Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Alchimer Introduces Cost-saving AquiViaTM Deposition Process For Advanced TSV Metallization

Abstract:
AquiVia Allows Customers to Achieve Conformal Coverage of High Aspect Ratio Vias Of 18:1 and Beyond with Little or No New Capital Investment

Alchimer Introduces Cost-saving AquiViaTM Deposition Process For Advanced TSV Metallization

MASSY, France | Posted on July 9th, 2009

Alchimer S.A., a leading provider of cost-saving coating processes for interconnections in advanced 3D-packaging applications, announced today that its cost-saving AquiVia™ deposition process is ready for implementation. The AquiVia process can reduce overall cost of ownership for through-silicon via (TSV) metallization by up to 65 percent vs. conventional dry processes.

AquiVia combines, for the first time, wet deposition processes for insulation, barrier, and seed layers in TSV metallization. This unique full stack approach utilizes Alchimer's proprietary Electrografting (eG™) and Chemicalgrafting (cG™) technology to create strong covalent bonds between each layer. This results in highly conformal and uniform layers for TSVs with aspect ratios of 18:1 and beyond, even on the highly scalloped TSV etch profiles produced by the DRIE/Bosch process.

Moreover, AquiVia enables customers to use existing plating equipment for the deposition of insulation, barrier and seed layers. This process completely eliminates all dry processing techniques from TSV metallization, cutting the cost of ownership of the via stack metallization by up to two-thirds.

"The introduction of the integrated AquiVia process significantly increases the cost-of-ownership benefits of Alchimer technologies in a difficult global economic market," said CEO Steve Lerner. "AquiVia allows customers to achieve extremely high aspect ratio vias with minimal, if any, new capital investment. The growing understanding of these advantages is reflected in the customer interest and customer revenues we are seeing."

Electrografting, Alchimer's breakthrough proprietary deposition technology, is based upon specific organic precursors that enable ultra-conformal deposition of dielectric and conductive nanometric films using aqueous chemistries. AquiVia allows lower processing temperatures compared to conventional dry processes. In addition, the polymer-based insulating layer is inherently compliant, which is beneficial in providing stress relief within the TSV structures.

Alchimer also recently announced the enhancement of its eG ViaCoat™ process for the copper seed metallization of TSVs. The eG ViaCoat process, one of three components of the overall AquiVia process, achieves levels of uniformity that meet or exceed standard industry quality metrics using legacy plating equipment without retrofits or modifications.

####

About Alchimer S.A.
Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films used in both semiconductor interconnects and 3D TSVs (through-silicon vias). The company’s breakthrough technology, Electrografting (eG™), is an electrochemical-based process that enables the growth of very thin coatings, of various types, on both conducting and semiconducting surfaces. Based in Massy, France, Alchimer is a spin-off from the Commissariat à l’Energie Atomique (CEA). Founded in 2001, it won the First National Award for the Creation of High Tech Companies from the French Minister of Research and Industry and is a Red Herring Top 100 European Company.

For more information, please click here

Contacts:
Kathy Cook
Alchimer
Director of Business Development
Phone: +1 214 649 6153


Sarah-Lyle Dampoux
Loomis Group
Phone: +33 1 58 18 59 30

Copyright © Alchimer S.A.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Researchers develop artificial building blocks of life March 8th, 2024

How surface roughness influences the adhesion of soft materials: Research team discovers universal mechanism that leads to adhesion hysteresis in soft materials March 8th, 2024

Two-dimensional bimetallic selenium-containing metal-organic frameworks and their calcinated derivatives as electrocatalysts for overall water splitting March 8th, 2024

Curcumin nanoemulsion is tested for treatment of intestinal inflammation: A formulation developed by Brazilian researchers proved effective in tests involving mice March 8th, 2024

Chip Technology

New chip opens door to AI computing at light speed February 16th, 2024

HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024

Electrons screen against conductivity-killer in organic semiconductors: The discovery is the first step towards creating effective organic semiconductors, which use significantly less water and energy, and produce far less waste than their inorganic counterparts February 16th, 2024

NRL discovers two-dimensional waveguides February 16th, 2024

Announcements

What heat can tell us about battery chemistry: using the Peltier effect to study lithium-ion cells March 8th, 2024

Curcumin nanoemulsion is tested for treatment of intestinal inflammation: A formulation developed by Brazilian researchers proved effective in tests involving mice March 8th, 2024

The Access to Advanced Health Institute receives up to $12.7 million to develop novel nanoalum adjuvant formulation for better protection against tuberculosis and pandemic influenza March 8th, 2024

Nanoscale CL thermometry with lanthanide-doped heavy-metal oxide in TEM March 8th, 2024

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project