Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > CEA-Leti and Docea Power to Combine Expertise on 3D Integration, Thermal and Low-Power Design

Abstract:
CEA-Leti and Docea Power announced today that they will combine their expertise in 3D silicon integration and thermal and low-power design. Under the terms of the common laboratory agreement, CEA-Leti will use EDA tools provided by Docea Power to build 3D-IC designs and methodologies for developing advanced applications consumer and wireless. CEA-Leti is the leading global research center committed to creating innovation in micro- and nanotechnologies. Docea Power, the design-for-low-power company, delivers software for power and thermal analysis at the architectural level.

CEA-Leti and Docea Power to Combine Expertise on 3D Integration, Thermal and Low-Power Design

Grenoble, France & Anaheim, CA | Posted on June 14th, 2010

The collaboration aims at improving design quality and validating a new generation of high-level design tools, like Docea's Aceplorer, for 3D-IC wireless and consumer applications.

"Thermal management and power-efficiency are key factors for success in nowadays designs. Through our cooperation, the thermal and low-power design Aceplorer platform from Docea Power will help to improve the overall design flow, reduce costs and improve the quality of our 3D-IC design," said Laurent Malier CEO of CEA-Leti. "This collaboration with Docea Power will also help us build a new generation of 3D-IC for Leti and our industrial partners."

"With its specific dynamic compact thermal models for 3D packaging and dies, our Aceplorer platform will enable power and thermal modeling of stacked dies, including the 3D interconnect using through-silicon vias (TSVs) and re-distribution layers (RDLs) and the power distribution across multiple layers," said Ghislain Kaiser, CEO of Docea Power. "Collaborating in a common lab with Leti, and benefitting from its broad and deep expertise in 3D-IC technology, gives us the opportunity to validate and improve our platform for addressing the fast-growing 3D stacked-IC market."

The More than Moore roadmap offers tremendous opportunities but also challenges for both optimizing the power consumption of new systems and securing their thermal behavior. In order to seize these opportunities and tackle the challenges of stacking ICs, an efficient architectural modeling solution is needed that takes into account the physical effects of heterogeneous integration, while allowing fast exploration of the design space. Docea's Aceplorer is an architectural-level platform for exploring power and thermal behavior of electronic systems that takes into account the power-temperature coupling effect at the earliest stage of a design.

####

About CEA-Leti
CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defense and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC Campus, CEA-Leti operates 8,000-m state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,500 patent families. For more information, visit www.leti.fr/en

About Docea Power
Docea Power develops and commercializes a new generation of methodologies and solutions for enabling faster and more reliable power and thermal modeling at system level. Docea Powers Aceplorer platform offers a consistent approach for executing architecture exploration and optimizing power and thermal behaviour of electronic systems at an early stage of the project. For more information about Docea Power, please visit: www.doceapower.com

For more information, please click here

Contacts:
Docea Power
Europe: Chantal Cochini, lOps PR
+33 6 22 98 03 80


US: Georgia Marszalek, ValleyPR
+1 (650) 345-7477



CEA-Leti

Thierry Bosc
+33 4 38 78 31 95


Agency
Amlie Ravier
+33 1 58 18 59 30

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Information storage with a nanoscale twist: Discovery of a novel rotational force inside magnetic vortices makes it easier to design ultrahigh capacity disk drives March 28th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX Technology Platform: Leading-edge I-fuse brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Laser activated gold pyramids could deliver drugs, DNA into cells without harm: Microstructures create temporary pores in cells March 27th, 2017

Chip Technology

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX Technology Platform: Leading-edge I-fuse brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Argon is not the 'dope' for metallic hydrogen March 24th, 2017

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

Nanoelectronics

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

UC researchers use gold coating to control luminescence of nanowires: University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper March 17th, 2017

A SOI wafer is a suitable substrate for gallium nitride crystals: Improved characteristics in power electronics and radio applications can be achieved by using a SOI wafer for gallium nitride growth March 4th, 2017

Announcements

Information storage with a nanoscale twist: Discovery of a novel rotational force inside magnetic vortices makes it easier to design ultrahigh capacity disk drives March 28th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX Technology Platform: Leading-edge I-fuse brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Laser activated gold pyramids could deliver drugs, DNA into cells without harm: Microstructures create temporary pores in cells March 27th, 2017

Tools

Cysteine Rose Wins 2016 Thermo Fisher Scientific Electron Microscopy Image Contest: Thermo Fisher honors Andrea Jacassi of the Italian Institute of Technology for image of cysteine crystals using focused ion beam techniques March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Researchers make flexible glass for tiny medical devices: Glass can bend over and over again on a nanoscale March 27th, 2017

Cryo-electron microscopy achieves unprecedented resolution using new computational methods March 25th, 2017

Alliances/Trade associations/Partnerships/Distributorships

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX Technology Platform: Leading-edge I-fuse brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

AIM Photonics Welcomes Coventor as Newest Member: US-Backed Initiative Taps Process Modeling Specialist to Enable Manufacturing of High-Yield, High-Performance Integrated Photonic Designs March 16th, 2017

Applied Graphene Materials plc - Significant commercial progress in AGMs three core sectors March 3rd, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project