Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

Abstract:
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010 Materials Research Society (MRS) Spring Meeting on April 5-9 in San Francisco, CA.

SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

San Francisco, CA | Posted on April 22nd, 2010

3D integration offers the promise of higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth. At MRS, SEMATECH researchers described several practical 3D integration achievements - applicable across various 3D processes - in areas such as high-aspect ratio TSVs, wafer bonding, and thinning of interconnect test structures.

"Through collaborative research, our goal is to develop and characterize new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "These practical approaches are critical to the integration, process development, metrology, and tool sets that will make 3D TSVs commercially viable."

"The SEMATECH-CNSE partnership continues to drive leading-edge technologies that will accelerate 3D processes for manufacturing," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This innovative research will enable critical advances to benefit our corporate partners and the global nanoelectronics industry."

In partnership with the UAlbany NanoCollege, specific SEMATECH process advances aimed at improving 3D performance include:

* A practical approach to copper overburden removal by chemical mechanical polishing (CMP), using high removal rate slurry screening and achieving good planarization results, with low polish defects, at a rate suitable for emerging 3D TSV copper applications.
* The process development and associated metrology necessary in thinning bonded 300mm TSV and non-TSV bonded wafers, leaving a defect-free surface which meets the requirements for subsequent processing.
* An array of metrology techniques used in characterizing a manufacturable wafer bond process to deliver a void and dendrite-free bond for handle wafers.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been working jointly with chipmakers, equipment and materials suppliers, and assembly and packaging service companies from around the world on early development challenges, including cost modeling, technology option narrowing, and technology development and benchmarking.

####

About SEMATECH
SEMATECH is the world's catalyst for accelerating the commercialization of technology innovations into manufacturing solutions.

By setting global direction, creating opportunities for flexible collaboration, and conducting strategic R&D, SEMATECH delivers significant return on investment to our semiconductor and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200, Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Composite Pipe Long Term Testing Facility February 10th, 2016

Scientists take nanoparticle snapshots February 10th, 2016

Chemical cages: New technique advances synthetic biology February 10th, 2016

New thin film transistor may lead to flexible devices: Researchers engineer an electronics first, opening door to flexible electronics February 10th, 2016

Academic/Education

SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology: Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly February 9th, 2016

COD Grad Begins Postdoctoral Fellow at Harvard University: Marsela Jorgolli's Passion for Physics Has Led to a Decade of Academic Research That Continues at Harvard University as a Postdoctoral Fellow February 2nd, 2016

Heriot-Watt's Institute of Photonics & Quantum Sciences uses the Deben Microtest 2 kN tensile stage to characterise ceramics and engineering plastics January 21st, 2016

Multiple uses for the JPK NanoWizard AFM system in the Smart Interfaces in Environmental Nanotechnology Group at the University of Illinois at Urbana-Champaign January 20th, 2016

Chip Technology

New thin film transistor may lead to flexible devices: Researchers engineer an electronics first, opening door to flexible electronics February 10th, 2016

SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology: Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly February 9th, 2016

Electron's 1-D metallic surface state observed: A step for the prediction of electronic properties of extremely-fine metal nanowires in next-generation semiconductors February 9th, 2016

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

Nanoelectronics

Electron's 1-D metallic surface state observed: A step for the prediction of electronic properties of extremely-fine metal nanowires in next-generation semiconductors February 9th, 2016

The iron stepping stones to better wearable tech without semiconductors February 8th, 2016

Spin dynamics in an atomically thin semi-conductor February 1st, 2016

New type of nanowires, built with natural gas heating: UNIST research team developed a new simple nanowire manufacturing technique February 1st, 2016

Announcements

Composite Pipe Long Term Testing Facility February 10th, 2016

Scientists take nanoparticle snapshots February 10th, 2016

Chemical cages: New technique advances synthetic biology February 10th, 2016

New thin film transistor may lead to flexible devices: Researchers engineer an electronics first, opening door to flexible electronics February 10th, 2016

Tools

Scientists take nanoparticle snapshots February 10th, 2016

Making sense of metallic glass February 9th, 2016

Chiral magnetic effect generates quantum current: Separating left- and right-handed particles in a semi-metallic material produces anomalously high conductivity February 8th, 2016

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

Events/Classes

Nanotech Security to Present at the Optical Document Security Conference February 11, 2016 February 4th, 2016

New research uses nanotechnology to prevent preterm birth: March of Dimes honors abstract on prematurity at SMFM Annual Meeting February 2nd, 2016

NBC LEARN DEBUTS SIX-PART VIDEO SERIES, “NANOTECHNOLOGY: SUPER SMALL SCIENCE” Produced by NBC Learn in partnership with the National Science Foundation, and narrated by NBC News/MSNBC’s Kate Snow, series highlights leading research in nanotechnology January 25th, 2016

Leti to Host Workshop on New Photonics Applications During SPIE Photonics West: Researchers also Will Present Four Invited Papers At Feb. 13-18 Conference, 14 Papers, Overall January 25th, 2016

Alliances/Trade associations/Partnerships/Distributorships

SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology: Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly February 9th, 2016

Vesper Collaborates with GLOBALFOUNDRIES to Deliver First Piezoelectric MEMS Microphones: Acoustic sensing company works with top foundry to support mass-market consumer products January 21st, 2016

Imec and Cloudtag Collaborate on High Quality Frictionless Wearables for Lifestyle Coaching: Next-generation health and fitness tracker Cloudtag TrackTM launched at CES 2016 January 7th, 2016

Technical partnership at the top – Oxford Instruments and Zurich Instruments announce a technical collaboration for low temperature physics January 7th, 2016

Research partnerships

Chemical cages: New technique advances synthetic biology February 10th, 2016

SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology: Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly February 9th, 2016

Making sense of metallic glass February 9th, 2016

Nanoscale cavity strongly links quantum particles: Single photons can quickly modify individual electrons embedded in a semiconductor chip and vice versa February 8th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic