Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Presto Engineering and CEA-Leti to Develop Test and Analysis Capability for 3D Semiconductor Devices

Abstract:
Presto Engineering Inc., a pioneer of the labless business model for bringing semiconductor products into volume production, and CEA-Leti today announced that they have begun a three-year collaboration to develop test and analysis capability for 3D semiconductor devices.

Presto Engineering and CEA-Leti to Develop Test and Analysis Capability for 3D Semiconductor Devices

San Jose, CA & Grenoble, France | Posted on April 20th, 2010

The project, a common lab that will include Presto's new R&D center at CEA-Leti, will focus on extending the company's test, reliability and failure analysis solutions to through-silicon vias (TSVs), the interconnects between levels on 3D devices.

"IDMs and fabless companies are increasingly outsourcing critical test and analysis functions. The adoption of 3D technologies will fuel this trend and product engineering will require new skills, reliable processes and specialized equipment," said Michel Villemain, CEO of Presto Engineering. "CEA-Leti has industry-leading expertise in 3D integration, advanced interconnects and TSVs, and by working side by side with CEA-Leti's experts, Presto will build on our proven product engineering capabilities for the arrival of TSVs."

Presto's R&D program with CEA-Leti is focused on:

· Characterization of TSVs reliability, defect susceptibility and electrical performance aspects

· Identifying existing test protocols that are appropriate for 3D structures while developing new ones to meet new challenges, and

· Bringing up new diagnostic methods or tools to identify root cause of failures

The common lab will make the ATE and debug process as well as the product engineering platform available for third parties.

"This partnership with Presto is a natural complement to CEA-Leti's many 3D integration projects and joint labs," said Laurent Malier, CEO of CEA-Leti. "We will identify the key challenges of 3D product engineering, so semiconductor manufacturers will have reliable, state-of-the-art test and analysis options when they are ready to go to market with 3D devices that feature TSVs."

In addition to its broad goals, the joint lab will enable Presto to develop critical test and analysis techniques, such as probing specific areas of TSVs without affecting the device itself.

"Testing 3D-IC prototypes will require detecting, recognizing and understanding the failure modes, and mechanisms through their electrical signature," said Cédric Mayor, R&D director for Presto Engineering Europe, a subsidiary of Presto Engineering Inc. "Faulty TSVs may have many root causes that have to be investigated and catalogued in such a way that our ultimate test program and diagnostic tool detect them efficiently."

Presto, which recently opened a hub in Caen, France, offers enhanced RF and 3D-integration expertise and advanced test, reliability, fault-isolation and failure-analysis services. Its Design Success Analysis™ offering includes first-silicon validation, as well as characterization of new processes, new designs, and process transfers.

####

About Presto Engineering
Presto Engineering introduced the labless business model to the semiconductor industry in 2007 when it acquired Cypress Semiconductor’s product-engineering lab. The company helps IDMs and fabless customers improve new device predictability and speed to market by complementing their internal resources with comprehensive chip test and analysis. Supported by unique technical skills and extensive industry experience, Presto’s product-engineering services include RF and 3D integration and state-of-the-art ATE, reliability testing, failure analysis and fault isolation. The company recently expanded into Europe by acquiring lab infrastructure of NXP Semiconductor in Caen, France, and establishing a subsidiary Presto Engineering Europe. Presto Engineering, an ISO 9001 company, is based in San Jose, Calif. Additional information is available on the company’s website at www.presto-eng.com.

About CEA-Leti
CEA is a French research and technology public organization, with activities in three main areas: energy, technologies for information and healthcare, and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC excellence centre, CEA-Leti operates 8,000-m² state-of-the-art clean rooms, on 24/7 mode, on 200mm and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,400 patent families. In 2008, contractual income covered more than 75 percent of its budget worth 205 M€. For more information, visit www.leti.fr.

For more information, please click here

Contacts:
Presto Engineering Inc.
Richard Curtin
Phone: +1 408 434 1808


CEA-Leti

Thierry Bosc
Phone: +33 4 38 78 31 95


Presto Engineering Europe
Neji Sanaa
Phone: +33 2 31 45 38 68


Agency: The Loomis Group
Jana Yuen
Phone: +33 1 58 18 59 30

Copyright © Presto Engineering

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

UTSA study describes new minimally invasive device to treat cancer and other illnesses: Medicine diffusion capsule could locally treat multiple ailments and diseases over several weeks December 3rd, 2016

Novel Electrode Structure Provides New Promise for Lithium-Sulfur Batteries December 3rd, 2016

Research Study: MetaSOLTM Shatters Solar Panel Efficiency Forecasts with Innovative New Coating: Coating Provides 1.2 Percent Absolute Enhancement to Triple Junction Solar Cells December 2nd, 2016

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Openings/New facilities/Groundbreaking/Expansion

New Agricultural Research Center Debuts at UCF October 12th, 2016

Nexeon Establishes Base in Asia October 11th, 2016

GLOBALFOUNDRIES to Expand Presence in China with 300mm Fab in Chongqing: Company plans new manufacturing facility and additional design capabilities to serve customers in China May 31st, 2016

Albertan Science Lab Opens in India May 7th, 2016

Chip Technology

Quantum obstacle course changes material from superconductor to insulator December 1st, 2016

Bumpy surfaces, graphene beat the heat in devices: Rice University theory shows way to enhance heat sinks in future microelectronics November 29th, 2016

Scientists shrink electron gun to matchbox size: Terahertz technology has the potential to enable new applications November 25th, 2016

Uncovering the secrets of friction on graphene: Sliding on flexible graphene surfaces has been uncharted territory until now November 23rd, 2016

Announcements

UTSA study describes new minimally invasive device to treat cancer and other illnesses: Medicine diffusion capsule could locally treat multiple ailments and diseases over several weeks December 3rd, 2016

Novel Electrode Structure Provides New Promise for Lithium-Sulfur Batteries December 3rd, 2016

Research Study: MetaSOLTM Shatters Solar Panel Efficiency Forecasts with Innovative New Coating: Coating Provides 1.2 Percent Absolute Enhancement to Triple Junction Solar Cells December 2nd, 2016

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Tools

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Controlled electron pulses November 30th, 2016

Scientists shrink electron gun to matchbox size: Terahertz technology has the potential to enable new applications November 25th, 2016

News from Quorum: The Agricultural Research Service of the USDA uses a Quorum Cryo-SEM preparation system for the study of mites, ticks and other soft bodied organisms November 22nd, 2016

Alliances/Trade associations/Partnerships/Distributorships

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications November 28th, 2016

Mechanism for sodium storage in 2-D material: Tin selenide is an effective host for storing sodium ions, making it a promising material for sodium ion batteries October 27th, 2016

Enterprise In Space Partners with Sketchfab and 3D Hubs for NewSpace Education October 13th, 2016

Arrowhead and Spring Bank Announce Clinical Collaboration for ARC-520 and SB 9200 in Chronic Hepatitis B October 6th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project