Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Léti and Brewer Science create a common laboratory for new 3-D stacking and MEMS process flows

70 µm thick wafer with medium density TSV
70 µm thick wafer with medium density TSV

Abstract:
Léti and Brewer Science, Inc. signed a common lab agreement to combine their expertise in integration and materials into ultra-thin wafer processing flows for 3 Dimensional Packaging using Brewer Science temporary adhesives. They are also collaborating in the development of photosensitive and non-photosensitive coatings for MEMS manufacturing processes.

Léti and Brewer Science create a common laboratory for new 3-D stacking and MEMS process flows

Grenoble, France | Posted on February 24th, 2009

A strengthened collaboration

In October 2007, Léti and Brewer Science began the integration of WaferBond™ materials into 3-D chip stacking process flows to achieve reliable, user friendly processes for ultra-thin wafer handling and processing. These products are of great interest in the creation of TSV's. At the end of 2008, the first full integration process was successfully completed. "We have, in a very limited time, achieved and characterized Unity Aspect Ratio vias on seventy microns thick wafers" says Nicolas Sillon, the Head of the Laboratory for advanced packaging and 3-D integration at Léti. "The developed technology based on WaferBond™ materials will accelerate the 3-D chip stacking projects we have at Léti. WaferBond™ materials have already been included in 3-D functional demonstrators delivered to key Léti partners. The results we presented at the 10th Electronics Packaging Technology Conference EPTC last December in Singapore are a world premiere" he added.

"The partnership with Léti has been extremely beneficial in achieving these successes", says Tony Flaim, Chief Technology Officer at Brewer Science, Inc. "Léti works as a true partner, so we have jointly decided to strengthen and extend our collaboration in the framework of a 3-year, common lab." Under this agreement, leading edge Brewer Science specialty products will be used in 3-D integration and MEMS process flows.

More functionality, less space, lower cost

Focus will be on development and integration of photosensitive and non-photosensitive coatings into MEMS manufacturing processes, where high aspect ratios are mandatory, and on organic coating layers for advanced KrF and ArF photoresist processes. "Introducing advanced, tailored products will provide a very competitive advantage in the development of innovative technologies for MEMS, their packaging and their integration--the key core competencies of our department" adds André Rouzaud, Deputy VP Microsystems at Léti.

"3-D Packaging is becoming the next enabler in the industry's quest to achieve more functionality in less space for lower cost", asserts Lori Nye, Executive Director Marketing at Brewer Science. "And, new MEMS technologies provide automated interaction with the environment around us." The expanded effort between Léti and Brewer Science in the common lab will facilitate new breakthroughs.

####

About Brewer Science
Brewer Science delivers innovative coating solutions for applications, including lithography, advanced packaging, MEMS, nanotechnology, optoelectronics and compound semiconductors. The inventor of the ARC® (anti-reflective coatings) products for the microlithography world, we continue to expand our scope with ProTEK® temporary etch protective coatings, WaferBOND™ temporary bonding materials, and microelectronics-grade carbon nanotube solutions. Exceptional technical expertise and extensive semiconductor industry knowledge, combined with our world-class product and customer support, make Brewer Science a company that continually enhances value to the entire electronics industry.


About CEA-LETI:

CEA-LETI, the Laboratory for Electronics & Information Technology is operated by Direction de la Recherche Technologique at CEA, the French Atomic Energy Commission. It mainly aims at helping companies to increase their competitiveness through technological innovation and transfer of its technical know-how to industry. Major player in the MINATEC Micro-Nano technologies innovation center, CEA-LETI benefits from 8000 m2 state-of-the-art clean rooms, with equipment worth some 160 million euros. It is currently employing some 1600 people among whom 1100 CEA employees and co-workers of various status including 100 people from industrial partners, working in the CEA-LETI premises within the framework of bilateral collaborations. Overall, research contracts with industry are worth 75% of CEA-LETI annual income. It has a very important patents portfolio, and filed last year more than 200 patents and 700 publications. The laboratory is structured into six departments, with a specific department operating 24-7 the technological facilities of the silicon technology platform, and five program-oriented programs covering the field of microelectronics, microsystems, optronics, sytem design and telco, and technologies for bio and health. For more information, visit www.leti.fr

For more information, please click here

Contacts:
CEA-LETI
Clément Moulet
Press Officer
Tel: +334.38.78.03.26


Brewer Science
Doyle Edwards
Marketing Communications
Tel: +1-573-364-0300

Copyright © Brewer Science

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Feynman Prize Winners Announced! April 26th, 2015

New ASTM Standards Will Help Educate Present and Future Nanotechnology Workforces April 26th, 2015

Heat makes electrons’ spin in magnetic superconductors April 26th, 2015

QD Vision Wins 2015 Bronze Edison Award for Color IQ™ Quantum Dot Technology April 26th, 2015

MEMS

Phonons, arise! Small electric voltage alters conductivity in key materials April 22nd, 2015

Iranian Scientists Evaluate Dynamic Interaction between 2 Carbon Nanotubes April 14th, 2015

ASIC Development for MEMS Applications: A Platform Approach March 25th, 2015

STMicroelectronics Executive Vice-President Benedetto Vigna Awarded IEEE Frederik Philips Award March 12th, 2015

Chip Technology

Surface matters: Huge reduction of heat conduction observed in flat silicon channels April 23rd, 2015

Drexel materials scientists putting a new spin on computing memory April 22nd, 2015

Printing Silicon on Paper, with Lasers April 21st, 2015

Advances in molecular electronics: Lights on -- molecule on: Researchers from Dresden and Konstanz succeed in light-controlled molecule switching April 20th, 2015

Announcements

Feynman Prize Winners Announced! April 26th, 2015

New ASTM Standards Will Help Educate Present and Future Nanotechnology Workforces April 26th, 2015

Heat makes electrons’ spin in magnetic superconductors April 26th, 2015

QD Vision Wins 2015 Bronze Edison Award for Color IQ™ Quantum Dot Technology April 26th, 2015

Alliances/Partnerships/Distributorships

How can you see an atom? (video) April 10th, 2015

FibeRio and VF Corporation Form Strategic Partnership to Lead the Apparel and Footwear Markets in Nanofiber Technology April 8th, 2015

UK National Graphene Institute Selects Bruker as Official Partner: World-Leading Graphene Research Facility Purchases Multiple Bruker AFMs April 7th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project