Home > Press > European PRO3D Consortium to Focus on Programming 3D Manycore Architectures
Abstract:
New Project Aimed at Developing Holistic System-Design Methodology Spanning Software, Architecture and 3D Integration
European PRO3D Consortium to Focus on Programming 3D Manycore Architectures
EU | Posted on May 4th, 2010
CEA-Leti, coordinator of a new European project called PRO3D to program future 3D manycore architectures, said today that the six partners will focus on developing holistic system-design methodology spanning software, architecture and 3D integration.
Launched by the European Commission in January 2010, the project is designed to demonstrate the effectiveness of 3D manycores by an integrated and concerted effort in key aspects of hardware and software design.
Specific goals of the project include:
The development of a system software flow that can operate transparently on parallel manycore platforms.
The Development of formal methods for software design guaranteeing the composability and correct operation of both hardware and software
The Exploration of the impact of 3D integration for new computing architectures
The Extension of the software flow to 3D-stacked manycores
PRO3D is built on the world-class R&D expertise of the project's partners to deliver a holistic 3D system-design methodology intended to bring a drastic improvement in productivity, reduce costs and shorten time to market for future embedded computing.
3D stacking enables the project partners to revisit the decade-long architectural tradeoffs between placing processor and memory sub-systems side by side versus placing them vertically and linking them through interconnects that are more than two orders of magnitude more energy efficient and denser than the most advanced off-chip I/O channels.
"With different manycore architectures on the market, the competitive edge can only be gained by taking a truly holistic approach that leverages disruptive advances in fabrication technology while harmonizing innovation in architecture, parallel- programming models and tools," said Laurent Malier, CEO of CEA-Leti. "3D stacking is the highest-potential technology innovation on the horizon for manycore integrated platforms, but it also has distinctive software challenges, like controlling thermal dissipation. These are some of the issues that the PRO3D partners will address."
The PRO3D consortium brings together world-class technology partners leaders with competencies in software, architecture and 3D integration.
Verimag, Joseph Fourier University, Grenoble 1, France
ETHZ, Swiss Federal Institute of Technology Zurich
Alma Mater Studorium, University of Bologna, Italy
STMicroelectronics, Grenoble, France
EPFL, Federal Polytechnic School of Lausanne, Switzerland
CEA-Leti, Grenoble, France.
####
About CEA-Leti
CEA is a French research and technology public organisation, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC excellence centre, CEA-Leti operates 8,000-mē state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,400 patent families. In 2008, contractual income covered more than 75 percent of its budget worth 205 M. For more information, visit www.leti.fr.
For more information, please click here
Contacts:
Sarah-Lyle Dampoux
Phone: +33 1 58 18 59 30
Copyright © CEA-Leti
If you have a comment, please
Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Bookmark:
News and information
Sound waves precisely position nanowires June 19th, 2013
Scientists Use Nanotechnology to Increase Thermal Stability of Essential Oils June 19th, 2013
Production of Bioactive Material for Quick Treatment of Bone Damages June 19th, 2013
Nanometrics Announces Participation in 5th Annual CEO Investor Summit: Accredited Investor and Publishing Research Analyst Event to be Held Concurrently With SEMICON West and Intersolar 2013 in San Francisco June 19th, 2013
Chip Technology
Sound waves precisely position nanowires June 19th, 2013
Nanometrics Announces Participation in 5th Annual CEO Investor Summit: Accredited Investor and Publishing Research Analyst Event to be Held Concurrently With SEMICON West and Intersolar 2013 in San Francisco June 19th, 2013
Which qubit my dear? New method to distinguish between neighbouring quantum bits June 18th, 2013
SEMATECH to Address Critical Supply Chain Challenges and Present Latest Technology Advances at SEMICON West 2013 June 17th, 2013
Nanoelectronics
Sound waves precisely position nanowires June 19th, 2013
Imec presents 4K2K CMOS image sensor together with Panasonic: The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV June 18th, 2013
Imec shows multiple enhancement options for next-generation FinFETs: Leading nano-electronics R&D center addresses key challenges of Germanium finFET technology at VLSI 2013 June 14th, 2013
Controlling magnetic clouds in graphene June 14th, 2013
Announcements
Sound waves precisely position nanowires June 19th, 2013
Scientists Use Nanotechnology to Increase Thermal Stability of Essential Oils June 19th, 2013
Production of Bioactive Material for Quick Treatment of Bone Damages June 19th, 2013
Nanometrics Announces Participation in 5th Annual CEO Investor Summit: Accredited Investor and Publishing Research Analyst Event to be Held Concurrently With SEMICON West and Intersolar 2013 in San Francisco June 19th, 2013
Alliances/Partnerships/Distributorships
Imec presents 4K2K CMOS image sensor together with Panasonic: The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV June 18th, 2013
European Technology Platform for Nanomedicine and Nanomed2020 European Consortium Launch the Nanomedicine Award June 17th, 2013
SEMATECH to Address Critical Supply Chain Challenges and Present Latest Technology Advances at SEMICON West 2013 June 17th, 2013
SEMATECH Names William R. Rozich Chairman of the Board June 13th, 2013