Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Obducat takes part in EU project SMASH

Abstract:
OBDUCAT, leading manufacturer of lithography solutions based on nanoimprint lithography and electron beam lithography, has been invited to participate in the EU funded SMASH project. The project's purpose is to establish new materials and process technologies to be used in production of low-cost, power-efficient, white LED-light sources for the general lighting market.

Obducat takes part in EU project SMASH

Sweden | Posted on November 3rd, 2009

SMASH is an EU funded project within the Seventh Framework Programme, FP 7. The project is coordinated by Osram Opto Semiconductors GmbH and brings together complementary expertise from across Europe. 14 partners from large industry, SMEs, research institutions and universities with an established track record of productive collaborations will participate in the project.

"Our main focus within the SMASH project will be on stamp manufacturing and replication of nanostructures based on our proprietary IPS®-STU® nanoimprint lithography technology for high volume manufacturing", says Patrik Lundström, CEO, Obducat AB.

Key success factors for the broad penetration of LEDs into the general lighting market are: high power efficiency and low cost. The concept of SMASH is to establish disruptive approaches that exploit nanostructured compound semiconductors to realize the key market factors of high efficiency and low cost. These will be achieved by epitaxial growth of LED structures on ultra-low defect nanostructured templates and by the development of LEDs based on nanorod emitters. These approaches will have large impact on manufacturing coast because they enable growth on large area, low coast substrates such as Silicon.

"Realizing these technologies will lead to a new generation of highly efficient and affordable LEDs, which enable the entrance to the general lighting market. That will keep Europe at the forefront of the energy-saving solid state lighting business and strengthen its position in the manufacturing supply chain and luminaire business", says Patrik Lundström.

The SMASH project extends over three years with a budget totalling Euro 11.5 million.


Obducat is required under the Securities Markets Act to make public the information in this press release. The information was submitted for publication at 8.30 am CET on 3 November 2009.

####

About Obducat
Obducat AB is an innovative developer and supplier of technologies, products and processes used for the production and replication of advanced micro and nano structures. Obducat’s products and services are intended to serve the demands of companies within the information storage, semiconductor, printed circuit board, and sensor industries. Obducat’s technologies include electron beam and nano imprint technology. Obducat has offices in Sweden and the UK, with the headquarters located in Malmö, Sweden. The Obducat shares are publicly traded on the Swedish NGM stock exchange.

For more information, please click here

Contacts:
Patrik Lundström
CEO
+46 703 27 37 38


Henri Bergstrand
Chairman of the Board
at +46 708 88 72 45

Copyright © Obducat AB

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

New Hopes for Treatment of Intestine Cancer by Edible Nanodrug March 2nd, 2015

Imec, Holst Centre and Renesas Present World’s Lowest Power 2.4GHz Radio Chip for Bluetooth Low Energy March 1st, 2015

Imec, Murata, and Huawei Introduce Breakthrough Solution for TX-to-RX Isolation in Reconfigurable, Multiband Front-End Modules for Mobile Phones: Electrical-Balance Duplexers Pave the Way to Integrated Solution for TX-to-RX Isolation March 1st, 2015

Imec Demonstrates Compact Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver March 1st, 2015

Display technology/LEDs/SS Lighting/OLEDs

New nanowire structure absorbs light efficiently: Dual-type nanowire arrays can be used in applications such as LEDs and solar cells February 25th, 2015

QD Vision Named Edison Award Finalist for Innovative Color IQ™ Quantum Dot Technology February 23rd, 2015

JunPus launched high-performance thermal grease for LED February 20th, 2015

Penn researchers develop new technique for making molybdenum disulfide: Extra control over monolayer material with advantages over graphene February 19th, 2015

Announcements

New Hopes for Treatment of Intestine Cancer by Edible Nanodrug March 2nd, 2015

Imec Demonstrates Compact Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver March 1st, 2015

onic Present breakthrough in CMOS-based Transceivers for mm-Wave Radar Systems March 1st, 2015

Graphene Shows Promise In Eradication Of Stem Cancer Cells March 1st, 2015

Tools

Mass spectrometers with optimised hydrogen pumping March 1st, 2015

Renishaw and Bruker team up for a workshop on TERS and co-localised AFM Raman February 26th, 2015

Maximum Precision in 3D Printing: New complete solution makes additive manufacturing standard for microfabrication February 26th, 2015

Real-time observation of bond formation by using femtosecond X-ray liquidography February 26th, 2015

Alliances/Partnerships/Distributorships

Launch of the Alliance for Space Development March 1st, 2015

Imec, Holst Centre and Renesas Present World’s Lowest Power 2.4GHz Radio Chip for Bluetooth Low Energy March 1st, 2015

Imec, Murata, and Huawei Introduce Breakthrough Solution for TX-to-RX Isolation in Reconfigurable, Multiband Front-End Modules for Mobile Phones: Electrical-Balance Duplexers Pave the Way to Integrated Solution for TX-to-RX Isolation March 1st, 2015

Imec Demonstrates Compact Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver March 1st, 2015

Research partnerships

Imec, Holst Centre and Renesas Present World’s Lowest Power 2.4GHz Radio Chip for Bluetooth Low Energy March 1st, 2015

Imec, Murata, and Huawei Introduce Breakthrough Solution for TX-to-RX Isolation in Reconfigurable, Multiband Front-End Modules for Mobile Phones: Electrical-Balance Duplexers Pave the Way to Integrated Solution for TX-to-RX Isolation March 1st, 2015

Imec Demonstrates Compact Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver March 1st, 2015

onic Present breakthrough in CMOS-based Transceivers for mm-Wave Radar Systems March 1st, 2015

Printing/Lithography/Inkjet/Inks

Maximum Precision in 3D Printing: New complete solution makes additive manufacturing standard for microfabrication February 26th, 2015

SUNY Poly CNSE Researchers and Corporate Partners to Present Forty Papers at Globally Recognized Lithography Conference: SUNY Poly CNSE Research Group Awarded Both ‘Best Research Paper’ and ‘Best Research Poster’ at SPIE Advanced Lithography 2015 forum February 25th, 2015

World’s first compact rotary 3D printer-cum-scanner unveiled at AAAS by NTU Singapore start-up: With production funded by crowdsourcing, the first unit will be delivered to the United States in March February 16th, 2015

3-D printing with custom molecules creates low-cost mechanical sensor February 10th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE