Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH SPCC Conference Featuring New Approaches to III-V Materials

Abstract:
Advanced technologies for cleaning, measuring and processing new III-V semiconductor materials for volume wafer manufacturing will be featured at SEMATECH's Surface Preparation and Cleaning Conference (SPCC), March 22-24, at the Sheraton Austin Hotel.

SEMATECH SPCC Conference Featuring New Approaches to III-V Materials

Austin, TX | Posted on March 13th, 2010

This year's annual SPCC will focus on particle removal, including next-generation materials, controlling processes to minimize impact on fragile device structures, non-damaging methods to remove resist, and new metrology approaches for measuring passivation and surface defects.

"As an industry, we're confronting the limits of physics in using silicon for advanced devices, which is forcing us to look for new materials among the III-V semiconductors," said Joel Barnett, SPCC chairman and Senior Member Technical Staff in SEMATECH's Front End Processes (FEP) division. "This year's conference focuses on current developments and roadmap challenges in advanced wafer and surface prep techniques for the 22 nm technology node and beyond."

For more than 10 years, SPCC has brought together leading researchers from industry and academia to focus on challenges in advanced wafer and mask cleaning and surface preparation. The conference presents cutting-edge information designed to help the industry meet technical goals outlined in the International Technology Roadmap for Semiconductors.

On opening day, Jimmy Price, Member Technical Staff, will deliver an invited paper on FEP's success in using second harmonic generation (SHG) to evaluate the effects of different surface cleans and passivization treatments on indium gallium arsenide (InGaAs), a promising III‑V material. The ability to accurately characterize III-V surfaces and interfaces using SHG highlights the potential of this technique as an in-line metrology system suitable for InGaAs-based chip manufacturing. "We now have a non-invasive method that process and device engineers can rely on to monitor the quality of III-V surfaces and interfaces," said Price. "We spent a year developing this application, and I will be explaining it in some detail."

Other highlights of SPCC 2010 include the following:

· A keynote address by SEMATECH president and CEO Dan Armbrust, on "Creative Collaboration: New Directions for Our Industry."

· A session addressing non-damaging wafer cleaning techniques, including wet laser shockwave, controllable collapsing bubbles, sonoluminescent signal, and controlled use of CO2-gasified deionized water. An invited panel will discuss these and other methodologies for removing particles in next-generation materials, including InGaAs.

· Talks on reducing damage to new materials from chemical-mechanical polishing (CMP) and resist removal. CMP can directly affect gate yield and is becoming more important in low temperature devices, where resists must be removed carefully to avoid damage to new III-V devices.

SPCC is part of the SEMATECH Knowledge Series: unique opportunities to focus on accelerating solutions for critical challenges in the nanoelectronics industry. For more information and registration details for SPCC 2010, go to www.sematech.org/meetings/spcc/.

####

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Animal study shows flexible, dissolvable silicon device promising for brain monitoring: Other applications include post-operative observation for vascular, cardiac, and orthopaedic procedures, finds Penn study May 5th, 2016

Speedy ion conduction in solid electrolytes clears road for advanced energy devices May 5th, 2016

Engineers create a better way to boil water -- with industrial, electronics applications May 5th, 2016

Clues on the path to a new lithium battery technology: Charging produces highly reactive singlet oxygen in lithium air batteries May 5th, 2016

Chip Technology

Engineers create a better way to boil water -- with industrial, electronics applications May 5th, 2016

Molybdenum disulfide holds promise for light absorption: Rice researchers probe light-capturing properties of atomically thin MoS2 May 5th, 2016

A compact, efficient single photon source that operates at ambient temperatures on a chip: Highly directional single photon source concept is expected to lead to a significant progress in producing compact, cheap, and efficient sources of quantum information bits for future appls May 3rd, 2016

Spintronics for future information technologies: Spin currents in topological insulators controlled May 2nd, 2016

Nanoelectronics

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

With simple process, UW-Madison engineers fabricate fastest flexible silicon transistor April 21st, 2016

All powered up: UCI chemists create battery technology with off-the-charts charging capacity April 21st, 2016

Materials/Metamaterials

A View Through Wood Shows Futuristic Applications: Transparent wood made at UMD could create new windows, cars and solar panels May 5th, 2016

Clay nanotube-biopolymer composite scaffolds for tissue engineering May 1st, 2016

Exploring phosphorene, a promising new material April 29th, 2016

Hybrid nanoantennas -- next-generation platform for ultradense data recording April 28th, 2016

Announcements

Speedy ion conduction in solid electrolytes clears road for advanced energy devices May 5th, 2016

Engineers create a better way to boil water -- with industrial, electronics applications May 5th, 2016

Clues on the path to a new lithium battery technology: Charging produces highly reactive singlet oxygen in lithium air batteries May 5th, 2016

Unique nano-capsules promise the targeted drug delivery: Russian scientists created unique nano-capsules for the targeted drug delivery May 5th, 2016

Events/Classes

Oxford Instruments Asylum Research and McGill University Announce the McGill AFM Summer School and Workshop, May 12-13, 2016 May 4th, 2016

Non-animal approach to predict impact of nanomaterials on human lung published Archives of Toxicology publishes workshop recommendations May 2nd, 2016

Researchers create a first frequency comb of time-bin entangled qubits: Discovery is a significant step toward multi-channel quantum communication and higher capacity quantum computers April 28th, 2016

Introducing the RE標ORK Bio-inspired Robotics Summit in Berlin April 27th, 2016

Alliances/Trade associations/Partnerships/Distributorships

Electrically Conductive Graphene Ink Enables Printing of Biosensors April 23rd, 2016

Leti Extends Collaboration with Qualcomm on CoolCubeTM 3D Integration Technology for High-Density, High-Performance ICs: Collaboration Goals Include Building an Ecosystem To Take the Chip-stacking Technology from Design to Fabrication April 13th, 2016

FEI Partners with Five Pharmaceutical Companies, the Medical Research Council and the University of Cambridge to form Cryo-EM Research Consortium April 5th, 2016

Strem Chemicals and SONA Nanotech Sign Distribution Agreement for the World’s First Gold Nanorods Synthesized without CTAB February 24th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic