Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

Abstract:
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010 Materials Research Society (MRS) Spring Meeting on April 5-9 in San Francisco, CA.

SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness

San Francisco, CA | Posted on April 22nd, 2010

3D integration offers the promise of higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. In this emerging field, new and improved technologies and integration schemes will be necessary to realize 3D's potential as a manufacturable and affordable path to sustaining semiconductor productivity growth. At MRS, SEMATECH researchers described several practical 3D integration achievements - applicable across various 3D processes - in areas such as high-aspect ratio TSVs, wafer bonding, and thinning of interconnect test structures.

"Through collaborative research, our goal is to develop and characterize new approaches to implementing 3D," said Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "These practical approaches are critical to the integration, process development, metrology, and tool sets that will make 3D TSVs commercially viable."

"The SEMATECH-CNSE partnership continues to drive leading-edge technologies that will accelerate 3D processes for manufacturing," said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. "This innovative research will enable critical advances to benefit our corporate partners and the global nanoelectronics industry."

In partnership with the UAlbany NanoCollege, specific SEMATECH process advances aimed at improving 3D performance include:

* A practical approach to copper overburden removal by chemical mechanical polishing (CMP), using high removal rate slurry screening and achieving good planarization results, with low polish defects, at a rate suitable for emerging 3D TSV copper applications.
* The process development and associated metrology necessary in thinning bonded 300mm TSV and non-TSV bonded wafers, leaving a defect-free surface which meets the requirements for subsequent processing.
* An array of metrology techniques used in characterizing a manufacturable wafer bond process to deliver a void and dendrite-free bond for handle wafers.

SEMATECH's 3D program was established at CNSE's Albany NanoTech Complex to deliver robust 300 mm equipment and process technology solutions for high-volume through-silicon via (TSV) manufacturing. To accelerate progress, the program's engineers have been working jointly with chipmakers, equipment and materials suppliers, and assembly and packaging service companies from around the world on early development challenges, including cost modeling, technology option narrowing, and technology development and benchmarking.

####

About SEMATECH
SEMATECH is the world's catalyst for accelerating the commercialization of technology innovations into manufacturing solutions.

By setting global direction, creating opportunities for flexible collaboration, and conducting strategic R&D, SEMATECH delivers significant return on investment to our semiconductor and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200, Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

New non-invasive method can detect Alzheimer's disease early: MRI probe technology shows brain toxins in living animals for first time December 22nd, 2014

Piezoelectricity in a 2-D semiconductor: Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS December 22nd, 2014

Quantum physics just got less complicated December 22nd, 2014

Enzyme Biosensor Used for Rapid Measurement of Drug December 22nd, 2014

Academic/Education

SUNY Poly NanoCollege Faculty Member Selected as American Physical Society Fellow: SUNY Poly Associate Professor of Nanoscience Dr. Vincent LaBella Recognized for Significant Technological Innovations that Enable Interactive Learning December 17th, 2014

Nanomedicine expert joins Rice faculty: Gang Bao combines genetic, nano and imaging techniques to fight disease December 17th, 2014

FEI and Oregon Health & Science University Install a Complete Correlative Microscopy Workflow in Newly Built Collaborative Science Facility December 16th, 2014

Student Nanotechnology Laboratories Network Set Up in Iran December 15th, 2014

Chip Technology

Instant-start computers possible with new breakthrough December 19th, 2014

Switching to spintronics: Berkeley Lab reports on electric field switching of ferromagnetism at room temp December 17th, 2014

Pb islands in a sea of graphene magnetise the material of the future December 16th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

Nanoelectronics

Stacking two-dimensional materials may lower cost of semiconductor devices December 11th, 2014

Defects are perfect in laser-induced graphene: Rice University lab discovers simple way to make material for energy storage, electronics December 10th, 2014

Nanoscale resistors for quantum devices: The electrical characteristics of new thin-film chromium oxide resistors that can be tuned by controlling the oxygen content detailed in the 'Journal of Applied Physics' December 9th, 2014

'Giant' charge density disturbances discovered in nanomaterials: Juelich researchers amplify Friedel oscillations in thin metallic films November 26th, 2014

Announcements

New non-invasive method can detect Alzheimer's disease early: MRI probe technology shows brain toxins in living animals for first time December 22nd, 2014

Piezoelectricity in a 2-D semiconductor: Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS December 22nd, 2014

Quantum physics just got less complicated December 22nd, 2014

Enzyme Biosensor Used for Rapid Measurement of Drug December 22nd, 2014

Tools

Mysteries of ‘Molecular Machines’ Revealed: Phenix software uses X-ray diffraction spots to produce 3-D image December 22nd, 2014

New non-invasive method can detect Alzheimer's disease early: MRI probe technology shows brain toxins in living animals for first time December 22nd, 2014

Atom-thick CCD could capture images: Rice University scientists develop two-dimensional, light-sensitive material December 20th, 2014

Oregon researchers glimpse pathway of sunlight to electricity: Collaboration with Lund University uses modified UO spectroscopy equipment to study 'maze' of connections in photoactive quantum dots December 19th, 2014

Events/Classes

Bruker Introduces BioScope Resolve High-Resolution BioAFM System: Featuring PeakForce Tapping for Quantitative Bio-Mechanical Property Mapping December 16th, 2014

TCL Launches World’s Most Advanced TV in the World’s Largest Market: New Quantum Dot TVs with Color IQ™ Optics Deliver OLED-Quality Color at a Fraction of the Price December 15th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

PETA science consortium to present at Society for Risk Analysis meeting December 10th, 2014

Alliances/Partnerships/Distributorships

SUNY Poly NanoCollege Faculty Member Selected as American Physical Society Fellow: SUNY Poly Associate Professor of Nanoscience Dr. Vincent LaBella Recognized for Significant Technological Innovations that Enable Interactive Learning December 17th, 2014

New 'electronic skin' for prosthetics, robotics detects pressure from different directions December 10th, 2014

SEMATECH Reports Significant Progress in EUV Resist Outgas Testing: Technologists from SEMATECH and JSR demonstrate outgas test results that further enable EUV lithography for high-volume manufacturing readiness December 3rd, 2014

Toward a low-cost 'artificial leaf' that produces clean hydrogen fuel December 3rd, 2014

Research partnerships

New non-invasive method can detect Alzheimer's disease early: MRI probe technology shows brain toxins in living animals for first time December 22nd, 2014

Quantum physics just got less complicated December 22nd, 2014

Scientists reveal breakthrough in optical fiber communications December 21st, 2014

Oregon researchers glimpse pathway of sunlight to electricity: Collaboration with Lund University uses modified UO spectroscopy equipment to study 'maze' of connections in photoactive quantum dots December 19th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE