Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH SPCC Conference Featuring New Approaches to III-V Materials

Abstract:
Advanced technologies for cleaning, measuring and processing new III-V semiconductor materials for volume wafer manufacturing will be featured at SEMATECH's Surface Preparation and Cleaning Conference (SPCC), March 22-24, at the Sheraton Austin Hotel.

SEMATECH SPCC Conference Featuring New Approaches to III-V Materials

Austin, TX | Posted on March 13th, 2010

This year's annual SPCC will focus on particle removal, including next-generation materials, controlling processes to minimize impact on fragile device structures, non-damaging methods to remove resist, and new metrology approaches for measuring passivation and surface defects.

"As an industry, we're confronting the limits of physics in using silicon for advanced devices, which is forcing us to look for new materials among the III-V semiconductors," said Joel Barnett, SPCC chairman and Senior Member Technical Staff in SEMATECH's Front End Processes (FEP) division. "This year's conference focuses on current developments and roadmap challenges in advanced wafer and surface prep techniques for the 22 nm technology node and beyond."

For more than 10 years, SPCC has brought together leading researchers from industry and academia to focus on challenges in advanced wafer and mask cleaning and surface preparation. The conference presents cutting-edge information designed to help the industry meet technical goals outlined in the International Technology Roadmap for Semiconductors.

On opening day, Jimmy Price, Member Technical Staff, will deliver an invited paper on FEP's success in using second harmonic generation (SHG) to evaluate the effects of different surface cleans and passivization treatments on indium gallium arsenide (InGaAs), a promising III‑V material. The ability to accurately characterize III-V surfaces and interfaces using SHG highlights the potential of this technique as an in-line metrology system suitable for InGaAs-based chip manufacturing. "We now have a non-invasive method that process and device engineers can rely on to monitor the quality of III-V surfaces and interfaces," said Price. "We spent a year developing this application, and I will be explaining it in some detail."

Other highlights of SPCC 2010 include the following:

· A keynote address by SEMATECH president and CEO Dan Armbrust, on "Creative Collaboration: New Directions for Our Industry."

· A session addressing non-damaging wafer cleaning techniques, including wet laser shockwave, controllable collapsing bubbles, sonoluminescent signal, and controlled use of CO2-gasified deionized water. An invited panel will discuss these and other methodologies for removing particles in next-generation materials, including InGaAs.

· Talks on reducing damage to new materials from chemical-mechanical polishing (CMP) and resist removal. CMP can directly affect gate yield and is becoming more important in low temperature devices, where resists must be removed carefully to avoid damage to new III-V devices.

SPCC is part of the SEMATECH Knowledge Series: unique opportunities to focus on accelerating solutions for critical challenges in the nanoelectronics industry. For more information and registration details for SPCC 2010, go to www.sematech.org/meetings/spcc/.

####

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Ag/ZnO-Nanorods Schottky diodes based UV-PDs are fabricated and tested May 26th, 2017

New metamaterial-enhanced MRI technique tested on humans May 26th, 2017

Controlling 3-D behavior of biological cells using laser holographic techniques May 26th, 2017

Unveiling the quantum necklace: Researchers simulate quantum necklace-like structures in superfluids May 26th, 2017

Chip Technology

Researchers find new way to control light with electric fields May 25th, 2017

Nanometrics Announces Retirement Plans of CEO Timothy Stultz: Dr. Stultz to Continue as Director May 25th, 2017

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Plasmon-powered upconversion nanocrystals for enhanced bioimaging and polarized emission: Plasmonic gold nanorods brighten lanthanide-doped upconversion superdots for improved multiphoton bioimaging contrast and enable polarization-selective nonlinear emissions for novel nanoscal May 19th, 2017

Nanoelectronics

Oddball enzyme provides easy path to synthetic biomaterials May 17th, 2017

Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology: Racyics will provide IP and design services as a part of the foundry’s FDXcelerator™ Partner Program May 11th, 2017

Researchers “iron out” graphene’s wrinkles: New technique produces highly conductive graphene wafers April 3rd, 2017

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

Materials/Metamaterials

New metamaterial-enhanced MRI technique tested on humans May 26th, 2017

Stanford scientists use nanotechnology to boost the performance of key industrial catalyst May 18th, 2017

Self-healing tech charges up performance for silicon-containing battery anodes May 15th, 2017

Discovery of new transparent thin film material could improve electronics and solar cells: Conductivity is highest-ever for thin film oxide semiconductor material May 6th, 2017

Announcements

Ag/ZnO-Nanorods Schottky diodes based UV-PDs are fabricated and tested May 26th, 2017

New metamaterial-enhanced MRI technique tested on humans May 26th, 2017

Controlling 3-D behavior of biological cells using laser holographic techniques May 26th, 2017

Unveiling the quantum necklace: Researchers simulate quantum necklace-like structures in superfluids May 26th, 2017

Events/Classes

Nanomechanics, Inc. to Exhibit at the SEM Conference: Nanoindentation experts will attend and exhibit their instruments at the Conference and Exposition on Experimental and Applied Mechanics in Indianapolis May 25th, 2017

Leti to Demo 1st Wireless UNB Transceiver for ‘Massive Internet of Things’ at RFIC 2017 and IMS 2017: Leti Will also Present Three Papers & Two Workshops on 5G Communications IC Design, from RF to mm-Wave, During IMS 2017 and RFIC 2017 in Hawaii May 24th, 2017

Leti Will Demo World’s-first WVGA 10-µm Pitch GaN Microdisplays for Augmented Reality Video at Display Week in Los Angles: Invited Paper also Will Present Leti’s Success with New Augmented Reality Technology That Reduces Pixel Pitch to Less than 5 Microns May 22nd, 2017

Oxford Instruments Asylum Research and Microscopy and Analysis Present the Webinar: “Video-Rate Atomic Force Microscopy Enables New Research Opportunities” May 9th, 2017

Alliances/Trade associations/Partnerships/Distributorships

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

BASF and Landa partner to create revolutionary pigments for automotive coatings: The alliance combines BASF innovations with Landa nano-pigment technology April 5th, 2017

Leti Announces EU/South Korean Project for World’s First 5G-system Prototype: Coinciding with the 2018 Winter Games in PyeongChang, Korea, Prototype Will Be First Time State-of-the-art Terrestrial Wireless Communication Is Seamlessly Combined with Disruptive Satellite Communicati April 4th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project