Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > CEA-Leti and Docea Power to Combine Expertise on 3D Integration, Thermal and Low-Power Design

Abstract:
CEA-Leti and Docea Power announced today that they will combine their expertise in 3D silicon integration and thermal and low-power design. Under the terms of the common laboratory agreement, CEA-Leti will use EDA tools provided by Docea Power to build 3D-IC designs and methodologies for developing advanced applications consumer and wireless. CEA-Leti is the leading global research center committed to creating innovation in micro- and nanotechnologies. Docea Power, the design-for-low-power company, delivers software for power and thermal analysis at the architectural level.

CEA-Leti and Docea Power to Combine Expertise on 3D Integration, Thermal and Low-Power Design

Grenoble, France & Anaheim, CA | Posted on June 14th, 2010

The collaboration aims at improving design quality and validating a new generation of high-level design tools, like Docea's Aceplorer, for 3D-IC wireless and consumer applications.

"Thermal management and power-efficiency are key factors for success in nowadays designs. Through our cooperation, the thermal and low-power design Aceplorer platform from Docea Power will help to improve the overall design flow, reduce costs and improve the quality of our 3D-IC design," said Laurent Malier CEO of CEA-Leti. "This collaboration with Docea Power will also help us build a new generation of 3D-IC for Leti and our industrial partners."

"With its specific dynamic compact thermal models for 3D packaging and dies, our Aceplorer platform will enable power and thermal modeling of stacked dies, including the 3D interconnect using through-silicon vias (TSVs) and re-distribution layers (RDLs) and the power distribution across multiple layers," said Ghislain Kaiser, CEO of Docea Power. "Collaborating in a common lab with Leti, and benefitting from its broad and deep expertise in 3D-IC technology, gives us the opportunity to validate and improve our platform for addressing the fast-growing 3D stacked-IC market."

The More than Moore roadmap offers tremendous opportunities but also challenges for both optimizing the power consumption of new systems and securing their thermal behavior. In order to seize these opportunities and tackle the challenges of stacking ICs, an efficient architectural modeling solution is needed that takes into account the physical effects of heterogeneous integration, while allowing fast exploration of the design space. Docea's Aceplorer is an architectural-level platform for exploring power and thermal behavior of electronic systems that takes into account the power-temperature coupling effect at the earliest stage of a design.

####

About CEA-Leti
CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defense and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC Campus, CEA-Leti operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,500 patent families. For more information, visit www.leti.fr/en

About Docea Power
Docea Power develops and commercializes a new generation of methodologies and solutions for enabling faster and more reliable power and thermal modeling at system level. Docea Power’s Aceplorer platform offers a consistent approach for executing architecture exploration and optimizing power and thermal behaviour of electronic systems at an early stage of the project. For more information about Docea Power, please visit: www.doceapower.com

For more information, please click here

Contacts:
Docea Power
Europe: Chantal Cochini, l’Ops PR
+33 6 22 98 03 80


US: Georgia Marszalek, ValleyPR
+1 (650) 345-7477



CEA-Leti

Thierry Bosc
+33 4 38 78 31 95


Agency
Amélie Ravier
+33 1 58 18 59 30

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Gold shines through properties of nano biosensors: Researchers discover that fluorescence in ligand-protected gold nanoclusters is an intrinsic property of the gold particles themselves August 16th, 2017

Chip Technology

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Two Scientists Receive Grants to Develop New Materials: Chad Mirkin and Monica Olvera de la Cruz recognized by Sherman Fairchild Foundation August 16th, 2017

Surprise discovery in the search for energy efficient information storage August 10th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Nanoelectronics

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles: Silicon Mobility and GF’s 55nm LPx -enabled platform, with SST’s highly-reliable SuperFlash® memory technology, boosts automotive performance, ene August 3rd, 2017

Scientists discover new magnet with nearly massless charge carriers July 29th, 2017

Atomic discovery opens door to greener, faster, smaller electronic circuitry: Scientists find way to correct communication pathways in silicon chips, making them perfect July 27th, 2017

Announcements

Researchers printed graphene-like materials with inkjet August 17th, 2017

Candy cane supercapacitor could enable fast charging of mobile phones August 17th, 2017

Freeze-dried foam soaks up carbon dioxide: Rice University scientists lead effort to make novel 3-D material August 16th, 2017

Gold shines through properties of nano biosensors: Researchers discover that fluorescence in ligand-protected gold nanoclusters is an intrinsic property of the gold particles themselves August 16th, 2017

Tools

Scientists from the University of Manchester and Diamond Light Source work with Deben to develop and test a new compression stage to study irradiated graphite at elevated temperatures August 15th, 2017

FRITSCH • Milling and Sizing! Innovations at POWTECH 2017 - Hall 2 • Stand 227 August 9th, 2017

New Quattro Field Emission ESEM Emphasizes Versatility and Ease of Use: Thermo Scientific Quattro ESEM allows materials science researchers to study nanoscale structure in almost any material under a range of environmental conditions August 8th, 2017

Thermo Fisher Scientific’s New Talos F200i S/TEM Delivers Flexible, High-Performance Imaging: New compact S/TEM can be configured to meet specific imaging and analytical requirements for materials characterization in research laboratories August 8th, 2017

Alliances/Trade associations/Partnerships/Distributorships

Oxford Instruments Plasma Technology announces a new partner in Korea August 15th, 2017

Moving at the Speed of Light: University of Arizona selected for high-impact, industrial demonstration of new integrated photonic cryogenic datalink for focal plane arrays: Program is major milestone for AIM Photonics August 10th, 2017

Technology Companies Join Forces for TEM Imaging and Analysis August 3rd, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project