Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button


Home > Press > European PRO3D Consortium to Focus on Programming 3D Manycore Architectures

New Project Aimed at Developing Holistic System-Design Methodology Spanning Software, Architecture and 3D Integration

European PRO3D Consortium to Focus on Programming 3D Manycore Architectures

EU | Posted on May 4th, 2010

CEA-Leti, coordinator of a new European project called PRO3D to program future 3D manycore architectures, said today that the six partners will focus on developing holistic system-design methodology spanning software, architecture and 3D integration.

Launched by the European Commission in January 2010, the project is designed to demonstrate the effectiveness of 3D manycores by an integrated and concerted effort in key aspects of hardware and software design.

Specific goals of the project include:

• The development of a system software flow that can operate transparently on parallel manycore platforms.
• The Development of formal methods for software design guaranteeing the composability and correct operation of both hardware and software
• The Exploration of the impact of 3D integration for new computing architectures
• The Extension of the software flow to 3D-stacked manycores

PRO3D is built on the world-class R&D expertise of the project's partners to deliver a holistic 3D system-design methodology intended to bring a drastic improvement in productivity, reduce costs and shorten time to market for future embedded computing.

3D stacking enables the project partners to revisit the decade-long architectural tradeoffs between placing processor and memory sub-systems side by side versus placing them vertically and linking them through interconnects that are more than two orders of magnitude more energy efficient and denser than the most advanced off-chip I/O channels.

"With different manycore architectures on the market, the competitive edge can only be gained by taking a truly holistic approach that leverages disruptive advances in fabrication technology while harmonizing innovation in architecture, parallel- programming models and tools," said Laurent Malier, CEO of CEA-Leti. "3D stacking is the highest-potential technology innovation on the horizon for manycore integrated platforms, but it also has distinctive software challenges, like controlling thermal dissipation. These are some of the issues that the PRO3D partners will address."

The PRO3D consortium brings together world-class technology partners leaders with competencies in software, architecture and 3D integration.
• Verimag, Joseph Fourier University, Grenoble 1, France
• ETHZ, Swiss Federal Institute of Technology Zurich
• Alma Mater Studorium, University of Bologna, Italy
• STMicroelectronics, Grenoble, France
• EPFL, Federal Polytechnic School of Lausanne, Switzerland
• CEA-Leti, Grenoble, France.


About CEA-Leti
CEA is a French research and technology public organisation, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC excellence centre, CEA-Leti operates 8,000-mē state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,400 patent families. In 2008, contractual income covered more than 75 percent of its budget worth 205 M€. For more information, visit

For more information, please click here

Sarah-Lyle Dampoux
Phone: +33 1 58 18 59 30

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Springer and Tsinghua University Press present the second Nano Research Award: Paul Alivisatos of the University of California Berkeley receives the honor for outstanding contributions in nanoscience July 30th, 2015

European Technology Platform for Nanomedicine and ENATRANS European Consortium Launch the 2nd edition of the Nanomedicine Award: The Award to be presented at BIO-Europe conference in Munich, November 2015 July 30th, 2015

Take a trip through the brain July 30th, 2015

This could replace your silicon computer chips: A new semiconductor material made from black phosphorus may be a candidate to replace silicon in future tech July 30th, 2015

Chip Technology

This could replace your silicon computer chips: A new semiconductor material made from black phosphorus may be a candidate to replace silicon in future tech July 30th, 2015

March 2016; 6th Int'l Conference on Nanostructures in Iran July 29th, 2015

Meet the high-performance single-molecule diode: Major milestone in molecular electronics scored by Berkeley Lab and Columbia University team July 29th, 2015

Short wavelength plasmons observed in nanotubes: Berkeley Lab researchers create Ludinger liquid plasmons in metallic SWNTs July 28th, 2015


Superfast fluorescence sets new speed record: Plasmonic device has speed and efficiency to serve optical computers July 27th, 2015

Spintronics: Molecules stabilizing magnetism: Organic molecules fixing the magnetic orientation of a cobalt surface/ building block for a compact and low-cost storage technology/ publication in Nature Materials July 25th, 2015

ORNL researchers make scalable arrays of 'building blocks' for ultrathin electronics July 22nd, 2015

An easy, scalable and direct method for synthesizing graphene in silicon microelectronics: Korean researchers grow 4-inch diameter, high-quality, multi-layer graphene on desired silicon substrates, an important step for harnessing graphene in commercial silicon microelectronics July 21st, 2015


Take a trip through the brain July 30th, 2015

This could replace your silicon computer chips: A new semiconductor material made from black phosphorus may be a candidate to replace silicon in future tech July 30th, 2015

Sol-gel capacitor dielectric offers record-high energy storage July 30th, 2015

Controlling Dynamic Behavior of Carbon Nanosheets in Structures Made Possible July 30th, 2015

Alliances/Trade associations/Partnerships/Distributorships

Liquipel Debuts Eyesight-Saving ION-Glass Blue Light Protection for iPhones and Androids at RadioShack Stores Nationwide: Liquipel's Unique Protective Screen, Available at RadioShack, Cuts Harmful Blue Light Implicated in Macular Degeneration by 10x July 28th, 2015

Dais Analytic's Business Affiliate in China Announces Ten-Year Strategic Energy Efficiency Business Arrangement With COFCO: Dais Beijing to Perform Feasibility Study on Over 80 Buildings to Improve Efficiencies as Part of Overall Hotel Energy-Savings Project July 23rd, 2015

Leti and Diabeloop Project Aims at Developing Artificial Pancreas for Diabetes Treatment July 22nd, 2015

Imec and Panasonic Demonstrate Breakthrough RRAM Cell July 16th, 2015

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project