Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Presto Engineering and CEA-Leti to Develop Test and Analysis Capability for 3D Semiconductor Devices

Abstract:
Presto Engineering Inc., a pioneer of the labless business model for bringing semiconductor products into volume production, and CEA-Leti today announced that they have begun a three-year collaboration to develop test and analysis capability for 3D semiconductor devices.

Presto Engineering and CEA-Leti to Develop Test and Analysis Capability for 3D Semiconductor Devices

San Jose, CA & Grenoble, France | Posted on April 20th, 2010

The project, a common lab that will include Presto's new R&D center at CEA-Leti, will focus on extending the company's test, reliability and failure analysis solutions to through-silicon vias (TSVs), the interconnects between levels on 3D devices.

"IDMs and fabless companies are increasingly outsourcing critical test and analysis functions. The adoption of 3D technologies will fuel this trend and product engineering will require new skills, reliable processes and specialized equipment," said Michel Villemain, CEO of Presto Engineering. "CEA-Leti has industry-leading expertise in 3D integration, advanced interconnects and TSVs, and by working side by side with CEA-Leti's experts, Presto will build on our proven product engineering capabilities for the arrival of TSVs."

Presto's R&D program with CEA-Leti is focused on:

· Characterization of TSVs reliability, defect susceptibility and electrical performance aspects

· Identifying existing test protocols that are appropriate for 3D structures while developing new ones to meet new challenges, and

· Bringing up new diagnostic methods or tools to identify root cause of failures

The common lab will make the ATE and debug process as well as the product engineering platform available for third parties.

"This partnership with Presto is a natural complement to CEA-Leti's many 3D integration projects and joint labs," said Laurent Malier, CEO of CEA-Leti. "We will identify the key challenges of 3D product engineering, so semiconductor manufacturers will have reliable, state-of-the-art test and analysis options when they are ready to go to market with 3D devices that feature TSVs."

In addition to its broad goals, the joint lab will enable Presto to develop critical test and analysis techniques, such as probing specific areas of TSVs without affecting the device itself.

"Testing 3D-IC prototypes will require detecting, recognizing and understanding the failure modes, and mechanisms through their electrical signature," said Cédric Mayor, R&D director for Presto Engineering Europe, a subsidiary of Presto Engineering Inc. "Faulty TSVs may have many root causes that have to be investigated and catalogued in such a way that our ultimate test program and diagnostic tool detect them efficiently."

Presto, which recently opened a hub in Caen, France, offers enhanced RF and 3D-integration expertise and advanced test, reliability, fault-isolation and failure-analysis services. Its Design Success Analysis™ offering includes first-silicon validation, as well as characterization of new processes, new designs, and process transfers.

####

About Presto Engineering
Presto Engineering introduced the labless business model to the semiconductor industry in 2007 when it acquired Cypress Semiconductor’s product-engineering lab. The company helps IDMs and fabless customers improve new device predictability and speed to market by complementing their internal resources with comprehensive chip test and analysis. Supported by unique technical skills and extensive industry experience, Presto’s product-engineering services include RF and 3D integration and state-of-the-art ATE, reliability testing, failure analysis and fault isolation. The company recently expanded into Europe by acquiring lab infrastructure of NXP Semiconductor in Caen, France, and establishing a subsidiary Presto Engineering Europe. Presto Engineering, an ISO 9001 company, is based in San Jose, Calif. Additional information is available on the company’s website at www.presto-eng.com.

About CEA-Leti
CEA is a French research and technology public organization, with activities in three main areas: energy, technologies for information and healthcare, and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC excellence centre, CEA-Leti operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,400 patent families. In 2008, contractual income covered more than 75 percent of its budget worth 205 M€. For more information, visit www.leti.fr.

For more information, please click here

Contacts:
Presto Engineering Inc.
Richard Curtin
Phone: +1 408 434 1808


CEA-Leti

Thierry Bosc
Phone: +33 4 38 78 31 95


Presto Engineering Europe
Neji Sanaa
Phone: +33 2 31 45 38 68


Agency: The Loomis Group
Jana Yuen
Phone: +33 1 58 18 59 30

Copyright © Presto Engineering

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Quantum networks: Back and forth are not equal distances! July 28th, 2015

Smart hydrogel coating creates 'stick-slip' control of capillary action July 27th, 2015

Industrial Nanotech, Inc. Provides Update on PCAOB Audited Financials July 27th, 2015

Global Corrosion Resistant Nano Coatings Market To 2015: Acute Market Reports July 27th, 2015

Openings/New facilities/Groundbreaking/Expansion

QuantumSphere Completes State-of-the-Art Nanocatalyst Production Facility: Now Positioned to Capitalize on Commercial Validation and JDA with Casale, SA July 25th, 2015

Iran Nanotech China Center (INCC) Starts Work in Suzhou Industrial Park June 2nd, 2015

Government of Canada Strengthens Opportunities for Commercialization of Micro- and Nano-Coated Products at the Northern Alberta Institute of Technology May 31st, 2015

SUNY Poly CNSE and NIOSH Launch Federal Nano Health and Safety Consortium: May 20th, 2015

Chip Technology

Quantum networks: Back and forth are not equal distances! July 28th, 2015

Superfast fluorescence sets new speed record: Plasmonic device has speed and efficiency to serve optical computers July 27th, 2015

Spintronics: Molecules stabilizing magnetism: Organic molecules fixing the magnetic orientation of a cobalt surface/ building block for a compact and low-cost storage technology/ publication in Nature Materials July 25th, 2015

Penn researchers discover new chiral property of silicon, with photonic applications July 25th, 2015

Announcements

Quantum networks: Back and forth are not equal distances! July 28th, 2015

Reshaping the solar spectrum to turn light to electricity: UC Riverside researchers find a way to use the infrared region of the sun's spectrum to make solar cells more efficient July 27th, 2015

Industrial Nanotech, Inc. Provides Update on PCAOB Audited Financials July 27th, 2015

Global Corrosion Resistant Nano Coatings Market To 2015: Acute Market Reports July 27th, 2015

Tools

Reshaping the solar spectrum to turn light to electricity: UC Riverside researchers find a way to use the infrared region of the sun's spectrum to make solar cells more efficient July 27th, 2015

Superfast fluorescence sets new speed record: Plasmonic device has speed and efficiency to serve optical computers July 27th, 2015

Ultra-thin hollow nanocages could reduce platinum use in fuel cell electrodes July 24th, 2015

Deben reports on the use of their CT500 in the X-ray microtomography laboratory at La Trobe University, Melbourne, Australia July 22nd, 2015

Alliances/Trade associations/Partnerships/Distributorships

Dais Analytic's Business Affiliate in China Announces Ten-Year Strategic Energy Efficiency Business Arrangement With COFCO: Dais Beijing to Perform Feasibility Study on Over 80 Buildings to Improve Efficiencies as Part of Overall Hotel Energy-Savings Project July 23rd, 2015

Leti and Diabeloop Project Aims at Developing Artificial Pancreas for Diabetes Treatment July 22nd, 2015

Imec and Panasonic Demonstrate Breakthrough RRAM Cell July 16th, 2015

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials: Method prevents leakage of barrier precursors during the interconnect metallization scheme July 15th, 2015

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project