Home > Press > SEMATECH and AZ Electronic Materials to Partner on Critical Issues in EUV Lithography at UAlbany NanoCollege
Abstract:
Collaboration at SEMATECH's Resist Center to demonstrate EUV materials and resists for 22nm and beyond
SEMATECH and AZ Electronic Materials to Partner on Critical Issues in EUV Lithography at UAlbany NanoCollege
Albany, NY & Luxembourg | Posted on June 2nd, 2010
SEMATECH, a global consortium of chipmakers, and AZ Electronic Materials, the global supplier of electronic materials to the semiconductor and flat panel display industries, announced today that AZ Electronic Materials has joined SEMATECH's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.
AZ Electronic Materials will collaborate with SEMATECH engineers on crucial resist issues in extreme ultraviolet (EUV) lithography. Specific areas include reduction or elimination of line edge roughness (LER) in images below 22 nm; ultimate resolution of new resists; and testing imaging materials for EUV sensitivity.
"Our partnership with AZ Electronic Materials will help strengthen the RMDC's ability to address critical resist issues in advanced imaging," said John Warlaumont, vice president of Advanced Technologies at SEMATECH. "This new collaboration illustrates the effectiveness of SEMATECH's efforts to include a broader range of industry participants in the search for new solutions to our common technology challenges."
"Joining the RMDC provides AZ the opportunity to apply our leading-edge underlayer and top-rinse technologies to the industry efforts to improve EUV performance," said Geoff Wild, AZ's CEO. "We expect the use of specialty materials 'above and below' the EUV resists will aid in solving some of the current resist processing shortcomings, and we now can test these types of materials at the CNSE."
"The addition of AZ Electronic Materials will further enhance the SEMATECH-CNSE partnership and serve to accelerate the leading-edge research in EUVL technology at CNSE's Albany NanoTech Complex," said Richard Brilla, CNSE vice president for strategy, alliances and consortia. "This collaboration takes advantage of the world-class capabilities at the UAlbany NanoCollege to enable advanced technology solutions that are critical to industry."
At the RMDC, leading resist and materials suppliers participate in focused, cooperative R&D with SEMATECH member companies. Together, the RMDC provides the hardware and research expertise required by materials suppliers and member companies to develop EUV resist processes that meet the stringent resolution, linewidth roughness, and sensitivity specifications needed for EUV insertion at member companies.
####
About SEMATECH
For over 20 years, SEMATECH®, the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.
About AZ Electronic Materials
AZ Electronic Materials (www.az-em.com) is a leading provider of electronic materials to the flat panel displays, integrated circuits and devices, and photolithographic printing industries. The business is headquartered in Luxembourg with plants in Taiwan, Korea, China, Japan, France, Germany and the US. AZ Electronic Materials is owned by the global private equity firms The Carlyle Group and Vestar Capital along with company management.
About CNSE
The UAlbany CNSE is the first college in the world dedicated to education, research, development, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. CNSE’s Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world. With over $5.5 billion in high-tech investments, the 800,000-square-foot complex attracts corporate partners from around the world and offers students a one-of-a-kind academic experience. The UAlbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet of Class 1 capable cleanrooms. More than 2,500 scientists, researchers, engineers, students, and faculty work on site at CNSE’s Albany NanoTech, from companies including IBM, AMD, GlobalFoundries, SEMATECH, Toshiba, Applied Materials, Tokyo Electron, ASML, Novellus Systems, Vistec Lithography and Atotech. For more information, visit www.cnse.albany.edu
For more information, please click here
Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256
Copyright © SEMATECH
If you have a comment, please
Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Bookmark:
News and information
Beautiful "flowers" self-assemble in a beaker: Elaborate nanostructures blossom from a chemical reaction perfected at Harvard May 17th, 2013
Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013
Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Academic/Education
Inaugural Baccalaureate Class Among CNSE Graduates to Pursue Opportunities in New York: Half of undergrads from pioneering class to seek graduate degrees at CNSE; majority of master’s and doctoral degree recipients land high-tech jobs in state’s emerging nanotech industry May 16th, 2013
Anasys reports on University of Illinois study of near-field behavior of semiconductor plasmonic microparticles using AFM-IR published in APL May 14th, 2013
The University of Wyoming uses Nanoparticle Tracking Analysis to characterize nanoparticles in natural environments May 14th, 2013
Nanotechnology Pioneer Named 'Entrepreneur of the Year': Royal Society of Chemistry honors Chad Mirkin for commercializing innovations May 10th, 2013
Chip Technology
UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013
Nanometrics Announces Upcoming Investor Events May 14th, 2013
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013
Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013
Nanoelectronics
Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013
Piezoelectric 'taxel' arrays convert motion to electronic signals for tactile imaging April 25th, 2013
Battery and Memory Device in One April 25th, 2013
Secret of the Crystal's Corners: New Nanowire Structure Has Potential to Increase Semiconductor Applications: University of Cincinnati research describes discovery of a new structure that is a fundamental game changer in the physics of semiconductor nanowires April 23rd, 2013
Announcements
Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013
Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013
Research partnerships
Advancements and developments of solid-state nanopores sensors May 16th, 2013
Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013
Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013
Cold atoms for quantum technology May 12th, 2013