Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

android tablet pc

Home > Press > FEI Announces New Flagship Helios NanoLab x50 DualBeam Series

Helios outperforms competition for failure analysis, 3D nanoscale characterization and prototyping, and other techniques

FEI Announces New Flagship Helios NanoLab x50 DualBeam Series

Hillsboro, OR | Posted on April 27th, 2010

FEI Company (NASDAQ: FEIC), a leading diversified scientific instruments company providing electron and ion-beam microscopes and tools for nanoscale applications across many industries, today introduced the new Helios NanoLab™ x50 DualBeam™ Series, the most powerful and versatile DualBeam system available on the market today. It integrates FEI's extreme high-resolution scanning electron microscope (XHR SEM) with a new, high-performance focused ion beam (FIB), to deliver an unprecedented level of imaging and milling capability for leading-edge applications in semiconductor and materials science research and development.

"FEI was the first to commercialize the DualBeam well over a decade ago, and, in keeping with FEI's long track record of combining the latest in SEM and FIB technologies in a single system, we have unveiled the new Helios NanoLab x50 DualBeam. Designed to meet our customers' next-generation imaging requirements, the Helios is the most capable and flexible dual beam system available on the market today," stated John Williams, FEI's director of corporate and strategic marketing. "It combines unmatched SEM imaging, originally launched in the award-winning Magellan™, and FIB milling performance with improved resolution and stability, for advanced applications in failure analysis, nanoscale characterization, nanoprototyping, sample preparation, and other advanced analytical techniques."

The new high-performance Tomahawk FIB, originally introduced in the V400ACETM and now empowered with FEI's latest fast switching technology, provides unprecedented SEM and FIB live monitoring of milling operations, a smaller FIB spot for more precise milling control, as well as higher beam currents for faster material removal on large structures, such as through silicon vias (TSVs). Overall throughput of advanced TEM lamella preparation has been improved by 40 percent.

"The Helios 450(S) series is designed primarily for today's advanced semiconductor labs that are dealing with numerous challenges, including shrinking dimensions at sub 32nm nodes; advanced packaging techniques, such as TSVs and multi-die stacks; as well as a higher volume of samples requiring TEM imaging," stated Williams.

The Helios 650 is designed for academic and industrial research centers that need to do advanced material characterization and modification down to the single nanometer scale. It delivers a wider range of information and higher quality 3D data in order to better understand material characteristics, such as particle/porosity distribution, crack propagation and other behaviors. The sub-nanometer resolution of the Helios 650 at extremely low beam energies provides surface-specific imaging that, until now, was unavailable in a dual beam instrument. For nanoprototyping, the Helios 650 offers users the ability to create finer, more complex structures over large areas (millimeters in size) with better control over dimensions, fewer artifacts, faster material removal rates, and more.

The Helios 450(S) and 650 series DualBeam systems are available for ordering immediately. For more information, please visit

FEI Safe Harbor Statement

This news release contains forward-looking statements that include statements regarding the performance capabilities and benefits of the Helios NanoLab x50 DualBeam Series. Factors that could affect these forward-looking statements include but are not limited to failure of the product or technology to perform as expected and achieve anticipated results, unexpected technology problems and our ability to manufacture, ship and deliver the tools as expected. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.


About FEI
FEI (Nasdaq: FEIC) is a leading diversified scientific instruments company. It is a premier provider of electron and ion-beam microscopes and tools for nanoscale applications across many industries: industrial and academic materials research, life sciences, semiconductors, data storage, natural resources and more. With a 60-year history of technological innovation and leadership, FEI has set the performance standard in transmission electron microscopes (TEM), scanning electron microscopes (SEM) and DualBeams™, which combine a SEM with a focused ion beam (FIB). FEI’s imaging systems provide 3D characterization, analysis and modification/prototyping with resolutions down to the sub-Ångström (one-tenth of a nanometer) level. FEI’s NanoPorts in North America, Europe and Asia provide centers of technical excellence where its world-class community of customers and specialists collaborate. FEI has approximately 1800 employees and sales and service operations in more than 50 countries around the world.

For more information, please click here

Sandy Fewkes, Principal (media contact)
MindWrite Communications, Inc
+1 408 224 4024

FEI Company
Fletcher Chamberlin (investors and analysts)
Investor Relations
+1 503 726 7710

Copyright © FEI

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Sunblock poses potential hazard to sea life August 20th, 2014

Rice physicist emerges as leader in quantum materials research: Nevidomskyy wins both NSF CAREER Award and Cottrell Scholar Award August 20th, 2014

Graphene may be key to leap in supercapacitor performance August 20th, 2014

Newly-Developed Nanobiosensor Quickly Diagnoses Cancer August 20th, 2014

Chip Technology

Electrical engineers take major step toward photonic circuits: Team invents non-metallic metamaterial that enables them to 'compress' and contain light August 19th, 2014

Promising Ferroelectric Materials Suffer From Unexpected Electric Polarizations: Brookhaven Lab scientists find surprising locked charge polarizations that impede performance in next-gen materials that could otherwise revolutionize data-driven devices August 18th, 2014

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption August 15th, 2014

Iranian Scientists Stabilize Protein on Highly Stable Electrode Surface August 14th, 2014


A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

3-D nanostructure could benefit nanoelectronics, gas storage: Rice U. researchers predict functional advantages of 3-D boron nitride July 15th, 2014

IBM Announces $3 Billion Research Initiative to Tackle Chip Grand Challenges for Cloud and Big Data Systems: Scientists and engineers to push limits of silicon technology to 7 nanometers and below and create post-silicon future July 10th, 2014


Rice physicist emerges as leader in quantum materials research: Nevidomskyy wins both NSF CAREER Award and Cottrell Scholar Award August 20th, 2014

Graphene may be key to leap in supercapacitor performance August 20th, 2014

Newly-Developed Nanobiosensor Quickly Diagnoses Cancer August 20th, 2014

Ultrasonic Waves Applied in Production of Graphene Nanosheets August 20th, 2014


Oxford Instruments Asylum Research Receives the 2014 Microscopy Today Innovation Award for blueDrive Photothermal Excitation August 18th, 2014

Laser makes microscopes way cooler: Cooling a nanowire probe with a laser could lead to substantial improvements in the sensitivity of atomic force probe microscopes August 15th, 2014

JPK reports on the use of AFM and advanced fluorescence microscopy at the University of Freiburg August 13th, 2014

Phasefocus reports on the use of their high-precision Lens Profiler for measuring contact lens thickness at the Brien Holden Vision Institute in Sydney, Australia August 13th, 2014

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project

© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE