Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button

Home > Press > EV Group Secures Order for 300-mm Wafer Bonder From SEMATECH's 3D Interconnect Program at UAlbany NanoCollege

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that SEMATECH, the global consortium of chipmakers, has selected EVG's fully automated 300-mm GEMINI(R) wafer bonder for enabling next-generation TSV and 3D interconnects. This order represents the industry's first fully automated 300-mm wafer bonder to integrate all four types of wafer bonding techniques into one system: thermo compression bonding, fusion bonding, temporary bonding and chip-to-wafer bonding. The EVG system will be installed in SEMATECH's 3D R&D Center at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex in Q4 2009.

EV Group Secures Order for 300-mm Wafer Bonder From SEMATECH's 3D Interconnect Program at UAlbany NanoCollege

Albany, NY and ST. FLORIAN, Austria | Posted on July 9th, 2009

With the rising demand for smaller, more functional and lower-power chips, 3D architecture is emerging as the clear approach for meeting leading-edge consumer device requirements. As collaboration on TSV/3D intensifies, barriers continue to be broken down thereby speeding industry-wide technology adoption among memory and CMOS manufacturers.

"SEMATECH has been involved in 3D research for several years, and we are committed to building a strong infrastructure to pave the way for volume production of TSVs," noted Sitaram Arkalgud, director of SEMATECH's 3D Interconnect Program. "Wafer and die bonding are key processes for 3D interconnects, and the EVG wafer bonding technology will provide various bonding capabilities that allow our researchers to aggressively address technical challenges in bonding next-generation TSVs, a critical requirement for successful introduction of 3D interconnects."

Paul Lindner, EVG's executive technology director, said, "SEMATECH has one of the world's most advanced R&D programs on 3D interconnect technology. This is a tremendous opportunity for EV Group to contribute to this top-level program, which includes the industry's leading experts throughout the 3D IC value chain. We've already achieved post-copper bond alignment results well in advance of our 2010 targets, and we look forward to this important collaboration with SEMATECH and seeing 3D technology continue to gain traction as the technology of choice for high-volume memory and CMOS manufacturers."

Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia, said, "The addition of EVG's wafer bonding technology will enhance both the leading-edge nanoelectronics research being conducted through the SEMATECH-CNSE partnership, and the world-class capabilities at CNSE's state-of-the-art Albany NanoTech Complex. The result will be accelerated development and commercialization of innovative technologies for the benefit of our corporate partners, as well as the global nanoelectronics industry."

Today, EVG's fully automated 300-mm GEMINI wafer bonder systems are used for high-volume wafer bonding applications for MEMS, 3D IC integration and advanced packaging, as well as compound semiconductor applications. The system purchased by SEMATECH is based on the flexible, field-proven GEMINI platform and integrates the company's SmartViewNT series announced in December 2008. Up until now, room-temperature fusion bonding and high-temperature, high-force thermo compression bonding were processed on two separate tools. This next-generation design can combine all of these bonding capabilities into one system for maximum R&D flexibility. Alternatively, it can be configured for a specific process flow to maximize productivity in a manufacturing environment.

Both Lindner and Arkalgud are panelists on the BrightSpots(SM) 3D IC Forum, a unique three-weeklong online discussion on 3D IC developments. The panel is now live and will conclude Friday, July 24, 2009. To join the discussion or find out what the experts are saying, visit www.semineedle.com/MCA3DIC. You can also follow BrightSpots activities on Twitter at #MCA3DIC.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at www.EVGroup.com.

About SEMATECH

For over 20 years, SEMATECH(R) (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About CNSE

The UAlbany CNSE is the first college in the world dedicated to education, research, development, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. CNSE's Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world. With over $5 billion in high-tech investments, the 800,000-square-foot complex attracts corporate partners from around the world and offers students a one-of-a-kind academic experience. The UAlbany NanoCollege houses the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet of Class 1 capable cleanrooms. More than 2,500 scientists, researchers, engineers, students, and faculty work on site at CNSE's Albany NanoTech, from companies including IBM, AMD, GlobalFoundries, SEMATECH, Toshiba, Applied Materials, Tokyo Electron, ASML, Vistec Lithography and Atotech. For more information, visit www.cnse.albany.edu.

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

New flexible material can make any window 'smart' August 23rd, 2016

University of Puerto Rico and NASA back in the news – XEI reports August 23rd, 2016

Nanoparticles that speed blood clotting may someday save lives August 23rd, 2016

Spider silk: Mother Nature's bio-superlens August 22nd, 2016

Academic/Education

Nanotech Security Featured by Simon Fraser University: Company's Anti-Counterfeiting Technology Developed With the Help of University's 4D LABS Materials Research Institute August 21st, 2016

W.M. Keck Foundation awards Cal State LA a $375,000 research and education grant August 4th, 2016

Thomas Swan and NGI announce unique partnership July 28th, 2016

The NanoWizard® AFM from JPK is applied for interdisciplinary research at the University of South Australia for applications including smart wound healing and how plants can protect themselves from toxins July 26th, 2016

Chip Technology

Down to the wire: ONR researchers and new bacteria August 18th, 2016

Hexagonal boron nitride semiconductors enable cost-effective detection of neutron signals: Texas Tech University researchers demonstrate hexagonal boron nitride semiconductors as a cost-effective alternative for inspecting overseas cargo containers entering US ports August 17th, 2016

Enhanced electron doping on iron superconductors discovered: IBS Centre for Correlated Electron Systems revises existing theories by raising the temperature for superconductivity August 17th, 2016

See-through circuitry: New method makes AZO a viable and cheap alternative for transparent electronics August 15th, 2016

Announcements

New flexible material can make any window 'smart' August 23rd, 2016

University of Puerto Rico and NASA back in the news – XEI reports August 23rd, 2016

Nanoparticles that speed blood clotting may someday save lives August 23rd, 2016

Researchers reduce expensive noble metals for fuel cell reactions August 22nd, 2016

Tools

University of Puerto Rico and NASA back in the news – XEI reports August 23rd, 2016

Spider silk: Mother Nature's bio-superlens August 22nd, 2016

Tracing barnacle's footprint August 19th, 2016

XEI Scientific celebrates its Silver Anniversary August 16th, 2016

New-Contracts/Sales/Customers

Thomas Swan and NGI announce unique partnership July 28th, 2016

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Nanometrics Selected for Third-Generation 3D-NAND Process Control: Atlas® Systems Extend Advanced Device Manufacturing Capability June 14th, 2016

Industrial Nanotech, Inc. Signs Agreement With and Receives First Purchase Order from Major New Customer in China June 6th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic