Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

Abstract:
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010 Materials Research Society (MRS) Spring Meeting on April 5-9 in San Francisco, CA.

SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

San Francisco, CA | Posted on April 22nd, 2010

3D integration offers the promise of higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth. At MRS, SEMATECH researchers described several practical 3D integration achievements - applicable across various 3D processes - in areas such as high-aspect ratio TSVs, wafer bonding, and thinning of interconnect test structures.

"Through collaborative research, our goal is to develop and characterize new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "These practical approaches are critical to the integration, process development, metrology, and tool sets that will make 3D TSVs commercially viable."

"The SEMATECH-CNSE partnership continues to drive leading-edge technologies that will accelerate 3D processes for manufacturing," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This innovative research will enable critical advances to benefit our corporate partners and the global nanoelectronics industry."

In partnership with the UAlbany NanoCollege, specific SEMATECH process advances aimed at improving 3D performance include:

* A practical approach to copper overburden removal by chemical mechanical polishing (CMP), using high removal rate slurry screening and achieving good planarization results, with low polish defects, at a rate suitable for emerging 3D TSV copper applications.
* The process development and associated metrology necessary in thinning bonded 300mm TSV and non-TSV bonded wafers, leaving a defect-free surface which meets the requirements for subsequent processing.
* An array of metrology techniques used in characterizing a manufacturable wafer bond process to deliver a void and dendrite-free bond for handle wafers.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been working jointly with chipmakers, equipment and materials suppliers, and assembly and packaging service companies from around the world on early development challenges, including cost modeling, technology option narrowing, and technology development and benchmarking.

####

About SEMATECH
SEMATECH is the world's catalyst for accelerating the commercialization of technology innovations into manufacturing solutions.

By setting global direction, creating opportunities for flexible collaboration, and conducting strategic R&D, SEMATECH delivers significant return on investment to our semiconductor and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200, Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Searching for errors in the quantum world September 21st, 2018

Viral RNA sensing: Optical detection of picomolar concentrations of RNA using switches in plasmonic chirality September 21st, 2018

UT engineers develop first method for controlling nanomotors: Breakthrough for nanotechnology as UT engineers develop first method for switching the mechanical motion of nanomotors September 21st, 2018

Nanobiotix: Update on Head and Neck Phase I/II Trial with NBTXR3 and Other program data presented at ImmunoRad 2018 September 20th, 2018

Academic/Education

The Institute of Applied Physics at the University of Tsukuba near Tokyo in Japan uses Deben's ARM2 detector to better understand catalytic reaction mechanisms June 27th, 2018

Powering the 21st Century with Integrated Photonics: UCSB-Led Team Selected for Demonstration of a Novel Waveguide Platform Which is Transparent Throughout the MWIR and LWIR Spectral Bands June 19th, 2018

SUNY Poly Professor Eric Lifshin Selected for ‘Fellow of the Microanalysis Society’ Position for Significant Contributions to Microanalysis June 13th, 2018

Grand Opening of UC Irvine Materials Research Institute (IMRI) to Spotlight JEOL Center for Nanoscale Solutions: Renowned Materials Scientists to Present at the 1st International Symposium on Advanced Microscopy and Spectroscopy (ISAMS) April 18th, 2018

Chip Technology

Researchers managed to prevent the disappearing of quantum information September 14th, 2018

New devices based on rust could reduce excess heat in computers: Physicists explore long-distance information transmission in antiferromagnetic iron oxide September 14th, 2018

New photonic chip promises more robust quantum computers September 14th, 2018

How a tetrahedral substance can be more symmetrical than a spherical atom: A new type of symmetry September 14th, 2018

Nanoelectronics

How a tetrahedral substance can be more symmetrical than a spherical atom: A new type of symmetry September 14th, 2018

Laser sintering optimized for printed electronics: New study sheds (laser) light on the best means of laying down thin-film circuitry September 13th, 2018

September 5th, 2018

Rice U. lab probes molecular limit of plasmonics: Optical effect detailed in organic molecules with fewer than 50 atoms September 5th, 2018

Announcements

Searching for errors in the quantum world September 21st, 2018

Viral RNA sensing: Optical detection of picomolar concentrations of RNA using switches in plasmonic chirality September 21st, 2018

UT engineers develop first method for controlling nanomotors: Breakthrough for nanotechnology as UT engineers develop first method for switching the mechanical motion of nanomotors September 21st, 2018

Nanobiotix: Update on Head and Neck Phase I/II Trial with NBTXR3 and Other program data presented at ImmunoRad 2018 September 20th, 2018

Tools

Carbon nanodots do an ultrafine job with in vitro lung tissue: New experiments highlight the role of charge and size when it comes to carbon nanodots that mimic the effect of nanoscale pollution particles on the human lung. September 12th, 2018

Terahertz spectroscopy enters the single-molecule regime September 7th, 2018

Mirrorcle Demonstrates MEMS-based Programmable Light Source at CES and PW18 August 30th, 2018

Stress-free ALD from Picosun August 28th, 2018

Events/Classes

Nanobiotix: Update on Head and Neck Phase I/II Trial with NBTXR3 and Other program data presented at ImmunoRad 2018 September 20th, 2018

Arrowhead Pharmaceuticals to Present at Upcoming September 2018 Conferences August 31st, 2018

Stress-free ALD from Picosun August 28th, 2018

Kavli Lectures: New vision of nanomaterial synthesis and light-fueled space travel August 8th, 2018

Alliances/Trade associations/Partnerships/Distributorships

Leti Announces EU Project to Develop Powerful, Inexpensive Sensors with Photonic Integrated Circuits: REDFINCH Members Initially Targeting Applications for Gas Detection and Analysis For Refineries & Petrochemical Industry and Protein Analysis for Dairy Industry September 19th, 2018

Leti & EFI Aim to Dramatically Improve Reliability & Speed of Low-Cost Electronic Devices for Autos: Project Will Extend Model Predictive Control Technique to Microcontrollers, Digital Signal Processors and Other Devices that Lack Powerful Computation Capabilities September 18th, 2018

Silvaco, Purdue team up to bring scalable atomistic TCAD solutions for next generation semiconductor devices and materials August 24th, 2018

Leti & CMP Announce World’s First Multi-Project-Wafer Service with Integrated Silicon OxRAM: Oxide-Based Resistive Ram Memory Platform Development for Backend Memories To Offer Non-Volatility Associated with Embedded Designs August 2nd, 2018

Research partnerships

Leti Announces EU Project to Develop Powerful, Inexpensive Sensors with Photonic Integrated Circuits: REDFINCH Members Initially Targeting Applications for Gas Detection and Analysis For Refineries & Petrochemical Industry and Protein Analysis for Dairy Industry September 19th, 2018

Researchers develop microbubble scrubber to destroy dangerous biofilms September 19th, 2018

Leti & EFI Aim to Dramatically Improve Reliability & Speed of Low-Cost Electronic Devices for Autos: Project Will Extend Model Predictive Control Technique to Microcontrollers, Digital Signal Processors and Other Devices that Lack Powerful Computation Capabilities September 18th, 2018

Tiny camera lens may help link quantum computers to network September 14th, 2018

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project