Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Altatech Semiconductor Receives Order for 300 mm CVD System From Fraunhofer Research Center

Abstract:
AltaCVD Tool to Process 3D Semiconductor Devices in Dresden, Germany

Altatech Semiconductor Receives Order for 300 mm CVD System From Fraunhofer Research Center

Montbonnot, France | Posted on June 15th, 2010

To advance its work in next-generation 3D semiconductor integration, the newly opened All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic packaging and system integration center run by the Fraunhofer IZM Institute, has ordered a 300 mm AltaCVD system from equipment supplier Altatech Semiconductor S.A.

This is the fourth order for AltaCVD equipment from a major research laboratory.

ASSID will use the AltaCVD system to create through silicon vias (TSV), critical features in 3D semiconductor integration. Processing both standard and thin silicon wafers, the low-temperature AltaCVD tool will deposit stacks of film layers and ultrathin, conformal isolation layers inside deep vias and trenches with aspect ratios as high as 40:1.

In addition to handling either 200 mm or 300 mm wafers, AltaCVD's flexible architecture allows it to be used in volume production for plasma-enhanced deposition (PECVD) of dielectric materials, stacks and metal films as well as in R&D for metal-organic processing (MOCVD) in back-end-of-line (BEOL) applications such as creating direct-platable barriers.

"ASSID's order confirms that our platform, chambers and processes are fulfilling today's most demanding requirements for advanced materials deposition," said Jean-Luc Delcarri, president of Altatech Semiconductor. "Our low-temperature processing and innovative vaporization technology for liquid precursors makes AltaCVD uniquely qualified to deposit the films required for TSV and microsystems integration."

The equipment is scheduled to go online in the third quarter of this year at ASSID's facility in Dresden. The site's Class 1,000 cleanroom is equipped with a complete 300 mm wafer fabrication line for TSV formation and post-processing on both the frontside and backside of wafers, wafer thinning, 3D device stacking, and package assembly and testing.

####

About Altatech Semiconductor
Incorporated in 2004, Altatech Semiconductor manufactures liquid-vaporization CVD, wafer inspection and analysis, and inkjet nanoprinting equipment at its headquarters facility near Grenoble and France's epicenter of microelectronics production. Led by a management team with more than 30 years of experience in the semiconductor equipment industry, the company is focused on helping customers to achieve the fastest design-to-market cycle times for products serving the emerging semiconductor, MEMS and nanotechnology markets. For more information, visit www.altatech-sc.com.

About Fraunhofer ASSID
Just opened on 31 May 2010, the new All Silicon System Integration Dresden of Fraunhofer IZM is specially designed for projects in 3D wafer-level system integration (200 mm/300 mm) and prototype development and manufacturing purposes for partners in industry. As part of the Fraunhofer IZM Institute, which specializes in transferring IC advanced packaging and system integration research results to industry, ASSID is integrated into a technology network of applied research institutes and universities.

For more information, please click here

Copyright © PrNewswire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Personal cooling units on the horizon April 29th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

The Translational Research Center at the University Hospital of Erlangen in Germany uses the ZetaView from Particle Metrix to quantify extracellular vesicles such as exosomes April 28th, 2016

Chip Technology

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

Researchers create a first frequency comb of time-bin entangled qubits: Discovery is a significant step toward multi-channel quantum communication and higher capacity quantum computers April 28th, 2016

NREL theory establishes a path to high-performance 2-D semiconductor devices April 27th, 2016

Nanoelectronics

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

With simple process, UW-Madison engineers fabricate fastest flexible silicon transistor April 21st, 2016

All powered up: UCI chemists create battery technology with off-the-charts charging capacity April 21st, 2016

Announcements

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Personal cooling units on the horizon April 29th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

The Translational Research Center at the University Hospital of Erlangen in Germany uses the ZetaView from Particle Metrix to quantify extracellular vesicles such as exosomes April 28th, 2016

Tools

Exploring phosphorene, a promising new material April 29th, 2016

JPK reports on the use of a NanoWizard AFM system at the University of Kaiserslautern to study the interaction of bacteria with microstructured surfaces April 28th, 2016

Chemists use DNA to build the world's tiniest thermometer April 27th, 2016

Bruker Introduces Dimension FastScan Pro Industrial AFM: Providing Nanometer-Resolution at High Scan Rates for up to 300-mm Samples April 26th, 2016

New-Contracts/Sales/Customers

Nanometrics Achieves Record 3D-NAND Bookings Quarter: A Record 3D-NAND Bookings Quarter, both in Aggregate and for Each of Three Key Customers March 28th, 2016

Keystone Nano selected by National Cancer Institute to participate in BIO March 23rd, 2016

Heriot-Watt's Institute of Photonics & Quantum Sciences uses the Deben Microtest 2 kN tensile stage to characterise ceramics and engineering plastics January 21st, 2016

Industrial Nanotech, Inc. Begins Supplying One of World's Largest Pulp and Paper Product Companies with Patented Energy Saving and Protective Coatings for Heat Process Equipment January 4th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic