Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Imec and Synopsys Collaborate on 3D Stacked IC Development

Abstract:
Synopsys TCAD Tools Accelerate Development of Through-Silicon Via Technology

Imec and Synopsys Collaborate on 3D Stacked IC Development

Mountain View, CA | Posted on March 9th, 2010

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, and the Belgian nanoelectronics research center, imec, today announced they have entered into a collaboration to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs). The collaboration will accelerate the development of 3D stacked IC technologies.

While considered an emerging technology, 3D stacked IC complements conventional transistor scaling and allows multiple chips to be stacked and integrated into a single package. This technology reduces form factor and power consumption, and increases bandwidth of inter-chip communication by minimizing connections through the circuit board with high parasitic capacitance. As with other innovative technologies, 3D stacked IC introduces a number of new issues that can potentially affect its reliability and performance. The collaborative research to address these issues will take place at imec, where silicon wafers with test structures will be manufactured and tested, and Synopsys' TCAD tools will be used to model the TSVs in the chip stacks to optimize 3D stacked IC performance and reliability.

"We consider the availability of Synopsys' silicon-proven finite-element method tools to be an integral part of deploying 3D stacked IC technology. This collaboration will speed up the development of through-silicon via technologies and will in turn facilitate the adoption of 3D stacked ICs in the semiconductor industry," said Luc Van den hove, president and chief executive officer of imec.

"This collaboration with imec affords us the opportunity to validate Synopsys' industry- leading TCAD simulation tools for addressing the emerging 3D stacked IC technology. Imec is an ideal collaboration partner for this effort given its excellent research facilities, industry focus and expertise," said Howard Ko, general manager and senior vice president of the Silicon Engineering Group at Synopsys.

Forward-Looking Statements

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934, including statements regarding the expected benefits of the collaboration between imec and Synopsys. These statements are based on current expectations and beliefs. Actual results could differ materially from those described by these statements due to risks and uncertainties including, but not limited to, engineering difficulties and other risks as identified in the section of Synopsys' Annual Report on Form 10-K for the fiscal year ended October 31, 2009, and subsequent forms 10-Q, entitled "Risk Factors."

####

About imec
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society.

Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of more than 1,750 people includes over 650 industrial residents and guest researchers. In 2008, imec's revenue (P&L) was 270 million euro. Further information on imec can be found at www.imec.be.

About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is a world leader in electronic design automation (EDA), supplying the global electronics market with the software, intellectual property (IP) and services used in semiconductor design, verification and manufacturing. Synopsys’ comprehensive, integrated portfolio of implementation, verification, IP, manufacturing and field-programmable gate array (FPGA) solutions helps address the key challenges designers and manufacturers face today, such as power and yield management, system-to-silicon verification and time-to-results. These technology-leading solutions help give Synopsys customers a competitive edge in bringing the best products to market quickly while reducing costs and schedule risk. Synopsys is headquartered in Mountain View, California, and has more than 65 offices located throughout North America, Europe, Japan, Asia and India. Visit Synopsys online at www.synopsys.com/.

For more information, please click here

Contacts:
Editorial Contacts:

Katrien Marent
Imec
T: + 32 1628 18 80,

Barbara Kalkis
Maestro Marketing & PR
T: +1 408 996 9975,

Sheryl Gulizia
Synopsys, Inc.
+1 650-584-8635


Lisa Gillette-Martin
MCA, Inc.
650-968-8900 x115

Copyright © imec

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Piezoelectricity in a 2-D semiconductor: Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS December 22nd, 2014

Quantum physics just got less complicated December 22nd, 2014

Enzyme Biosensor Used for Rapid Measurement of Drug December 22nd, 2014

Universality of charge order in cuprate superconductors: Charge order has been established in another class of cuprate superconductors, highlighting the importance of the phenomenon as a general property of these high-Tc materials December 22nd, 2014

Software

Spectral Surface Mapping with Microscopic Resolution: CRAIC Technologies introduces Spectral Surface Mapping™ (S2M™) software November 18th, 2014

FEI Releases New Electronics Failure Analysis Applications for Helios NanoLab DualBeam Portfolio: Dx gas chemistry enables rapid delayering of ICs, while AutoLX advanced automation simplifies sample preparation for transmission electron microscopy November 3rd, 2014

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

Strengthening thin-film bonds with ultrafast data collection October 23rd, 2014

Chip Technology

Instant-start computers possible with new breakthrough December 19th, 2014

Switching to spintronics: Berkeley Lab reports on electric field switching of ferromagnetism at room temp December 17th, 2014

Pb islands in a sea of graphene magnetise the material of the future December 16th, 2014

Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014

Nanoelectronics

Stacking two-dimensional materials may lower cost of semiconductor devices December 11th, 2014

Defects are perfect in laser-induced graphene: Rice University lab discovers simple way to make material for energy storage, electronics December 10th, 2014

Nanoscale resistors for quantum devices: The electrical characteristics of new thin-film chromium oxide resistors that can be tuned by controlling the oxygen content detailed in the 'Journal of Applied Physics' December 9th, 2014

'Giant' charge density disturbances discovered in nanomaterials: Juelich researchers amplify Friedel oscillations in thin metallic films November 26th, 2014

Announcements

Piezoelectricity in a 2-D semiconductor: Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS December 22nd, 2014

Quantum physics just got less complicated December 22nd, 2014

Enzyme Biosensor Used for Rapid Measurement of Drug December 22nd, 2014

Universality of charge order in cuprate superconductors: Charge order has been established in another class of cuprate superconductors, highlighting the importance of the phenomenon as a general property of these high-Tc materials December 22nd, 2014

Tools

Atom-thick CCD could capture images: Rice University scientists develop two-dimensional, light-sensitive material December 20th, 2014

Oregon researchers glimpse pathway of sunlight to electricity: Collaboration with Lund University uses modified UO spectroscopy equipment to study 'maze' of connections in photoactive quantum dots December 19th, 2014

Switching to spintronics: Berkeley Lab reports on electric field switching of ferromagnetism at room temp December 17th, 2014

ORNL microscopy pencils patterns in polymers at the nanoscale December 17th, 2014

Alliances/Partnerships/Distributorships

SUNY Poly NanoCollege Faculty Member Selected as American Physical Society Fellow: SUNY Poly Associate Professor of Nanoscience Dr. Vincent LaBella Recognized for Significant Technological Innovations that Enable Interactive Learning December 17th, 2014

New 'electronic skin' for prosthetics, robotics detects pressure from different directions December 10th, 2014

SEMATECH Reports Significant Progress in EUV Resist Outgas Testing: Technologists from SEMATECH and JSR demonstrate outgas test results that further enable EUV lithography for high-volume manufacturing readiness December 3rd, 2014

Toward a low-cost 'artificial leaf' that produces clean hydrogen fuel December 3rd, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE