Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > STMicroelectronics and Soitec Join Forces to Develop Next-Generation Technology for CMOS Image Sensors

Abstract:
ST and Soitec cooperation will lead to backside-illumination (BSI) product manufacturing for mobile consumer markets

STMicroelectronics and Soitec Join Forces to Develop Next-Generation Technology for CMOS Image Sensors

GRENOBLE, France | Posted on May 13th, 2009

STMicroelectronics (NYSE: STM), one of the world's leading semiconductor companies and a world leader in CMOS imaging technology, and Soitec (Euronext: SOI), the world's leading supplier of engineered substrates, today announced an exclusive joint cooperation between the two companies that will lead to the development of 300mm wafer-level backside-illumination (BSI) technology for next-generation image sensors in consumer products.

The resolution of today's leading-edge image sensors is continuously increasing, while demand is high for the overall reduction of the camera-module footprint, particularly in consumer markets. This means the necessary development of smaller individual pixel sizes, while maintaining pixel sensitivity to produce high-quality images. Backside illumination is a key enabling technology to meet this challenge in the development of next-generation image sensors.

The agreement between the two companies includes the licensing by Soitec to ST of the Smart Stacking(TM) bonding technology for the manufacturing of backside-illumination sensors on 300mm wafers. This technology, developed by Soitec's Tracit business unit, leverages molecular bonding, and mechanical, as well as chemical thinning. ST will develop a new generation of image sensors based on its advanced derivative-CMOS process technology at 65nm and beyond, at its 300mm facility in Crolles, France. In combination with ST's advanced wafer-level manufacturing capabilities, the Smart Stacking technology will enable ST to increase its leadership in developing and supplying high-performance image sensors for mobile consumer products.

"Backside illumination technology is a key ingredient in the small-pixel, high-image-quality race for the development of leading-edge image sensors," said Eric Aussedat, Group Vice President and General Manager, Imaging Division, STMicroelectronics. "Partnering with Soitec will help quickly deploy the Smart Stacking technology into ST's camera products. This agreement will accelerate the development of advanced and superior cost-competitive image-sensor processes, and further confirms the Grenoble region as a world-class center of expertise for advanced CMOS imaging technologies."

"We are very pleased that STMicroelectronics has chosen our Smart Stacking technology for their BSI product," said Andre-Jacques Auberton-Herve, chairman and president of the Soitec Group. "This technology developed by our Tracit business unit, supports fast implementation of advanced processes involving substrate engineering and 3D integration. We are glad to support ST's commitment to innovation for the benefit of their customers."

####

About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company's net revenues were $9.84 billion.

About Soitec

Soitec is the world's leading supplier of engineered substrates for advanced microelectronics. The Group produces a wide range of advanced materials, especially silicon-on-insulator (SOI) wafers based on its Smart Cut(TM) technology -- the first high-volume application for this proprietary technology. SOI is currently seen as the platform of the future, paving the way to higher-performance, faster, and more economical chips. Soitec currently produces over 80% of SOI wafers. Headquartered at Bernin in France, with two high-volume production units on site, Soitec also has offices in the US, Japan, and Taiwan, and a new production site is in the process of customer qualification in Singapore. Two other business units : Picogiga International (Les Ulis) and Tracit Technologies (Bernin). Picogiga delivers advanced substrates solutions, including III-V epiwafers and gallium nitride (GaN) wafers, to the compound material world for the manufacture of high-frequency electronics and other optoelectronic devices. Tracit, on the other hand, provides thin-film layer transfer technologies used to manufacture engineered substrates for power ICs and microsystems, as well as generic circuit transfer technology, Smart Stacking(TM) for applications such as image sensors and 3D integration. Shares for the Soitec Group are listed on Euronext Paris.

More information is available at www.soitec.com

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

Canadian physicists discover new properties of superconductivity February 8th, 2016

Leading bugs to the death chamber: A kinder face of cholesterol February 8th, 2016

From allergens to anodes: Pollen derived battery electrodes February 8th, 2016

Chip Technology

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

The iron stepping stones to better wearable tech without semiconductors February 8th, 2016

Organic crystals allow creating flexible electronic devices: The researchers from the Faculty of Physics of the Moscow State University have grown organic crystals that allow creating flexible electronic devices February 5th, 2016

Scientists guide gold nanoparticles to form 'diamond' superlattices: DNA scaffolds cage and coax nanoparticles into position to form crystalline arrangements that mimic the atomic structure of diamond February 4th, 2016

Sensors

Scientists have put a high precision blood assay into a simple test strip: Researchers have developed a new biosensor test system based on magnetic nanoparticles February 3rd, 2016

Nanosheet growth technique could revolutionize nanomaterial production February 1st, 2016

New record in nanoelectronics at ultralow temperatures January 28th, 2016

NBC LEARN DEBUTS SIX-PART VIDEO SERIES, “NANOTECHNOLOGY: SUPER SMALL SCIENCE” Produced by NBC Learn in partnership with the National Science Foundation, and narrated by NBC News/MSNBC’s Kate Snow, series highlights leading research in nanotechnology January 25th, 2016

Announcements

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

Canadian physicists discover new properties of superconductivity February 8th, 2016

Leading bugs to the death chamber: A kinder face of cholesterol February 8th, 2016

From allergens to anodes: Pollen derived battery electrodes February 8th, 2016

Alliances/Trade associations/Partnerships/Distributorships

Vesper Collaborates with GLOBALFOUNDRIES to Deliver First Piezoelectric MEMS Microphones: Acoustic sensing company works with top foundry to support mass-market consumer products January 21st, 2016

Imec and Cloudtag Collaborate on High Quality Frictionless Wearables for Lifestyle Coaching: Next-generation health and fitness tracker Cloudtag TrackTM launched at CES 2016 January 7th, 2016

Technical partnership at the top – Oxford Instruments and Zurich Instruments announce a technical collaboration for low temperature physics January 7th, 2016

Production of Graphene Oxide Nanosheets to Economize Fuel Cells January 1st, 2016

Research partnerships

Scientists take key step toward custom-made nanoscale chemical factories: Berkeley Lab researchers part of team that creates new function in tiny protein shell structures February 6th, 2016

Polar vortices observed in ferroelectric: New state of matter holds promise for ultracompact data storage and processing February 4th, 2016

Spin dynamics in an atomically thin semi-conductor February 1st, 2016

Graphene shown to safely interact with neurons in the brain January 31st, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic