Nanotechnology Now - Press Release: "FEI Announces New Flagship Helios NanoLab x50 DualBeam Series"

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Abstract:
Helios outperforms competition for failure analysis, 3D nanoscale characterization and prototyping, and other techniques

FEI Announces New Flagship Helios NanoLab x50 DualBeam Series

Hillsboro, OR | Posted on April 27th, 2010

FEI Company (NASDAQ: FEIC), a leading diversified scientific instruments company providing electron and ion-beam microscopes and tools for nanoscale applications across many industries, today introduced the new Helios NanoLab™ x50 DualBeam™ Series, the most powerful and versatile DualBeam system available on the market today. It integrates FEI's extreme high-resolution scanning electron microscope (XHR SEM) with a new, high-performance focused ion beam (FIB), to deliver an unprecedented level of imaging and milling capability for leading-edge applications in semiconductor and materials science research and development.

"FEI was the first to commercialize the DualBeam well over a decade ago, and, in keeping with FEI's long track record of combining the latest in SEM and FIB technologies in a single system, we have unveiled the new Helios NanoLab x50 DualBeam. Designed to meet our customers' next-generation imaging requirements, the Helios is the most capable and flexible dual beam system available on the market today," stated John Williams, FEI's director of corporate and strategic marketing. "It combines unmatched SEM imaging, originally launched in the award-winning Magellan™, and FIB milling performance with improved resolution and stability, for advanced applications in failure analysis, nanoscale characterization, nanoprototyping, sample preparation, and other advanced analytical techniques."

The new high-performance Tomahawk FIB, originally introduced in the V400ACETM and now empowered with FEI's latest fast switching technology, provides unprecedented SEM and FIB live monitoring of milling operations, a smaller FIB spot for more precise milling control, as well as higher beam currents for faster material removal on large structures, such as through silicon vias (TSVs). Overall throughput of advanced TEM lamella preparation has been improved by 40 percent.

"The Helios 450(S) series is designed primarily for today's advanced semiconductor labs that are dealing with numerous challenges, including shrinking dimensions at sub 32nm nodes; advanced packaging techniques, such as TSVs and multi-die stacks; as well as a higher volume of samples requiring TEM imaging," stated Williams.

The Helios 650 is designed for academic and industrial research centers that need to do advanced material characterization and modification down to the single nanometer scale. It delivers a wider range of information and higher quality 3D data in order to better understand material characteristics, such as particle/porosity distribution, crack propagation and other behaviors. The sub-nanometer resolution of the Helios 650 at extremely low beam energies provides surface-specific imaging that, until now, was unavailable in a dual beam instrument. For nanoprototyping, the Helios 650 offers users the ability to create finer, more complex structures over large areas (millimeters in size) with better control over dimensions, fewer artifacts, faster material removal rates, and more.

The Helios 450(S) and 650 series DualBeam systems are available for ordering immediately. For more information, please visit www.fei.com.

FEI Safe Harbor Statement

This news release contains forward-looking statements that include statements regarding the performance capabilities and benefits of the Helios NanoLab x50 DualBeam Series. Factors that could affect these forward-looking statements include but are not limited to failure of the product or technology to perform as expected and achieve anticipated results, unexpected technology problems and our ability to manufacture, ship and deliver the tools as expected. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.

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About FEI
FEI (Nasdaq: FEIC) is a leading diversified scientific instruments company. It is a premier provider of electron and ion-beam microscopes and tools for nanoscale applications across many industries: industrial and academic materials research, life sciences, semiconductors, data storage, natural resources and more. With a 60-year history of technological innovation and leadership, FEI has set the performance standard in transmission electron microscopes (TEM), scanning electron microscopes (SEM) and DualBeams™, which combine a SEM with a focused ion beam (FIB). FEI’s imaging systems provide 3D characterization, analysis and modification/prototyping with resolutions down to the sub-Ångström (one-tenth of a nanometer) level. FEI’s NanoPorts in North America, Europe and Asia provide centers of technical excellence where its world-class community of customers and specialists collaborate. FEI has approximately 1800 employees and sales and service operations in more than 50 countries around the world.

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Contacts:
Sandy Fewkes, Principal (media contact)
MindWrite Communications, Inc
+1 408 224 4024

FEI Company
Fletcher Chamberlin (investors and analysts)
Investor Relations
+1 503 726 7710

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