Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

Abstract:
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010 Materials Research Society (MRS) Spring Meeting on April 5-9 in San Francisco, CA.

SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

San Francisco, CA | Posted on April 22nd, 2010

3D integration offers the promise of higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth. At MRS, SEMATECH researchers described several practical 3D integration achievements - applicable across various 3D processes - in areas such as high-aspect ratio TSVs, wafer bonding, and thinning of interconnect test structures.

"Through collaborative research, our goal is to develop and characterize new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "These practical approaches are critical to the integration, process development, metrology, and tool sets that will make 3D TSVs commercially viable."

"The SEMATECH-CNSE partnership continues to drive leading-edge technologies that will accelerate 3D processes for manufacturing," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This innovative research will enable critical advances to benefit our corporate partners and the global nanoelectronics industry."

In partnership with the UAlbany NanoCollege, specific SEMATECH process advances aimed at improving 3D performance include:

* A practical approach to copper overburden removal by chemical mechanical polishing (CMP), using high removal rate slurry screening and achieving good planarization results, with low polish defects, at a rate suitable for emerging 3D TSV copper applications.
* The process development and associated metrology necessary in thinning bonded 300mm TSV and non-TSV bonded wafers, leaving a defect-free surface which meets the requirements for subsequent processing.
* An array of metrology techniques used in characterizing a manufacturable wafer bond process to deliver a void and dendrite-free bond for handle wafers.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been working jointly with chipmakers, equipment and materials suppliers, and assembly and packaging service companies from around the world on early development challenges, including cost modeling, technology option narrowing, and technology development and benchmarking.

####

About SEMATECH
SEMATECH is the world's catalyst for accelerating the commercialization of technology innovations into manufacturing solutions.

By setting global direction, creating opportunities for flexible collaboration, and conducting strategic R&D, SEMATECH delivers significant return on investment to our semiconductor and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200, Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Ultracold atom waves may shed light on rogue ocean killers: Rice quantum experiments probe underlying physics of rogue ocean waves April 27th, 2017

Looking for the quantum frontier: Beyond classical computing without fault-tolerance? April 27th, 2017

Metal nanoparticles induced visible-light photocatalysis: Mechanisms, applications, ways of promoting catalytic activity and outlook April 27th, 2017

Arrowhead Pharmaceuticals to Webcast Fiscal 2017 Second Quarter Results April 27th, 2017

Academic/Education

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

SUNY Polytechnic Institute Announces Total of 172 Teams Selected to Compete in Solar in Your Community Challenge: Teams from 40 states, plus Washington, DC, 2 Territories, and 4 American Indian Reservations, Will Deploy Solar in Underserved Communities April 20th, 2017

Rice crew revved for Nanocar Race: Nanocar creator James Tour and team take on international competition with single-molecule marvel April 20th, 2017

The Catholic University of Rome uses the JPK NanoWizard® AFM & CellHesion® systems to understand how cells sense and respond to mechanical stimuli April 5th, 2017

Chip Technology

Geoffrey Beach: Drawn to explore magnetism: Materials researcher is working on the magnetic memory of the future April 25th, 2017

'Neuron-reading' nanowires could accelerate development of drugs for neurological diseases April 12th, 2017

Nanometrics to Announce First Quarter Financial Results on May 2, 2017 April 11th, 2017

AIM Photonics Presents Cutting-Edge Integrated Photonics Technology Developments to Packed House at OFC 2017, the Optical Networking and Communication Conference & Exhibition April 11th, 2017

Nanoelectronics

Researchers “iron out” graphene’s wrinkles: New technique produces highly conductive graphene wafers April 3rd, 2017

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

UC researchers use gold coating to control luminescence of nanowires: University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper March 17th, 2017

Announcements

Ultracold atom waves may shed light on rogue ocean killers: Rice quantum experiments probe underlying physics of rogue ocean waves April 27th, 2017

Looking for the quantum frontier: Beyond classical computing without fault-tolerance? April 27th, 2017

Metal nanoparticles induced visible-light photocatalysis: Mechanisms, applications, ways of promoting catalytic activity and outlook April 27th, 2017

Arrowhead Pharmaceuticals to Webcast Fiscal 2017 Second Quarter Results April 27th, 2017

Tools

New Product Nanoparticle preparation from Intertronics with new Thinky NP-100 Nano Pulveriser April 26th, 2017

Affordable STM32 Cloud-Connectable Kit from STMicroelectronics Puts More Features On-Board for Fast and Flexible IoT-Device Development April 26th, 2017

Geoffrey Beach: Drawn to explore magnetism: Materials researcher is working on the magnetic memory of the future April 25th, 2017

NanoMONITOR shares its latest developments concerning the NanoMONITOR Software and the Monitoring stations April 21st, 2017

Events/Classes

Arrowhead Pharmaceuticals to Webcast Fiscal 2017 Second Quarter Results April 27th, 2017

National Conference on Nanomaterials, (NCN-2017) April 21st, 2017

Nanomechanics, Inc. Unveils New Product at ICMCTF Show April 25th: Nanoindentation experts will launch the new Gemini that measures the interaction of two objects that are sliding across each other – not merely making contact April 21st, 2017

Forge Nano 2017: 1st Quarter Media Update April 20th, 2017

Alliances/Trade associations/Partnerships/Distributorships

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

BASF and Landa partner to create revolutionary pigments for automotive coatings: The alliance combines BASF innovations with Landa nano-pigment technology April 5th, 2017

Leti Announces EU/South Korean Project for World’s First 5G-system Prototype: Coinciding with the 2018 Winter Games in PyeongChang, Korea, Prototype Will Be First Time State-of-the-art Terrestrial Wireless Communication Is Seamlessly Combined with Disruptive Satellite Communicati April 4th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Research partnerships

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

Better living through pressure: Functional nanomaterials made easy April 19th, 2017

Shedding light on the absorption of light by titanium dioxide April 14th, 2017

AIM Photonics Presents Cutting-Edge Integrated Photonics Technology Developments to Packed House at OFC 2017, the Optical Networking and Communication Conference & Exhibition April 11th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project