Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Cadence Encounter Digital Implementation System Used by Gennum's Snowbush IP Group to Speed Delivery of Industry's First 45nm USB 3.0 PHY IP

Abstract:
Encounter Technology Accelerates Transition to 45- and 40-Nanometer Low-Power Design at Multiple Foundries; Speeds Delivery of First-Pass Silicon Success

Cadence Encounter Digital Implementation System Used by Gennum's Snowbush IP Group to Speed Delivery of Industry's First 45nm USB 3.0 PHY IP

San Jose, CA | Posted on May 7th, 2009

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced today that Gennum Corporation's (TSX: GND) Snowbush IP Group utilized the Cadence® Encounter® Digital Implementation System to develop the industry's first 45-nanometer SuperSpeed USB 3.0 PHY IP core. Encounter was used for timing closure and layout on the digital portion of the PHY. Introduced in March, the new IP from Gennum's Snowbush IP Group features an integrated USB 3.0 PHY and controller IP with a 5-gigabit per second (Gb/s) transfer rate in each direction. The Encounter Digital Implementation System helped Gennum's Snowbush IP design team quickly target the digital portion of the PHY to advanced 45- and 40-nanometer process technologies at multiple foundries, further expanding its market potential.

"The high-speed timing constraints of the PCS layer of the new USB 3.0 PHY require the highly capable design methodology offered by Encounter," said John Wilby, director of engineering-PHY, for the Snowbush IP Group at Gennum. "The move from a competitor's design environment to the Cadence Encounter Digital Implementation System took just three months from installation to first-pass silicon success. Key benefits with Encounter include its native signoff quality timing closure and support for advanced DFM rules in deep submicron technologies. In combination with low-power signoff, we also gained improved productivity, a high quality of silicon and ultimately faster time to market."

Wilby also noted that the fully integrated Encounter Digital Implementation System allowed Gennum to raise the bar on its design specifications and improve the competitive differentiation of its customizable family of IP cores through improved power savings and chip performance, reduced jitter, and optimized noise immunity.

The Encounter Digital Implementation System is a configurable and extensible high-performance, high-capacity, scalable design solution uniquely delivering flat and hierarchical design closure and signoff analysis, as well as low-power, advanced-node, and mixed-signal design solutions in a single integrated environment. The system also delivers interoperability with package, logic, and custom IC design. Cadence design-for-manufacturing (DFM) technologies are an integral part of the Encounter Digital Implementation System, enabling early identification, analysis and repair of yield-limiting design elements present at advanced nodes.

"Gennum's Snowbush IP Group has a strong track record of success, and we're pleased to play an integral role in the development of its latest high-speed family of customizable IP cores," said Chi-Ping Hsu, senior vice president of implementation research and development at Cadence. "This project was a success on multiple levels, but most notably it demonstrated that a full front-to-back design solution can be installed, ramped and used to deliver state-of-the-art advanced-node, low-power designs in a fraction of the time of previous solutions, with first-pass silicon success, lower risk, and faster time to market as the reward."

####

About Cadence Design Systems, Inc.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.

Cadence and Encounter are registered trademarks and the Cadence logo is a trademark of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

For more information, please click here

Contacts:
Dan Holden
Cadence Design Systems, Inc.
408-944-7457

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Electron's 1-D metallic surface state observed: A step for the prediction of electronic properties of extremely-fine metal nanowires in next-generation semiconductors February 9th, 2016

Nanoparticle therapy that uses LDL and fish oil kills liver cancer cells February 9th, 2016

Leading bugs to the death chamber: A kinder face of cholesterol February 8th, 2016

From allergens to anodes: Pollen derived battery electrodes February 8th, 2016

Chip Technology

Electron's 1-D metallic surface state observed: A step for the prediction of electronic properties of extremely-fine metal nanowires in next-generation semiconductors February 9th, 2016

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

The iron stepping stones to better wearable tech without semiconductors February 8th, 2016

Organic crystals allow creating flexible electronic devices: The researchers from the Faculty of Physics of the Moscow State University have grown organic crystals that allow creating flexible electronic devices February 5th, 2016

Announcements

Electron's 1-D metallic surface state observed: A step for the prediction of electronic properties of extremely-fine metal nanowires in next-generation semiconductors February 9th, 2016

Nanoparticle therapy that uses LDL and fish oil kills liver cancer cells February 9th, 2016

A fast solidification process makes material crackle February 8th, 2016

From allergens to anodes: Pollen derived battery electrodes February 8th, 2016

Tools

Chiral magnetic effect generates quantum current: Separating left- and right-handed particles in a semi-metallic material produces anomalously high conductivity February 8th, 2016

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

Researchers discover new phase of boron nitride and a new way to create pure c-BN February 5th, 2016

Cornell researchers create first self-assembled superconductor February 1st, 2016

New-Contracts/Sales/Customers

Heriot-Watt's Institute of Photonics & Quantum Sciences uses the Deben Microtest 2 kN tensile stage to characterise ceramics and engineering plastics January 21st, 2016

Industrial Nanotech, Inc. Begins Supplying One of World's Largest Pulp and Paper Product Companies with Patented Energy Saving and Protective Coatings for Heat Process Equipment January 4th, 2016

Industrial Nanotech, Inc. Announces Two More Offshore Oil and Gas Platform Projects December 9th, 2015

Nanotech Signs MOU with Leading European Manufacturer to Supply Optical Thin Film to the Banknote Market: Alliance Combines Technology and Production Capacity to Address High Volume Opportunities November 17th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic