Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

Abstract:
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010 Materials Research Society (MRS) Spring Meeting on April 5-9 in San Francisco, CA.

SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

San Francisco, CA | Posted on April 22nd, 2010

3D integration offers the promise of higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth. At MRS, SEMATECH researchers described several practical 3D integration achievements - applicable across various 3D processes - in areas such as high-aspect ratio TSVs, wafer bonding, and thinning of interconnect test structures.

"Through collaborative research, our goal is to develop and characterize new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "These practical approaches are critical to the integration, process development, metrology, and tool sets that will make 3D TSVs commercially viable."

"The SEMATECH-CNSE partnership continues to drive leading-edge technologies that will accelerate 3D processes for manufacturing," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This innovative research will enable critical advances to benefit our corporate partners and the global nanoelectronics industry."

In partnership with the UAlbany NanoCollege, specific SEMATECH process advances aimed at improving 3D performance include:

* A practical approach to copper overburden removal by chemical mechanical polishing (CMP), using high removal rate slurry screening and achieving good planarization results, with low polish defects, at a rate suitable for emerging 3D TSV copper applications.
* The process development and associated metrology necessary in thinning bonded 300mm TSV and non-TSV bonded wafers, leaving a defect-free surface which meets the requirements for subsequent processing.
* An array of metrology techniques used in characterizing a manufacturable wafer bond process to deliver a void and dendrite-free bond for handle wafers.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been working jointly with chipmakers, equipment and materials suppliers, and assembly and packaging service companies from around the world on early development challenges, including cost modeling, technology option narrowing, and technology development and benchmarking.

####

About SEMATECH
SEMATECH is the world's catalyst for accelerating the commercialization of technology innovations into manufacturing solutions.

By setting global direction, creating opportunities for flexible collaboration, and conducting strategic R&D, SEMATECH delivers significant return on investment to our semiconductor and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200, Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

SEFCU, SUNY Poly CNSE Announce Winning Student-Led Teams in the 6th Annual $500,000 New York Business Plan Competition April 25th, 2015

Northwestern scientists develop first liquid nanolaser: Technology could lead to new way of doing 'lab on a chip' medical diagnostics April 25th, 2015

Nanotech-enabled moisturizer speeds healing of diabetic skin wounds: Spherical nucleic acids silence gene that interferes with wound healing April 24th, 2015

Fast and accurate 3-D imaging technique to track optically trapped particles April 24th, 2015

Academic/Education

SEFCU, SUNY Poly CNSE Announce Winning Student-Led Teams in the 6th Annual $500,000 New York Business Plan Competition April 25th, 2015

Iranian Female Professor Awarded UNESCO Medal in Nanoscience April 20th, 2015

JPK reports on the use of the NanoWizard® 3 AFM system at the Hebrew University of Jerusalem April 14th, 2015

UK National Graphene Institute Selects Bruker as Official Partner: World-Leading Graphene Research Facility Purchases Multiple Bruker AFMs April 7th, 2015

Chip Technology

Surface matters: Huge reduction of heat conduction observed in flat silicon channels April 23rd, 2015

Drexel materials scientists putting a new spin on computing memory April 22nd, 2015

Printing Silicon on Paper, with Lasers April 21st, 2015

Advances in molecular electronics: Lights on -- molecule on: Researchers from Dresden and Konstanz succeed in light-controlled molecule switching April 20th, 2015

Nanoelectronics

Surface matters: Huge reduction of heat conduction observed in flat silicon channels April 23rd, 2015

New class of 3D-printed aerogels improve energy storage April 22nd, 2015

‘Oxford Instruments Young Nanoscientist India Award 2015’ to Prof. Arindam Ghosh April 20th, 2015

Advances in molecular electronics: Lights on -- molecule on: Researchers from Dresden and Konstanz succeed in light-controlled molecule switching April 20th, 2015

Announcements

SEFCU, SUNY Poly CNSE Announce Winning Student-Led Teams in the 6th Annual $500,000 New York Business Plan Competition April 25th, 2015

Northwestern scientists develop first liquid nanolaser: Technology could lead to new way of doing 'lab on a chip' medical diagnostics April 25th, 2015

Nanotech-enabled moisturizer speeds healing of diabetic skin wounds: Spherical nucleic acids silence gene that interferes with wound healing April 24th, 2015

Fast and accurate 3-D imaging technique to track optically trapped particles April 24th, 2015

Tools

Fast and accurate 3-D imaging technique to track optically trapped particles April 24th, 2015

ORNL reports method that takes quantum sensing to new level April 23rd, 2015

Quantum 'paparazzi' film photons in the act of pairing up April 22nd, 2015

Richards-Kortum elected to American Academy of Arts and Sciences: April 22nd, 2015

Events/Classes

SEFCU, SUNY Poly CNSE Announce Winning Student-Led Teams in the 6th Annual $500,000 New York Business Plan Competition April 25th, 2015

Richards-Kortum elected to American Academy of Arts and Sciences: April 22nd, 2015

Harris & Harris Group Sponsors NYC American Heart Association's Health Sciences Innovation Investment Forum: Co-founder of Harris & Harris Group Portfolio Company TARA Biosystems to Speak About the Value of Tissue Engineering Technology April 21st, 2015

SouthWest NanoTechnologies CEO Dave Arthur to Speak at NanoBCA DC Roundtable on May 19 in Washington DC April 20th, 2015

Alliances/Partnerships/Distributorships

How can you see an atom? (video) April 10th, 2015

FibeRio and VF Corporation Form Strategic Partnership to Lead the Apparel and Footwear Markets in Nanofiber Technology April 8th, 2015

UK National Graphene Institute Selects Bruker as Official Partner: World-Leading Graphene Research Facility Purchases Multiple Bruker AFMs April 7th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Research partnerships

Pseudoparticles travel through photoactive material: KIT scientists measure important process in the conversion of light energy -- publication in Nature Communications April 24th, 2015

Electron spin brings order to high entropy alloys April 23rd, 2015

Surface matters: Huge reduction of heat conduction observed in flat silicon channels April 23rd, 2015

Drexel materials scientists putting a new spin on computing memory April 22nd, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project