Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

Abstract:
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010 Materials Research Society (MRS) Spring Meeting on April 5-9 in San Francisco, CA.

SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

San Francisco, CA | Posted on April 22nd, 2010

3D integration offers the promise of higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth. At MRS, SEMATECH researchers described several practical 3D integration achievements - applicable across various 3D processes - in areas such as high-aspect ratio TSVs, wafer bonding, and thinning of interconnect test structures.

"Through collaborative research, our goal is to develop and characterize new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "These practical approaches are critical to the integration, process development, metrology, and tool sets that will make 3D TSVs commercially viable."

"The SEMATECH-CNSE partnership continues to drive leading-edge technologies that will accelerate 3D processes for manufacturing," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This innovative research will enable critical advances to benefit our corporate partners and the global nanoelectronics industry."

In partnership with the UAlbany NanoCollege, specific SEMATECH process advances aimed at improving 3D performance include:

* A practical approach to copper overburden removal by chemical mechanical polishing (CMP), using high removal rate slurry screening and achieving good planarization results, with low polish defects, at a rate suitable for emerging 3D TSV copper applications.
* The process development and associated metrology necessary in thinning bonded 300mm TSV and non-TSV bonded wafers, leaving a defect-free surface which meets the requirements for subsequent processing.
* An array of metrology techniques used in characterizing a manufacturable wafer bond process to deliver a void and dendrite-free bond for handle wafers.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been working jointly with chipmakers, equipment and materials suppliers, and assembly and packaging service companies from around the world on early development challenges, including cost modeling, technology option narrowing, and technology development and benchmarking.

####

About SEMATECH
SEMATECH is the world's catalyst for accelerating the commercialization of technology innovations into manufacturing solutions.

By setting global direction, creating opportunities for flexible collaboration, and conducting strategic R&D, SEMATECH delivers significant return on investment to our semiconductor and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200, Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

A new, tunable device for spintronics: An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs August 29th, 2014

Nanoscale assembly line August 29th, 2014

New analytical technology reveals 'nanomechanical' surface traits August 29th, 2014

New Vice President Takes Helm at CNSE CMOST: Catherine Gilbert To Lead CNSE Children’s Museum of Science and Technology Through Expansion And Relocation August 29th, 2014

Academic/Education

New Vice President Takes Helm at CNSE CMOST: Catherine Gilbert To Lead CNSE Children’s Museum of Science and Technology Through Expansion And Relocation August 29th, 2014

RMIT delivers $30m boost to micro and nano-tech August 26th, 2014

SEMATECH and Newly Merged SUNY CNSE/SUNYIT Launch New Patterning Center to Further Advance Materials Development: Center to Provide Access to Critical Tools that Support Semiconductor Technology Node Development August 7th, 2014

Oxford Instruments Asylum Research and the Center for Nanoscale Systems at Harvard University Present a Workshop on AFM Nanomechanical and Nanoelectrical Characterization, Aug. 21-22 August 6th, 2014

Chip Technology

New analytical technology reveals 'nanomechanical' surface traits August 29th, 2014

Fonon Announces 3D Metal Sintering Technology: Emerging Additive Nano Powder Manufacturing Technology August 28th, 2014

RMIT delivers $30m boost to micro and nano-tech August 26th, 2014

Competition for Graphene: Berkeley Lab Researchers Demonstrate Ultrafast Charge Transfer in New Family of 2D Semiconductors August 26th, 2014

Nanoelectronics

Competition for Graphene: Berkeley Lab Researchers Demonstrate Ultrafast Charge Transfer in New Family of 2D Semiconductors August 26th, 2014

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

3-D nanostructure could benefit nanoelectronics, gas storage: Rice U. researchers predict functional advantages of 3-D boron nitride July 15th, 2014

Announcements

A new, tunable device for spintronics: An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs August 29th, 2014

Nanoscale assembly line August 29th, 2014

New analytical technology reveals 'nanomechanical' surface traits August 29th, 2014

New Vice President Takes Helm at CNSE CMOST: Catherine Gilbert To Lead CNSE Children’s Museum of Science and Technology Through Expansion And Relocation August 29th, 2014

Tools

New analytical technology reveals 'nanomechanical' surface traits August 29th, 2014

Ultra-Low Frequency Vibration Isolation Stabilizes Scanning Tunneling Microscopy at UCLA’s Nano-Research Group August 28th, 2014

Measure Both Elastic and Viscous Properties with AFM Using Asylum Research’s Exclusive AM-FM Viscoelastic Mapping Mode August 28th, 2014

Malvern specialists to deliver inaugural short course on polymer characterization at Interplas 2014 August 27th, 2014

Events/Classes

SouthWest NanoTechnologies CEO Dave Arthur to Discuss “Carbon Nanotubes and Automotive Applications” at The Automotive Composites Conference and Expo 2014 (ACCE2014) August 28th, 2014

Aspen Aerogels, Inc. to Present at Barclays CEO Energy-Power Conference August 27th, 2014

Malvern specialists to deliver inaugural short course on polymer characterization at Interplas 2014 August 27th, 2014

Wyatt Technology’s 24th International Light Scattering Colloquium to Highlight Developments in Applications and Characterization of Nanoparticles August 21st, 2014

Alliances/Partnerships/Distributorships

Leading European communications companies and research organizations have launched an EU project developing the future 5th Generation cellular mobile networks August 28th, 2014

JPK expands availability of instrumentation in the USA – appointing new distributors – launched a new web site to support the US market - AFM now available to US users August 26th, 2014

Sunblock poses potential hazard to sea life August 20th, 2014

SouthWest NanoTechnologies Appoints Matteson-Ridolfi for U.S. Distribution of its SMW™ Specialty Multiwall Carbon Nanotubes August 13th, 2014

Research partnerships

Leading European communications companies and research organizations have launched an EU project developing the future 5th Generation cellular mobile networks August 28th, 2014

New technique uses fraction of measurements to efficiently find quantum wave functions August 28th, 2014

The thunder god vine, assisted by nanotechnology, could shake up future cancer treatment: Targeted therapy for hepatocellular carcinoma using nanotechnology August 27th, 2014

Competition for Graphene: Berkeley Lab Researchers Demonstrate Ultrafast Charge Transfer in New Family of 2D Semiconductors August 26th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE