductor integration, the newly opened All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic packaging and system integration center run by the Fraunhofer IZM Institute, has ordered a 300 mm AltaCVD system from equipment supplier Altatech Semiconductor S.A.

This is the fourth order for AltaCVD equipment from a major research laboratory.

ASSID will use the AltaCVD system to create through silicon vias (TSV), critical features in 3D semiconductor integration. Processing both standard and thin silicon wafers, the low-temperature AltaCVD tool will deposit stacks of film layers and ultrathin, conformal isolation layers inside deep vias and trenches with aspect ratios as high as 40:1.

In addition to handling either 200 mm or 300 mm wafers, AltaCVD's flexible architecture allows it to be used in volume production for plasma-enhanced deposition (PECVD) of dielectric materials, stacks and metal films as well as in R&D for metal-organic processing (MOCVD) in back-end-of-line (BEOL) applications such as creating direct-platable barriers.

"ASSID's order confirms that our platform, chambers and processes are fulfilling today's most demanding requirements for advanced materials deposition," said Jean-Luc Delcarri, president of Altatech Semiconductor. "Our low-temperature processing and innovative vaporization technology for liquid precursors makes AltaCVD uniquely qualified to deposit the films required for TSV and microsystems integration."

The equipment is scheduled to go online in the third quarter of this year at ASSID's facility in Dresden. The site's Class 1,000 cleanroom is equipped with a complete 300 mm wafer fabrication line for TSV formation and post-processing on both the frontside and backside of wafers, wafer thinning, 3D device stacking, and package assembly and testing.

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About Altatech Semiconductor
Incorporated in 2004, Altatech Semiconductor manufactures liquid-vaporization CVD, wafer inspection and analysis, and inkjet nanoprinting equipment at its headquarters facility near Grenoble and France's epicenter of microelectronics production. Led by a management team with more than 30 years of experience in the semiconductor equipment industry, the company is focused on helping customers to achieve the fastest design-to-market cycle times for products serving the emerging semiconductor, MEMS and nanotechnology markets. For more information, visit www.altatech-sc.com.

About Fraunhofer ASSID
Just opened on 31 May 2010, the new All Silicon System Integration Dresden of Fraunhofer IZM is specially designed for projects in 3D wafer-level system integration (200 mm/300 mm) and prototype development and manufacturing purposes for partners in industry. As part of the Fraunhofer IZM Institute, which specializes in transferring IC advanced packaging and system integration research results to industry, ASSID is integrated into a technology network of applied research institutes and universities.

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