Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH at UAlbany NanoCollege

Abstract:
SEMATECH Will Perform Innovative 3D Applications at CNSE's Albany NanoTech with SET's High Accuracy FC300 System

SET Receives Strategic Wafer Level Packaging Equipment Order from SEMATECH at UAlbany NanoCollege

Albany, NY and Saint Jeoire, France | Posted on September 1st, 2009

SET, Smart Equipment Technology, a wholly owned subsidiary of Replisaurus Technologies, has received an order for its high accuracy and high force Device Bonder FC300 from SEMATECH, the global consortium of semiconductor manufacturers. The order was booked earlier this year and the delivery of the machine is scheduled for the end of 2009 at SEMATECH's 3D R&D Center at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex in Albany, N.Y.

"Our comprehensive program is aimed at enabling the manufacturability of 3D interconnects, and will benefit from this versatile platform that addresses the broad spectrum of our member companies' bonding requirements," said Sitaram Arkalgud, SEMATECH's 3D program director.

"As the SEMATECH-CNSE partnership continues to drive innovative solutions for next-generation nanodevice manufacturing, the addition of SET's bonding system will support that effort," added Richard Brilla, CNSE vice president for Strategy, Alliances and Consortia. "At the same time, the enhanced capabilities at CNSE's world-class Albany NanoTech Complex will further enable the leading-edge research and development that is critical to our global corporate partners."

The FC300 is a new generation of high accuracy (0.5 µm), high force (4,000N) device bonder for wafers diameters up to 300 mm. It can be equipped with an optional built-in chamber for collective reflow in a gas or vacuum environment. The FC300 also features nanoimprinting capabilities.

In the frame of its 3D integration program, SEMATECH will explore three-dimensional technology and design for applications in various domains. The technology research using the FC300 focuses mainly on die-to-wafer bonding applications. Other processes such as die-to-die bonding will be explored in the future.

The system ordered encompasses an ultrasonic bonding head and a high force bonding head equipped with a confinement chamber that reduces oxide on bumps and bonding pads. This configuration is especially interesting for Cu-Cu bonding applicable to 3D-Ics integration.

The FC300 has unrivalled versatility, and is able to perform various applications on the same platform with a quick process head reconfiguration:

- High Force Bonding Head, adapted to the thermo-compression bonding process.

- Low Force Bonding Head, for reflow bonding of all sorts of components, including RF & Optoelectronics device assembly.

- UV-curing Head for adhesive bonding using the UV-NIL process, etc.

"SET is proud of confirming its leadership position within the industry by providing cutting-edge bonding solutions to major players like SEMATECH. By working closely with our customers, SET has raised process development and flexibility of its equipment to the highest level," said Gilbert Lecarpentier, SET business development manager.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About CNSE

The Ualbany CNSE is the first college in the world dedicated to education, research, development, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. CNSE’s Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world. With over $5 billion in high-tech investments, the 800,000-square-foot complex attracts corporate partners from around the world and offers students a one-of-a-kind academic experience. The Ualbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet of Class 1 capable cleanrooms. More than 2,500 scientists, researchers, engineers, students, and faculty work on site at CNSE’s Albany NanoTech, from companies including IBM, AMD, GlobalFoundries, SEMATECH, Toshiba, Applied Materials, Tokyo Electron, ASML, Vistec Lithography and Atotech. For more information, visit www.cnse.albany.edu.

About SET

SET, Smart Equipment Technology is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder, through the automated FC150 and FC300 to the production FC250, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm. Further information on the FC300 is available on www.set-sas.fr.

For more information, please click here

Contacts:
SEMATECH contact:
Erica McGill
Media Relations
Phone: (518) 649-1041


CNSE contact:
Steve Janack
Vice President for Marketing and Communications
Phone: (518) 956-7322


SET contact:
Gilbert Lecarpentier
Business Development Manager
Phone: +33 (0) 686 28 1224

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Sirrus's Issued Patent Portfolio Continues To Accelerate July 18th, 2018

FEFU scientists reported on toxicity of carbon and silicon nanotubes and carbon nanofibers: Nanoparticles with a wide range of applying, including medicine, damage cells of microalgae Heterosigma akashivo badly. July 18th, 2018

In borophene, boundaries are no barrier: Rice U., Northwestern researchers make and test atom-thick boron's unique domains July 17th, 2018

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits July 16th, 2018

Chip Technology

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits July 16th, 2018

Nanometrics to Announce Second Quarter Financial Results on July 31, 2018 July 12th, 2018

Leti and Soitec Launch a New Substrate Innovation Center to Develop Engineered Substrate Solutions: Industry-inclusive hub promotes early collaboration and learning from substrate to system level July 11th, 2018

GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX® Technology : With 50 client designs and growing, 22FDX proves its value as a cost-effective solution for power-sensitive applications July 9th, 2018

Nanoelectronics

GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX® Technology : With 50 client designs and growing, 22FDX proves its value as a cost-effective solution for power-sensitive applications July 9th, 2018

High-power electronics keep their cool with new heat-conducting crystals July 6th, 2018

Leti Presenting Strategic Vision and Hosting a Workshop at SEMICON West: “From Electrons to Photons” Leti Workshop and CEO Media Briefing Set for Tuesday, July 10 in W Hotel, San Francisco June 12th, 2018

Quantum Interference May Be Key to Smaller Insulators: Breakthrough could jumpstart further miniaturization of transistors June 6th, 2018

Announcements

Sirrus's Issued Patent Portfolio Continues To Accelerate July 18th, 2018

FEFU scientists reported on toxicity of carbon and silicon nanotubes and carbon nanofibers: Nanoparticles with a wide range of applying, including medicine, damage cells of microalgae Heterosigma akashivo badly. July 18th, 2018

In borophene, boundaries are no barrier: Rice U., Northwestern researchers make and test atom-thick boron's unique domains July 17th, 2018

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits July 16th, 2018

Tools

Oxford Instruments’ 22 Tesla superconducting magnet system commissioned at the UAM, making it the most intense magnetic field available outside a large international facility July 12th, 2018

Nanometrics to Announce Second Quarter Financial Results on July 31, 2018 July 12th, 2018

Nanometrics to Participate in the 10th Annual CEO Investor Summit 2018: Accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2018 in San Francisco June 28th, 2018

The Institute of Applied Physics at the University of Tsukuba near Tokyo in Japan uses Deben's ARM2 detector to better understand catalytic reaction mechanisms June 27th, 2018

New-Contracts/Sales/Customers

Barium ruthenate: A high-yield, easy-to-handle perovskite catalyst for the oxidation of sulfides July 13th, 2018

Oxford Instruments’ 22 Tesla superconducting magnet system commissioned at the UAM, making it the most intense magnetic field available outside a large international facility July 12th, 2018

The first PE blown films with nanotubes hit the Chinese market April 26th, 2018

Deep Space Industries to provide Comet satellite propulsion for BlackSky, LeoStella April 3rd, 2018

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project