Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > New silver-based ink has applications in electronics, researchers say

Abstract:
A new ink developed by researchers at the University of Illinois allows them to write their own silver linings.

The ink, composed of silver nanoparticles, can be used in electronic and optoelectronic applications to create flexible, stretchable and spanning microelectrodes that carry signals from one circuit element to another. The printed microelectrodes can withstand repeated bending and stretching with minimal change in their electrical properties.

New silver-based ink has applications in electronics, researchers say

Champaign, IL | Posted on February 12th, 2009

In a paper to be published Feb. 12, by Science Express, the online version of the journal Science, Jennifer Lewis, the Thurnauer Professor of Materials Science and Engineering and director of the university's Frederick Seitz Materials Research Laboratory, and her collaborators demonstrate patterned silver microelectrodes by omnidirectional printing of concentrated nanoparticle inks with minimum widths of about 2 microns on semiconductor, plastic and glass substrates.

"Unlike inkjet or screen printing, our approach enables the microelectrodes to be printed out-of-plane, allowing them to directly cross pre-existing patterned features through the formation of spanning arches," Lewis said. "Typically, insulating layers or bypass electrode arrays are required in conventional layouts."

To produce printed features, the researchers first prepare a highly concentrated silver nanoparticle ink. The ink is then extruded through a tapered cylindrical nozzle attached to a three-axis micropositioning stage, which is controlled by computer-aided design software.

When printed, the silver nanoparticles are not yet bonded together. The bonding process occurs when the printed structure is heated to 150 degrees Celsius or higher. During thermal annealing, the nanoparticles fuse into an interconnected structure. Because of the modest processing temperatures required, the printed features are compatible with flexible, organic substrates.

To demonstrate the versatility of the printing process, the researchers patterned both planar and out-of-plane silver microelectrodes; produced spanning interconnects for solar microcell and light-emitting-diode arrays; and bonded silver wires to fragile,
three-dimensional devices.

"Unlike conventional techniques, our approach allows fine silver wires to be bonded to delicate devices using minimal contact pressure," said postdoctoral researcher Bok Yeop Ahn, the lead author of the paper.

"Our approach is capable of creating highly integrated systems from diverse classes of electronic materials on a broad range of substrates," said graduate student Eric Duoss, a co-author of the paper. "Omnidirectional printing overcomes some of the design constraints that have limited the potential of printed electronics.

In addition to Lewis, Ahn and Duoss, the paper's co-authors include chemistry professor Ralph Nuzzo and materials science and engineering professor John Rogers, as well as members of their research groups.

The work was funded by the U.S. Department of Energy.

####

For more information, please click here

Contacts:
James E. Kloeppel
Physical Sciences Editor
217-244-1073


Jennifer Lewis
217-244-4973

Copyright © University of Illinois at Urbana-Champaign

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Future electronic components to be printed like newspapers July 20th, 2018

The relationship between charge density waves and superconductivity? It's complicated July 19th, 2018

Sirrus's Issued Patent Portfolio Continues To Accelerate July 18th, 2018

FEFU scientists reported on toxicity of carbon and silicon nanotubes and carbon nanofibers: Nanoparticles with a wide range of applying, including medicine, damage cells of microalgae Heterosigma akashivo badly. July 18th, 2018

Chip Technology

Future electronic components to be printed like newspapers July 20th, 2018

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits July 16th, 2018

Nanometrics to Announce Second Quarter Financial Results on July 31, 2018 July 12th, 2018

Leti and Soitec Launch a New Substrate Innovation Center to Develop Engineered Substrate Solutions: Industry-inclusive hub promotes early collaboration and learning from substrate to system level July 11th, 2018

Discoveries

Future electronic components to be printed like newspapers July 20th, 2018

The relationship between charge density waves and superconductivity? It's complicated July 19th, 2018

FEFU scientists reported on toxicity of carbon and silicon nanotubes and carbon nanofibers: Nanoparticles with a wide range of applying, including medicine, damage cells of microalgae Heterosigma akashivo badly. July 18th, 2018

In borophene, boundaries are no barrier: Rice U., Northwestern researchers make and test atom-thick boron's unique domains July 17th, 2018

Announcements

Future electronic components to be printed like newspapers July 20th, 2018

The relationship between charge density waves and superconductivity? It's complicated July 19th, 2018

Sirrus's Issued Patent Portfolio Continues To Accelerate July 18th, 2018

FEFU scientists reported on toxicity of carbon and silicon nanotubes and carbon nanofibers: Nanoparticles with a wide range of applying, including medicine, damage cells of microalgae Heterosigma akashivo badly. July 18th, 2018

Printing/Lithography/Inkjet/Inks/Bio-printing

Future electronic components to be printed like newspapers July 20th, 2018

Making carbon nanotubes as usable as common plastics: Researchers discover that cresols disperse carbon nanotubes at unprecedentedly high concentrations May 15th, 2018

New 4-D printer could reshape the world we live in March 20th, 2018

Leti & Mapper announce cyber-security breakthrough that encrypts individual chips with a code: Low-Cost Cyber-Security Breakthrough that Encrypts Individual Chips With a Unique Code Presented at SPIE Advanced Lithography 2018 in San Jose March 2nd, 2018

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project