Nanotechnology Now

• About Us
  
  • Advertising
  • Our Mission
  • Our Team
  • Comments
  • Friends
  • Contact
• Nanotechnology
• News
  
  • Current News
  • Press Releases
  • Submit Press
  • Press kit
  • Interviews
• Columns
• Products
  
  • Our Products
  • Books
  • Featured Books
• Directories
  
  • Companies/Academic
  • Events
  • Glossary
  • Best Of
• Career Center
• Nano-Social Network
• Nano Consulting
• My Account

Home > News > SanDisk, Toshiba aim to reclaim NAND process lead

March 4th, 2010

SanDisk, Toshiba aim to reclaim NAND process lead

Abstract:
The SanDisk-Toshiba duo is looking to take back the process technology lead in NAND—again.


The team of SanDisk Corp. and Toshiba Corp. is set to roll out a 24nm NAND flash part in 2H 10, thereby regaining the lead from the duo of Intel Corp. and Micron Technology Inc., according to an analyst. SanDisk and Toshiba have a joint manufacturing venture in NAND in Japan.

Source:
eetasia.com

Bookmark:

Related News Press

News and information

Beautiful "flowers" self-assemble in a beaker: Elaborate nanostructures blossom from a chemical reaction perfected at Harvard May 17th, 2013

Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013

Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013

NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013

Chip Technology

UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013

Nanometrics Announces Upcoming Investor Events May 14th, 2013

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013

Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013

Memory Technology

RUB physicists let magnetic dipoles interact on the nanoscale for the first time: 'Of great technical interest for future hard disk drives' May 15th, 2013

UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013

Battery and Memory Device in One April 25th, 2013

NanoRosetta Kickstarter project - Printing and archiving the Human genome for the next 10,000 years using nanotech April 4th, 2013

Nanoelectronics

Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013

Piezoelectric 'taxel' arrays convert motion to electronic signals for tactile imaging April 25th, 2013

Battery and Memory Device in One April 25th, 2013

Secret of the Crystal's Corners: New Nanowire Structure Has Potential to Increase Semiconductor Applications: University of Cincinnati research describes discovery of a new structure that is a fundamental game changer in the physics of semiconductor nanowires April 23rd, 2013

Announcements

Artificial Forest for Solar Water-Splitting: Berkeley Lab Researchers Report First Fully Integrated Artificial Photosynthesis Nanosystem May 17th, 2013

Moth-Inspired Nanostructures Take the Color Out of Thin Films May 17th, 2013

NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013

Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013

Alliances/Partnerships/Distributorships

NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013

Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013

Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013

	The latest news from around the world, FREE

Premium Products
	Only the news you want to read!  Learn More
	University Technology Transfer & Patents  Learn More
	Full-service, expert consulting  Learn More

Nanotechnology Now Featured Books