Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

android tablet pc

Home > Press > EV Group to Collaborate with Applied Materials On Thin Wafer Bonding Technology for 3D IC Development

EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in three-dimensional integrated circuit (3D IC) packaging applications. The two companies will be working together as members of the EMC-3D Semiconductor 3D Equipment and Materials Consortium.

EV Group to Collaborate with Applied Materials On Thin Wafer Bonding Technology for 3D IC Development

St. Florian, Austria | Posted on July 16th, 2009

Growing consumer demand for smaller, lower-power electronic devices with greater functionality is driving the need for TSV technology - a new approach to increase packaging density by vertically stacking chips. However, while conventional ICs use wafers approximately 750-um thick, 3D ICs require thinner wafers of about 100 um or less. Processed by themselves, these paper-thin wafers lose structural and edge integrity in high-temperature, high-stress processes such as metallization, which poses manufacturing challenges and impacts device reliability. EVG and Applied will work together to address these issues by bonding temporary carrier wafers to device wafers prior to thinning. The carriers will support the ultra-thin device wafers during subsequent process steps and can be removed afterwards.

The collaboration will explore the use of silicon and glass carrier wafers to determine substrate stability using EVG's wafer bonding and thin-wafer handling expertise and Applied's advanced etch, CVD, PVD and CMP process systems. The goal of this effort is to yield baseline processes and recommendations for the use of carrier-mounted wafers throughout the individual process steps offered by both parties. Results from the partnership will be shared with EMC-3D member companies.

"This is a continuation of our strategy to form alliances with leading equipment suppliers such as EVG to deliver fully-characterized TSV process flows to accelerate customers' time to market," said Hans Stork, group vice president and chief technology officer of Applied's Silicon Systems Group. "We look forward to working with EVG at Applied's Maydan Technology Center in advancing this disruptive technology and expediting the adoption of TSVs for mainstream manufacturing."

"We are excited to collaborate with an industry leader like Applied, to expedite temporary bonding and debonding capabilities for 3D IC development," said Markus Wimplinger, Corporate Technology Development and IP Director at EV Group "As a co-founder of EMC-3D, EVG is committed to the consortium's mission to develop cost-effective and manufacturable TSVs for advanced semiconductors. This opportunity to work with Applied complements those efforts and brings us closer to realizing 3D IC production for our customers."

About Applied Materials

Applied Materials, Inc. is the global leader in Nanomanufacturing Technology(TM) solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panels, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live. Learn more at


About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its leading market share for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at

* CVD = chemical vapor deposition; PVD = physical vapor deposition; CMP = chemical-mechanical planarization

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

The International Space Elevator Consortium (ISEC) is proud to announce the 2014 Space Elevator Conference! This annual event will be held at the Museum of Flight in Seattle, Washington from Friday, August 22nd through Sunday, August 24th August 19th, 2014

KaSAM-2014 International Conference (September 7-10, 2014, Kathmandu, Nepal) August 19th, 2014

Success in Intracellular Imaging of Cesium Distribution in Plants Used for Cesium Absorption August 19th, 2014

Electrical engineers take major step toward photonic circuits: Team invents non-metallic metamaterial that enables them to 'compress' and contain light August 19th, 2014

Chip Technology

Electrical engineers take major step toward photonic circuits: Team invents non-metallic metamaterial that enables them to 'compress' and contain light August 19th, 2014

Promising Ferroelectric Materials Suffer From Unexpected Electric Polarizations: Brookhaven Lab scientists find surprising locked charge polarizations that impede performance in next-gen materials that could otherwise revolutionize data-driven devices August 18th, 2014

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption August 15th, 2014

Iranian Scientists Stabilize Protein on Highly Stable Electrode Surface August 14th, 2014


Сalculations with Nanoscale Smart Particles August 19th, 2014

Life on Mars? Implications of a newly discovered mineral-rich structure August 19th, 2014

Harris & Harris Group Letter to Shareholders on Website August 19th, 2014

Electrical engineers take major step toward photonic circuits: Team invents non-metallic metamaterial that enables them to 'compress' and contain light August 19th, 2014


SouthWest NanoTechnologies Appoints Matteson-Ridolfi for U.S. Distribution of its SMW™ Specialty Multiwall Carbon Nanotubes August 13th, 2014

Could hemp nanosheets topple graphene for making the ideal supercapacitor? August 12th, 2014

On the frontiers of cyborg science August 10th, 2014

Like cling wrap, new biomaterial can coat tricky burn wounds and block out infection August 10th, 2014

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project

© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE