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EVG Technology Day to Feature Keynote by Leading METU Professor and Conclude with Tour of Bilkent University's New State-of-the-Art Cleanroom-Home to Multiple EVG Systems
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it will host an EVG Technology Day on October 2, 2009 at the Bilkent Hotel in Ankara, Turkey. This day-long customer event will be dedicated to discussing the latest technology trends in MEMS, wafer bonding and lithography. To kick off its first EVG Technology Day in the region, the event will feature a keynote speech by Professor Dr. Tayfun Akin, the founder and head of the METU-MEMS Research and Applications Center and faculty member of Electrical and Electronics Engineering Department at Middle East Technical University (METU). Professor Dr. Akin, who was the co-chair of the IEEE International MEMS Conference held in Istanbul in 2006, will speak about the trends in MEMS.
The keynote speech will follow with technology presentations from EVG representatives on topics such as wafer bonding, advanced lithography: coating and alignment, and nanoimprint lithography (NIL). The day will conclude with a tour of the recently opened UNAM Clean Facility (UCF) at Bilkent University's Institute of Materials Science and Nanotechnology-a national nanotechnology research center. The full agenda is accessible here.
The UCF boasts three tools from EVG, which were installed in July 2009. The cleanroom maintains two flexible, semi-automated EVG620 mask aligners-one of which is equipped with UV-NIL capabilities. The tools support not only the university's own research efforts, but also third-party R&D such as other institutes, consortia and companies. These systems represent one of EVG's most flexible solutions for R&D activities, process evaluation, equipment demonstrations, and pilot or small-scale production.
Paul Lindner, executive technology director of EV Group commented, "EVG has been committed to serving the world's top R&D institutions and universities for more than 25 years now. We are honored that Bilkent University selected our mask aligners, including the UV-NIL system, for its new, state-of-the-art research facility. Turkey is a burgeoning market for us, and for micro- and nanotechnology development, in general. We are pleased to be involved in enabling R&D in the region, and are committed to furthering EVG's involvement, beginning first with an EVG Technology Day."
"We are pleased to partner with EV Group, a global player which has been active in nanoimprint lithography technology for more than a decade," said Mehmet Bayindir, Assistant Director of the Institute of Material Science and Nanotechnology (UNAM) at Bilkent University. "EVG's equipment can be used in our demo facility for customers in the region, as well as for general research at our new facility to enable new ideas in Turkey."
EVG has a proven portfolio of solutions ranging from R&D through high-volume production for the MEMS and semiconductor industries, among others. The company has been involved in Turkey since 2001, with several installations in this emerging market, including two systems at Bilkent University and three systems at METU, who owns the only wafer bonding system in the country.
EVG supports the market through its distribution partner, Imtek Ileri Malzemeler ve Teknolojiler Ltd Sti.-a leading equipment and engineering services provider for advanced technologies and applications in the MEMS and semiconductor fields. Located in Ankara, Imtek has been collaborating closely with EVG since 2007 to offer technology expertise, including local applications support and overall service to its customers throughout Turkey.
For parties interested in attending the EVG Technology Day on October 2, 2009, please visit www.evg-techdays.com.
About Imtek Ileri Malzemeler ve Teknolojiler Ltd.
Founded in 2001, Imtek ltd. is centrally located in Ankara to support the burgeoning technology market in Turkey, working closely with research institutes and universities. Imtek is a leading supplier of cryogenic systems, semiconductor R&D equipment, and material preparation/characterization systems. In addition to providing R&D and manufacturing solutions to the region, Imtek also provides localized technical support.
The experienced technical team at Imtek supports customers by completing whole installations on-site and providing 24/7 service support to maintain high-uptime for the systems. Imtek also dedicates time for its own R&D efforts to improve its technical base. For more about Imtek, please visit www.imaltek.com.
About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.
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