Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH at UAlbany NanoCollege

Abstract:
SEMATECH Will Perform Innovative 3D Applications at CNSE's Albany NanoTech with SET's High Accuracy FC300 System

SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH at UAlbany NanoCollege

Albany, NY and Saint Jeoire, France | Posted on September 1st, 2009

SET, Smart Equipment Technology, a wholly owned subsidiary of Replisaurus Technologies, has received an order for its high accuracy and high force Device Bonder FC300 from SEMATECH, the global consortium of semiconductor manufacturers. The order was booked earlier this year and the delivery of the machine is scheduled for the end of 2009 at SEMATECH's 3D R&D Center at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex in Albany, N.Y.

"Our comprehensive program is aimed at enabling the manufacturability of 3D interconnects, and will benefit from this versatile platform that addresses the broad spectrum of our member companies' bonding requirements," said Sitaram Arkalgud, SEMATECH's 3D program director.

"As the SEMATECH-CNSE partnership continues to drive innovative solutions for next-generation nanodevice manufacturing, the addition of SET's bonding system will support that effort," added Richard Brilla, CNSE vice president for Strategy, Alliances and Consortia. "At the same time, the enhanced capabilities at CNSE's world-class Albany NanoTech Complex will further enable the leading-edge research and development that is critical to our global corporate partners."

The FC300 is a new generation of high accuracy (0.5 µm), high force (4,000N) device bonder for wafers diameters up to 300 mm. It can be equipped with an optional built-in chamber for collective reflow in a gas or vacuum environment. The FC300 also features nanoimprinting capabilities.

In the frame of its 3D integration program, SEMATECH will explore three-dimensional technology and design for applications in various domains. The technology research using the FC300 focuses mainly on die-to-wafer bonding applications. Other processes such as die-to-die bonding will be explored in the future.

The system ordered encompasses an ultrasonic bonding head and a high force bonding head equipped with a confinement chamber that reduces oxide on bumps and bonding pads. This configuration is especially interesting for Cu-Cu bonding applicable to 3D-Ics integration.

The FC300 has unrivalled versatility, and is able to perform various applications on the same platform with a quick process head reconfiguration:

- High Force Bonding Head, adapted to the thermo-compression bonding process.

- Low Force Bonding Head, for reflow bonding of all sorts of components, including RF & Optoelectronics device assembly.

- UV-curing Head for adhesive bonding using the UV-NIL process, etc.

"SET is proud of confirming its leadership position within the industry by providing cutting-edge bonding solutions to major players like SEMATECH. By working closely with our customers, SET has raised process development and flexibility of its equipment to the highest level," said Gilbert Lecarpentier, SET business development manager.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About CNSE

The Ualbany CNSE is the first college in the world dedicated to education, research, development, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. CNSE’s Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world. With over $5 billion in high-tech investments, the 800,000-square-foot complex attracts corporate partners from around the world and offers students a one-of-a-kind academic experience. The Ualbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet of Class 1 capable cleanrooms. More than 2,500 scientists, researchers, engineers, students, and faculty work on site at CNSE’s Albany NanoTech, from companies including IBM, AMD, GlobalFoundries, SEMATECH, Toshiba, Applied Materials, Tokyo Electron, ASML, Vistec Lithography and Atotech. For more information, visit www.cnse.albany.edu.

About SET

SET, Smart Equipment Technology is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder, through the automated FC150 and FC300 to the production FC250, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. Further information on the FC300 is available on www.set-sas.fr.

For more information, please click here

Contacts:
SEMATECH contact:
Erica McGill
Media Relations
Phone: (518) 649-1041


CNSE contact:
Steve Janack
Vice President for Marketing and Communications
Phone: (518) 956-7322


SET contact:
Gilbert Lecarpentier
Business Development Manager
Phone: +33 (0) 686 28 1224

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Springer and Tsinghua University Press present the second Nano Research Award: Paul Alivisatos of the University of California Berkeley receives the honor for outstanding contributions in nanoscience July 30th, 2015

European Technology Platform for Nanomedicine and ENATRANS European Consortium Launch the 2nd edition of the Nanomedicine Award: The Award to be presented at BIO-Europe conference in Munich, November 2015 July 30th, 2015

Take a trip through the brain July 30th, 2015

This could replace your silicon computer chips: A new semiconductor material made from black phosphorus may be a candidate to replace silicon in future tech July 30th, 2015

Chip Technology

This could replace your silicon computer chips: A new semiconductor material made from black phosphorus may be a candidate to replace silicon in future tech July 30th, 2015

March 2016; 6th Int'l Conference on Nanostructures in Iran July 29th, 2015

Meet the high-performance single-molecule diode: Major milestone in molecular electronics scored by Berkeley Lab and Columbia University team July 29th, 2015

Short wavelength plasmons observed in nanotubes: Berkeley Lab researchers create Ludinger liquid plasmons in metallic SWNTs July 28th, 2015

Nanoelectronics

Superfast fluorescence sets new speed record: Plasmonic device has speed and efficiency to serve optical computers July 27th, 2015

Spintronics: Molecules stabilizing magnetism: Organic molecules fixing the magnetic orientation of a cobalt surface/ building block for a compact and low-cost storage technology/ publication in Nature Materials July 25th, 2015

ORNL researchers make scalable arrays of 'building blocks' for ultrathin electronics July 22nd, 2015

An easy, scalable and direct method for synthesizing graphene in silicon microelectronics: Korean researchers grow 4-inch diameter, high-quality, multi-layer graphene on desired silicon substrates, an important step for harnessing graphene in commercial silicon microelectronics July 21st, 2015

Announcements

Take a trip through the brain July 30th, 2015

This could replace your silicon computer chips: A new semiconductor material made from black phosphorus may be a candidate to replace silicon in future tech July 30th, 2015

Sol-gel capacitor dielectric offers record-high energy storage July 30th, 2015

Controlling Dynamic Behavior of Carbon Nanosheets in Structures Made Possible July 30th, 2015

Tools

Take a trip through the brain July 30th, 2015

Publication on Atomic Force Microscopy based nanoscale IR Spectroscopy (AFM-IR) persists as a 2015 top downloaded paper July 29th, 2015

Nanometrics Announces Upcoming Investor Events July 28th, 2015

Reshaping the solar spectrum to turn light to electricity: UC Riverside researchers find a way to use the infrared region of the sun's spectrum to make solar cells more efficient July 27th, 2015

New-Contracts/Sales/Customers

Liquipel Debuts Eyesight-Saving ION-Glass Blue Light Protection for iPhones and Androids at RadioShack Stores Nationwide: Liquipel's Unique Protective Screen, Available at RadioShack, Cuts Harmful Blue Light Implicated in Macular Degeneration by 10x July 28th, 2015

Dais Analytic's Business Affiliate in China Announces Ten-Year Strategic Energy Efficiency Business Arrangement With COFCO: Dais Beijing to Perform Feasibility Study on Over 80 Buildings to Improve Efficiencies as Part of Overall Hotel Energy-Savings Project July 23rd, 2015

Renishaw adds Raman analysis to Scanning Electron Microscopy at the University of Sydney, Australia July 9th, 2015

Oxford Instruments’ TritonXL Cryofree dilution refrigerator selected for the Oxford NQIT Quantum Technology Hub project June 30th, 2015

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project