Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Altatech Semiconductor Receives Order for 300 mm CVD System From Fraunhofer Research Center

Abstract:
AltaCVD Tool to Process 3D Semiconductor Devices in Dresden, Germany

Altatech Semiconductor Receives Order for 300 mm CVD System From Fraunhofer Research Center

Montbonnot, France | Posted on June 15th, 2010

To advance its work in next-generation 3D semiconductor integration, the newly opened All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic packaging and system integration center run by the Fraunhofer IZM Institute, has ordered a 300 mm AltaCVD system from equipment supplier Altatech Semiconductor S.A.

This is the fourth order for AltaCVD equipment from a major research laboratory.

ASSID will use the AltaCVD system to create through silicon vias (TSV), critical features in 3D semiconductor integration. Processing both standard and thin silicon wafers, the low-temperature AltaCVD tool will deposit stacks of film layers and ultrathin, conformal isolation layers inside deep vias and trenches with aspect ratios as high as 40:1.

In addition to handling either 200 mm or 300 mm wafers, AltaCVD's flexible architecture allows it to be used in volume production for plasma-enhanced deposition (PECVD) of dielectric materials, stacks and metal films as well as in R&D for metal-organic processing (MOCVD) in back-end-of-line (BEOL) applications such as creating direct-platable barriers.

"ASSID's order confirms that our platform, chambers and processes are fulfilling today's most demanding requirements for advanced materials deposition," said Jean-Luc Delcarri, president of Altatech Semiconductor. "Our low-temperature processing and innovative vaporization technology for liquid precursors makes AltaCVD uniquely qualified to deposit the films required for TSV and microsystems integration."

The equipment is scheduled to go online in the third quarter of this year at ASSID's facility in Dresden. The site's Class 1,000 cleanroom is equipped with a complete 300 mm wafer fabrication line for TSV formation and post-processing on both the frontside and backside of wafers, wafer thinning, 3D device stacking, and package assembly and testing.

####

About Altatech Semiconductor
Incorporated in 2004, Altatech Semiconductor manufactures liquid-vaporization CVD, wafer inspection and analysis, and inkjet nanoprinting equipment at its headquarters facility near Grenoble and France's epicenter of microelectronics production. Led by a management team with more than 30 years of experience in the semiconductor equipment industry, the company is focused on helping customers to achieve the fastest design-to-market cycle times for products serving the emerging semiconductor, MEMS and nanotechnology markets. For more information, visit www.altatech-sc.com.

About Fraunhofer ASSID
Just opened on 31 May 2010, the new All Silicon System Integration Dresden of Fraunhofer IZM is specially designed for projects in 3D wafer-level system integration (200 mm/300 mm) and prototype development and manufacturing purposes for partners in industry. As part of the Fraunhofer IZM Institute, which specializes in transferring IC advanced packaging and system integration research results to industry, ASSID is integrated into a technology network of applied research institutes and universities.

For more information, please click here

Copyright © PrNewswire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Leti to Demo Wristband with Embedded Sensors to Diagnose Sleep Apnea: APNEAband, Which Will Be Demonstrated at CES 2018, Also Monitors Mountain Sickness, Dehydration, Dialysis Treatment Response and Epileptic Seizures December 12th, 2017

Leti Develops World’s First Micro-Coolers for CERN Particle Detectors: Leti Design, Fabrication and Packaging Expertise Extends to Very Large Scientific Instruments December 11th, 2017

Untangling DNA: Researchers filter the entropy out of nanopore measurements December 8th, 2017

Device makes power conversion more efficient: New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid December 8th, 2017

Chip Technology

UCLA chemists synthesize narrow ribbons of graphene using only light and heat: Tiny structures could be next-generation solution for smaller electronic devices December 8th, 2017

Device makes power conversion more efficient: New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid December 8th, 2017

Leti Integrates Hybrid III-V Silicon Lasers on 200mm Wafers with Standard CMOS Process December 6th, 2017

Leti Breakthroughs Point Way to Significant Improvements in SoC Memories December 6th, 2017

Nanoelectronics

GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card November 14th, 2017

Leti Will Present 11 Papers and Host More-than-Moore Technologies Workshop November 14th, 2017

The next generation of power electronics? Gallium nitride doped with beryllium: How to cut down energy loss in power electronics? The right kind of doping November 9th, 2017

Researchers bring optical communication onto silicon chips: Ultrathin films of a semiconductor that emits and detects light can be stacked on top of silicon wafers October 23rd, 2017

Announcements

Leti to Demo Wristband with Embedded Sensors to Diagnose Sleep Apnea: APNEAband, Which Will Be Demonstrated at CES 2018, Also Monitors Mountain Sickness, Dehydration, Dialysis Treatment Response and Epileptic Seizures December 12th, 2017

Leti Develops World’s First Micro-Coolers for CERN Particle Detectors: Leti Design, Fabrication and Packaging Expertise Extends to Very Large Scientific Instruments December 11th, 2017

Untangling DNA: Researchers filter the entropy out of nanopore measurements December 8th, 2017

Device makes power conversion more efficient: New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid December 8th, 2017

Tools

Untangling DNA: Researchers filter the entropy out of nanopore measurements December 8th, 2017

JPK Instruments announce partnership with Swiss company, Cytosurge AG. The partnership makes Cytosurge’s FluidFM® technology available on the JPK NanoWizard® AFM platform December 8th, 2017

Researchers advance technique to detect ovarian cancer: Rice, MD Anderson use fluorescent carbon nanotube probes to achieve first in vivo success November 30th, 2017

Deben reports on a new publication from scientists at La Trobe University in Australia where their CT500 stage is used in micro scanning tomography experiments to better understand ceramic matrix composites under load November 29th, 2017

New-Contracts/Sales/Customers

Solid State Laser manufacturer Lasertel Inc. purchases an Oxford Instruments ICPCVD advanced deposition solution for improved device performance November 3rd, 2017

GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers: Strategic milestone to help guarantee a secure, high-volume supply of FD-SOI technology September 20th, 2017

Probiotics: Novel biosynthetic tool to develop metallic nanoparticles: This research article by Dr. Nida Akhtar et al has been published in Recent Patents on Drug Delivery & Formulation, Volume 11, Issue 1, 2017 July 20th, 2017

Here's a tip: Indented cement shows unique properties: Rice University models reveal nanoindentation can benefit crystals in concrete July 20th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project