Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Sematech selects Okamoto GDM 300 system for TSV process at UAlbany Nanocollege

Abstract:
SEMATECH's 3D R&D center will utilize the GDM300 backgrinder for their TSV development

Sematech selects Okamoto GDM 300 system for TSV process at UAlbany Nanocollege

ALBANY, NY | Posted on September 17th, 2009

Okamoto announced today that SEMATECH, the global consortium of chip-makers, has selected Okamoto's GDM300 Backgrinder for processing Through Silicon Via (TSV). The System, a High-Precision wafer thinning tool, will be installed in SEMATECH's 3D R&D Center at the College of Nanoscale Science and Engineering's (CNSE) world-class Albany NanoTech Complex.



After the grind process, stress release is achieved by dual high speed scanning polishing heads able to achieve +/- 5% non-uniformity. Improved die strength is achieved by simultaneously utilizing CMP and water polish. An integrated edge trimmer eliminates edge chipping and improves yield. Non-contact measurement devices enable precision thickness accuracy.



Sitaram Arkalgud, SEMATECH's 3D program director, added, "SEMATECH's 3D program is focused on enabling the manufacturability of 3D interconnects, and one of our key infrastructure requirements is a system that provides an integrated process that allows our engineers to identify and quantify the technical challenges of thinning wafer pairs to achieve damage-free bonds."



Richard Brilla, CNSE's Vice President for Strategy, Alliances and Consortia, said, "The addition of Okamoto's wafer-thinning tool will support the advanced work being done through SEMATECH's 3D program, as well as the state-of-the-art capabilities at CNSE's Albany NanoTech, which are enhancing the industry's efforts to manufacture increasingly complex nanoscale devices."



The system is designed for thin wafer applications such as TSV, bonded wafers, SOI, and MEMS. Also available optionally in a full line system for single wafer thinning are dicing frame mounting, UV curing and detaping of protective tape. DAF tape can also be applied in lieu of standard dicing tape.

####

For more information, please click here

Contacts:
Erica McGill
SEMATECH | Media Relations
257 Fuller Road | Suite 2200 | Albany, NY | 12203
o: 518-649-1041 | m: 518-487-8256

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Sandia use confined nanoparticles to improve hydrogen storage materials performance: Big changes from a small package for hydrogen storage February 25th, 2017

New nano approach could cut dose of leading HIV treatment in half February 24th, 2017

Atom-scale oxidation mechanism of nanoparticles helps develop anti-corrosion materials February 24th, 2017

Atomic force imaging used to study nematodes: KFU bionanotechnology lab (head - Dr. Rawil Fakhrullin) has obtained 3-D images of nematodes' cuticles February 23rd, 2017

Academic/Education

Nominations Invited for $250,000 Kabiller Prize in Nanoscience: Major international prize recognizes a visionary nanotechnology researcher February 20th, 2017

Oxford Nanoimaging report on how the Nanoimager, a desktop microscope delivering single molecule, super-resolution performance, is being applied at the MRC Centre for Molecular Bacteriology & Infection November 22nd, 2016

The University of Applied Sciences in Upper Austria uses Deben tensile stages as an integral part of their computed tomography research and testing facility October 18th, 2016

Enterprise In Space Partners with Sketchfab and 3D Hubs for NewSpace Education October 13th, 2016

Chip Technology

GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications: Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations February 22nd, 2017

Strem Chemicals and Dotz Nano Ltd. Sign Distribution Agreement for Graphene Quantum Dots Collaboration February 21st, 2017

Particles from outer space are wreaking low-grade havoc on personal electronics February 19th, 2017

Liquid metal nano printing set to revolutionize electronics: Creating integrated circuits just atoms thick February 18th, 2017

Announcements

Sandia use confined nanoparticles to improve hydrogen storage materials performance: Big changes from a small package for hydrogen storage February 25th, 2017

New nano approach could cut dose of leading HIV treatment in half February 24th, 2017

Atom-scale oxidation mechanism of nanoparticles helps develop anti-corrosion materials February 24th, 2017

Atomic force imaging used to study nematodes: KFU bionanotechnology lab (head - Dr. Rawil Fakhrullin) has obtained 3-D images of nematodes' cuticles February 23rd, 2017

Tools

Atomic force imaging used to study nematodes: KFU bionanotechnology lab (head - Dr. Rawil Fakhrullin) has obtained 3-D images of nematodes' cuticles February 23rd, 2017

JPK selects compact tensile stage from Deben for their NanoWizardŽ AFM platform to broaden capabilities for materials characterisation February 22nd, 2017

Molecular phenomenon discovered by advanced NMR facility: Cutting edge technology has shown a molecule self-assembling into different forms when passing between solution state to solid state, and back again - a curious phenomenon in science - says research by the University of Wa February 22nd, 2017

Strem Chemicals and Dotz Nano Ltd. Sign Distribution Agreement for Graphene Quantum Dots Collaboration February 21st, 2017

New-Contracts/Sales/Customers

JPK selects compact tensile stage from Deben for their NanoWizardŽ AFM platform to broaden capabilities for materials characterisation February 22nd, 2017

Cetim Facility Receives Bruker Contour CMM Dimensional Analysis System: New Optical Coordinate Measurement Technology Enables High-Precision 3D Scanning November 16th, 2016

Industrial Nanotech, Inc. Announces Plans to Spin Off New Product Line to Major Paint Compan November 9th, 2016

Leti Provides New Low-noise Image Technology to French SME PYXALIS; Will Be Demonstrated at Vision 2016 in Stuttgart November 3rd, 2016

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project