Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > European PRO3D Consortium to Focus on Programming 3D Manycore Architectures

Abstract:
New Project Aimed at Developing Holistic System-Design Methodology Spanning Software, Architecture and 3D Integration

European PRO3D Consortium to Focus on Programming 3D Manycore Architectures

EU | Posted on May 4th, 2010

CEA-Leti, coordinator of a new European project called PRO3D to program future 3D manycore architectures, said today that the six partners will focus on developing holistic system-design methodology spanning software, architecture and 3D integration.

Launched by the European Commission in January 2010, the project is designed to demonstrate the effectiveness of 3D manycores by an integrated and concerted effort in key aspects of hardware and software design.

Specific goals of the project include:

• The development of a system software flow that can operate transparently on parallel manycore platforms.
• The Development of formal methods for software design guaranteeing the composability and correct operation of both hardware and software
• The Exploration of the impact of 3D integration for new computing architectures
• The Extension of the software flow to 3D-stacked manycores

PRO3D is built on the world-class R&D expertise of the project's partners to deliver a holistic 3D system-design methodology intended to bring a drastic improvement in productivity, reduce costs and shorten time to market for future embedded computing.

3D stacking enables the project partners to revisit the decade-long architectural tradeoffs between placing processor and memory sub-systems side by side versus placing them vertically and linking them through interconnects that are more than two orders of magnitude more energy efficient and denser than the most advanced off-chip I/O channels.

"With different manycore architectures on the market, the competitive edge can only be gained by taking a truly holistic approach that leverages disruptive advances in fabrication technology while harmonizing innovation in architecture, parallel- programming models and tools," said Laurent Malier, CEO of CEA-Leti. "3D stacking is the highest-potential technology innovation on the horizon for manycore integrated platforms, but it also has distinctive software challenges, like controlling thermal dissipation. These are some of the issues that the PRO3D partners will address."

The PRO3D consortium brings together world-class technology partners leaders with competencies in software, architecture and 3D integration.
• Verimag, Joseph Fourier University, Grenoble 1, France
• ETHZ, Swiss Federal Institute of Technology Zurich
• Alma Mater Studorium, University of Bologna, Italy
• STMicroelectronics, Grenoble, France
• EPFL, Federal Polytechnic School of Lausanne, Switzerland
• CEA-Leti, Grenoble, France.

####

About CEA-Leti
CEA is a French research and technology public organisation, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC excellence centre, CEA-Leti operates 8,000-m˛ state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,400 patent families. In 2008, contractual income covered more than 75 percent of its budget worth 205 M€. For more information, visit www.leti.fr.

For more information, please click here

Contacts:
Sarah-Lyle Dampoux
Phone: +33 1 58 18 59 30

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

A big nano boost for solar cells: Kyoto University and Osaka Gas effort doubles current efficiencies January 21st, 2017

A toolkit for transformable materials: How to design materials with reprogrammable shape and function January 20th, 2017

Explaining how 2-D materials break at the atomic level January 20th, 2017

New research helps to meet the challenges of nanotechnology: Research helps to make the most of nanoscale catalytic effects for nanotechnology January 20th, 2017

Chip Technology

Explaining how 2-D materials break at the atomic level January 20th, 2017

New research helps to meet the challenges of nanotechnology: Research helps to make the most of nanoscale catalytic effects for nanotechnology January 20th, 2017

Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale January 20th, 2017

Nanometrics to Announce Fourth Quarter and Full Year Financial Results on February 7, 2017 January 19th, 2017

Nanoelectronics

Nano-chimneys can cool circuits: Rice University scientists calculate tweaks to graphene would form phonon-friendly cones January 4th, 2017

Advance in intense pulsed light sintering opens door to improved electronics manufacturing December 23rd, 2016

Fast track control accelerates switching of quantum bits December 16th, 2016

GLOBALFOUNDRIES Demonstrates Industry-Leading 56Gbps Long-Reach SerDes on Advanced 14nm FinFET Process Technology: Proven ASIC IP solution will enable significant performance and power efficiency improvements for next-generation high-speed applications December 13th, 2016

Announcements

A big nano boost for solar cells: Kyoto University and Osaka Gas effort doubles current efficiencies January 21st, 2017

A toolkit for transformable materials: How to design materials with reprogrammable shape and function January 20th, 2017

New research helps to meet the challenges of nanotechnology: Research helps to make the most of nanoscale catalytic effects for nanotechnology January 20th, 2017

Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale January 20th, 2017

Alliances/Trade associations/Partnerships/Distributorships

GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions: Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES’ FDX™ portfolio December 15th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications November 28th, 2016

Mechanism for sodium storage in 2-D material: Tin selenide is an effective host for storing sodium ions, making it a promising material for sodium ion batteries October 27th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project