Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH Experts Report Progress on Enabling EUVL at SPIE

Abstract:
Papers provide innovative and practical options for realizing the semiconductor roadmap for the 22 nm half-pitch node and beyond

SEMATECH Experts Report Progress on Enabling EUVL at SPIE

Albany, NY and Austin, TX | Posted on February 11th, 2009

SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) experts will present world-leading research and development results on extreme ultraviolet (EUV) manufacturability and extendibility, alternative lithography, and related areas of metrology at the SPIE Advanced Lithography 2009 conferences on February 22-27 at the San Jose Convention Center and Marriott in San Jose, CA.

SEMATECH engineers will report their progress on assessing EUV lithography (EUVL) manufacturability and on advancing EUVL extendibility and alternative lithography and will showcase some of their findings in 12 papers demonstrating breakthrough results in exposure tool capability, resist advances, defect-related inspection, reticle handling, and nanoimprint.

"We are enthusiastic about sharing our progress on some of the most critical determiners for the development of EUV infrastructure," said Bryan Rice, director of lithography at SEMATECH. "SEMATECH's leadership in enabling EUVL pilot line readiness and in researching new techniques for advancing EUV extendibility and alternative lithography, coupled with access to the full-field exposure tool, located at the University at Albany's College of Nanoscale Science and Engineering, demonstrate how our research continues to support EUV readiness for the 22 nm half-pitch node."

In addition to the EUV results, ISMI engineers will present on critical dimension-scanning electron microscopy (CD-SEM) metrology and process control. ISMI's metrology program is focused on the 32 nm and 22 nm generations, to facilitate lithographic innovation, improve manufacturing productivity, and reduce manufacturing costs.

SEMATECH-led presentations at SPIE include the following:
Tuesday, February 24

· 4:30 p.m.: Nanopit smoothing by cleaning - will introduce a new technique for smoothing pit defects on EUV mask substrates. This technique is based on non-isotropic etch processes.

· 5:30 p.m.: Protection efficiency and commercial availability of a standards-compliant EUV reticle handling solution - will present performance results of a commercial carrier, using the world's most advanced inspection capability of 40 nm polystyrene latex (PSL) equivalent.

Wednesday, February 25

· 8:40 a.m.: SEMATECH research activities on EUV full-field exposure tool - will evaluate the performance of an alpha demo tool (ADT) exposure tool, looking specifically at the status of EUVL and its supporting infrastructure.

· 9:40 a.m.: Estimation of cost comparison of lithography technologies at the 22 nm half-pitch node - will identify key cost factors for different lithography candidates, investigate their corresponding cost targets, and discuss the cost dependence of different types of integrated devices on lithography technology.

· 3:50 p.m.: SEMATECH's nanoimprint program: a key enabler for nanoimprint introduction - will explore many of the critical aspects of the nanoimprint process and drive key improvements in overlay, template cleaning, and defectivity toward making nanoimprint technology a cost-effective alternative for CMOS development and manufacturing applications.

Thursday, February 26

· 10:50 a.m.: Assessment of EUV resist readiness for 32 nm half-pitch manufacturing and extendibility study of EUV ADT using state-of-the-art resists - will assess EUVL resist readiness for 32 nm half-pitch manufacturability using a full-field ADT scanner and demonstrate ADT extendibility with state-of-the-art EUV resists.

Key ISMI presentations in the Metrology, Inspections, and Process Control for Microlithography sessions include the following:

· 1:40 p.m., Tuesday, February 24: CD-SEM parameter influence on image resolution and measurement accuracy - will show experimental SEM resolution results, including influences of many different parameters such as SEM focus and stigmation, filter, and threshold levels.

· 4:10 p.m., Wednesday, February 25: Phenomenology of electron-beam-induced photoresist shrinkage trends - will examine the readiness of SEM metrology for the challenges presented by both dry and immersion ArF lithographies and will calculate the errors involved in estimating the original CD from the shrinkage trend.

For a complete listing of papers authored or co-authored by SEMATECH researchers, or highlighting SEMATECH research, please visit www.sematech.org/corporate/news/features/spie2009.htm.

####

About SEMATECH
For 20 years, SEMATECH® (www.sematech.org), the global consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH | Media Relations
257 Fuller Road | Suite 2200 | Albany, NY | 12203
o: 518-649-1041 | m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Thanks for the memory: NIST takes a deep look at memristors January 20th, 2018

New Method Uses DNA, Nanoparticles and Top-Down Lithography to Make Optically Active Structures: Technique could lead to new classes of materials that can bend light, such as for those used in cloaking devices January 18th, 2018

Arrowhead Pharmaceuticals Announces Pricing of Underwritten Public Offering of Common Stock January 18th, 2018

Leti to Demo New Curving Technology at Photonics West that Improves Performance of Optical Components January 18th, 2018

Chip Technology

Thanks for the memory: NIST takes a deep look at memristors January 20th, 2018

Leti to Demo New Curving Technology at Photonics West that Improves Performance of Optical Components January 18th, 2018

Ultra-thin memory storage device paves way for more powerful computing January 17th, 2018

'Gyroscope' molecules form crystal that's both solid and full of motion: New type of molecular machine designed by UCLA researchers could have wide-ranging applications in technology and science January 16th, 2018

Announcements

Thanks for the memory: NIST takes a deep look at memristors January 20th, 2018

New Method Uses DNA, Nanoparticles and Top-Down Lithography to Make Optically Active Structures: Technique could lead to new classes of materials that can bend light, such as for those used in cloaking devices January 18th, 2018

Arrowhead Pharmaceuticals Announces Pricing of Underwritten Public Offering of Common Stock January 18th, 2018

Leti to Demo New Curving Technology at Photonics West that Improves Performance of Optical Components January 18th, 2018

Interviews/Book Reviews/Essays/Reports/Podcasts/Journals/White papers

Thanks for the memory: NIST takes a deep look at memristors January 20th, 2018

Nanowrinkles could save billions in shipping and aquaculture Surfaces inspired by carnivorous plants delay degradation by marine fouling January 17th, 2018

Ultrathin black phosphorus for solar-driven hydrogen economy: Osaka University researchers use sunlight to make hydrogen with a new nanostructured catalyst based on nanosheets of black phosphorus and bismuth vanadate January 17th, 2018

Ultra-thin optical fibers offer new way to 3-D print microstructures: Novel approach lays groundwork for using 3-D printing to repair tissue in the body January 17th, 2018

Events/Classes

Leti to Demo New Curving Technology at Photonics West that Improves Performance of Optical Components January 18th, 2018

21st International Conference on Advanced Nanoscience and Nanotechnology December 31st, 2017

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Leti to Demo Wristband with Embedded Sensors to Diagnose Sleep Apnea: APNEAband, Which Will Be Demonstrated at CES 2018, Also Monitors Mountain Sickness, Dehydration, Dialysis Treatment Response and Epileptic Seizures December 12th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project