Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Industry Leaders at SEMATECH Litho Forum Expect EUV Lithography for Semiconductor Manufacturing in 2014

Abstract:
Industry collaboration is required to tackle business and technical challenges facing lithography

Industry Leaders at SEMATECH Litho Forum Expect EUV Lithography for Semiconductor Manufacturing in 2014

New York, NY | Posted on May 24th, 2010

At SEMATECH's Litho Forum, May 10-12, semiconductor business leaders and technology experts gained valuable insight on the industry's perceptions about and intentions for lithography development.

The Forum, a three-day gathering of global lithography experts, featured an impressive line-up of senior executives and technical experts in the semiconductor industry who shared perspectives on why collaboration is imperative for semiconductor innovation and what challenges the development of next-generation technologies must tackle to make lithography successful.

"The fundamental enabler of the industry is improving the cost per function," said Dan Armbrust, president and CEO of SEMATECH. "For the industry to evolve, business models need to take into account collaborations to control costs and extend current technologies while building the infrastructure for future solutions."

"Lithography is the backbone of the semiconductor industry, and it will be a driving force for future application opportunities and business growth," said Bryan Rice, director of Lithography at SEMATECH. "The resulting information and guidance from this year's Forum will be invaluable in helping SEMATECH members extend current technologies, build infrastructure for emerging ones, and overcome the technical and cost challenges of next-generation lithography."

Key highlights of the Forum included the following:

o Keynote speaker Gary Patton of IBM focused on the need for industry collaboration and innovation to continue the roadmap forward and pointed to SEMATECH's collaboration on EUV infrastructure as a good example of the type of collaborative innovation to make EUV happen.

o Presenters from IBM, TSMC, Tokyo Electron Limited, and GLOBALFOUNDRIES reviewed the current state of lithography and activities supporting lithography options, including EUV insertion, mask inspection challenges, double patterning process development, multiple e-beam decisions for 22 nm and sub-22 nm, and overall tool readiness.

o Equipment and material suppliers emphasized that the overall development costs and risk reduction must be secured by ensuring that development progresses at a pace compatible with the EUV mask and resist infrastructure.

Additionally, more than 130 attendees were surveyed on their plans and preferences on lithographic approaches for future manufacturing. Key survey results included the following:

o As identified at previous Forums, 193 nm immersion double patterning continues to be the suitable lithographic technology for volume manufacturing in 2012.

o While some manufacturers will use the technology sooner, EUV would be capable of being placed into manufacturing in 2014, with extendibility into manufacturing in 2016.

o For immersion double patterning, cost of ownership, overlay capability, and extendibility to the next-generation device are still the top challenges.

o For EUV technology, mask defects, source power, exposure tool throughput, and cost of ownership were rated the top challenges.

o 193 nm and EUV were chosen as the technologies that would be considered for manufacturing at the 32 nm node or beyond.

With an industry cycle of about two years per lithography node, SEMATECH's biennial Litho Forum provides an opportunity for lithography users and suppliers to evaluate the progress of various technology options. The previous Forums helped coordinate industry consensus on the 32 nm half-pitch generation and beyond.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH | Media Relations
257 Fuller Road | Suite 2200 | Albany, NY | 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Research Study: MetaSOLTM Shatters Solar Panel Efficiency Forecasts with Innovative New Coating: Coating Provides 1.2 Percent Absolute Enhancement to Triple Junction Solar Cells December 2nd, 2016

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Quantum obstacle course changes material from superconductor to insulator December 1st, 2016

Throwing new light on printed organic solar cells December 1st, 2016

Chip Technology

Quantum obstacle course changes material from superconductor to insulator December 1st, 2016

Bumpy surfaces, graphene beat the heat in devices: Rice University theory shows way to enhance heat sinks in future microelectronics November 29th, 2016

Scientists shrink electron gun to matchbox size: Terahertz technology has the potential to enable new applications November 25th, 2016

Uncovering the secrets of friction on graphene: Sliding on flexible graphene surfaces has been uncharted territory until now November 23rd, 2016

Nanoelectronics

Supersonic spray yields new nanomaterial for bendable, wearable electronics: Film of self-fused nanowires clear as glass, conducts like metal November 23rd, 2016

What a twist: Silicon nanoantennas turn light around: The theoretical results will allow scientists to design nanodevices with extraordinary features for use in optoelectronics November 21st, 2016

2-D material a brittle surprise: Rice University researchers finds molybdenum diselenide not as strong as they thought November 14th, 2016

UCR researchers discover new method to dissipate heat in electronic devices: By modulating the flow of phonons through semiconductor nanowires, engineers can create smaller and faster devices November 13th, 2016

Announcements

Research Study: MetaSOLTM Shatters Solar Panel Efficiency Forecasts with Innovative New Coating: Coating Provides 1.2 Percent Absolute Enhancement to Triple Junction Solar Cells December 2nd, 2016

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Quantum obstacle course changes material from superconductor to insulator December 1st, 2016

Throwing new light on printed organic solar cells December 1st, 2016

Events/Classes

IEDM: Leti CEO Marie Semeria to Give Opening-day Keynote on Impact of ‘Hyperconnectivity’ and IoT: Speech to Portray Key Role Nonprofit Research and Technology Organizations Play in Making Technology More Efficient and Ensuring Safety and Security November 29th, 2016

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications November 28th, 2016

Cutting-edge nanotechnologies are breaking into industries November 18th, 2016

IEDM: CEO Marie Semeria to Deliver Opening Day Keynote at IEDM 2016; Institute to Present 13 Papers November 17th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project