Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Cadence Encounter Digital Implementation System Used by Gennum's Snowbush IP Group to Speed Delivery of Industry's First 45nm USB 3.0 PHY IP

Abstract:
Encounter Technology Accelerates Transition to 45- and 40-Nanometer Low-Power Design at Multiple Foundries; Speeds Delivery of First-Pass Silicon Success

Cadence Encounter Digital Implementation System Used by Gennum's Snowbush IP Group to Speed Delivery of Industry's First 45nm USB 3.0 PHY IP

San Jose, CA | Posted on May 7th, 2009

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced today that Gennum Corporation's (TSX: GND) Snowbush IP Group utilized the Cadence® Encounter® Digital Implementation System to develop the industry's first 45-nanometer SuperSpeed USB 3.0 PHY IP core. Encounter was used for timing closure and layout on the digital portion of the PHY. Introduced in March, the new IP from Gennum's Snowbush IP Group features an integrated USB 3.0 PHY and controller IP with a 5-gigabit per second (Gb/s) transfer rate in each direction. The Encounter Digital Implementation System helped Gennum's Snowbush IP design team quickly target the digital portion of the PHY to advanced 45- and 40-nanometer process technologies at multiple foundries, further expanding its market potential.

"The high-speed timing constraints of the PCS layer of the new USB 3.0 PHY require the highly capable design methodology offered by Encounter," said John Wilby, director of engineering-PHY, for the Snowbush IP Group at Gennum. "The move from a competitor's design environment to the Cadence Encounter Digital Implementation System took just three months from installation to first-pass silicon success. Key benefits with Encounter include its native signoff quality timing closure and support for advanced DFM rules in deep submicron technologies. In combination with low-power signoff, we also gained improved productivity, a high quality of silicon and ultimately faster time to market."

Wilby also noted that the fully integrated Encounter Digital Implementation System allowed Gennum to raise the bar on its design specifications and improve the competitive differentiation of its customizable family of IP cores through improved power savings and chip performance, reduced jitter, and optimized noise immunity.

The Encounter Digital Implementation System is a configurable and extensible high-performance, high-capacity, scalable design solution uniquely delivering flat and hierarchical design closure and signoff analysis, as well as low-power, advanced-node, and mixed-signal design solutions in a single integrated environment. The system also delivers interoperability with package, logic, and custom IC design. Cadence design-for-manufacturing (DFM) technologies are an integral part of the Encounter Digital Implementation System, enabling early identification, analysis and repair of yield-limiting design elements present at advanced nodes.

"Gennum's Snowbush IP Group has a strong track record of success, and we're pleased to play an integral role in the development of its latest high-speed family of customizable IP cores," said Chi-Ping Hsu, senior vice president of implementation research and development at Cadence. "This project was a success on multiple levels, but most notably it demonstrated that a full front-to-back design solution can be installed, ramped and used to deliver state-of-the-art advanced-node, low-power designs in a fraction of the time of previous solutions, with first-pass silicon success, lower risk, and faster time to market as the reward."

####

About Cadence Design Systems, Inc.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.

Cadence and Encounter are registered trademarks and the Cadence logo is a trademark of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

For more information, please click here

Contacts:
Dan Holden
Cadence Design Systems, Inc.
408-944-7457

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Seeking Nanoscale Defenses for Biological and Chemical Threats: WPI co-organizes a NATO workshop to improve the detection and decontamination of biological and chemical agents September 13th, 2014

New pricing report for bulk graphene materials September 13th, 2014

Berkeley Lab Licenses Boron Nitride Nanotube Technology: New material has unique mechanical and electronic properties September 13th, 2014

Iranian Nano Scientists Create Flame-Resistant Polymers September 13th, 2014

Chip Technology

UT Arlington research uses nanotechnology to help cool electrons with no external sources September 11th, 2014

Excitonic Dark States Shed Light on TMDC Atomic Layers: Berkeley Lab Discovery Holds Promise for Nanoelectronic and Photonic Applications September 11th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

Development of Algorithm for Accurate Calculation of Average Distance Travelled by Low-Speed Electrons without Energy Loss that Are Sensitive to Surface Structure September 11th, 2014

Announcements

Seeking Nanoscale Defenses for Biological and Chemical Threats: WPI co-organizes a NATO workshop to improve the detection and decontamination of biological and chemical agents September 13th, 2014

New pricing report for bulk graphene materials September 13th, 2014

Berkeley Lab Licenses Boron Nitride Nanotube Technology: New material has unique mechanical and electronic properties September 13th, 2014

Iranian Nano Scientists Create Flame-Resistant Polymers September 13th, 2014

Tools

Advanced Light Source Sets Microscopy Record| Berkeley Lab Researchers Achieve Highest Resolution Ever with X-ray Microscopy September 11th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

Development of Algorithm for Accurate Calculation of Average Distance Travelled by Low-Speed Electrons without Energy Loss that Are Sensitive to Surface Structure September 11th, 2014

How skin falls apart: The pathology of autoimmune skin disease is revealed at the nanoscale September 10th, 2014

New-Contracts/Sales/Customers

Fullerex: Talga Resources Joins INSCX™ Exchange September 4th, 2014

Global Energy Systems Signs Master Sales Agreement with China Aviation Supplies Group September 4th, 2014

East China University of Science and Technology Purchases Nanonex Advanced Nanoimprint Tool NX-B200 July 30th, 2014

University of Manchester selects Anasys AFM-IR for coatings and corrosion research July 30th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE