Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Intel Completes Next Generation, 32nm Process Development Phase

Abstract:
Intel Corporation has completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 nanometers (a billionth of a meter). The company is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009.

Intel Completes Next Generation, 32nm Process Development Phase

SANTA CLARA, CA | Posted on December 10th, 2008

Intel will provide a multitude of technical details around the 32nm process technology along with several other topics during presentations at the International Electron Devices Meeting (IEDM) next week in San Francisco. Finishing the development phase for the company's 32nm process technology and production readiness in this timeframe means that Intel remains on pace with its ambitious product and manufacturing cadence referred to as the company's "tick-tock" strategy.

That plan revolves around introducing an entirely new processor microarchitecture alternating with a cutting edge manufacturing process about every 12 months, an effort unmatched in the industry. Producing 32nm chips next year would mark the fourth consecutive year Intel has met its goal.

The Intel 32nm paper and presentation describe a logic technology that incorporates second-generation high-k + metal gate technology, 193nm immersion lithography for critical patterning layers and enhanced transistor strain techniques. These features enhance the performance and energy efficiency of Intel processors. Intel's manufacturing process has the highest transistor performance and the highest transistor density of any reported 32nm technology in the industry.

"Our manufacturing prowess and resulting products have helped us widen our lead in computing performance and battery life for Intel-based laptops, servers and desktops," said Mark Bohr, Intel Senior Fellow and director of process architecture and integration. "As we've shown this year, the manufacturing strategy and execution have also given us the ability to create entirely new product lines for MIDs, CE equipment, embedded computers and netbooks."

Other Intel IEDM papers will describe a low power system on chip version of Intel's 45nm process, transistors based on compound semiconductors, substrate engineering to improve performance of 45nm transistors, integrating chemical mechanical polish for the 45nm node and beyond; and, integrating an array of silicon photonics modulators. Intel will also participate in a short course on 22nm CMOS Technology.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

####

For more information, please click here

Contacts:
Intel Corporation
Megan Langer
503-712-4305

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Personal cooling units on the horizon April 29th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

The Translational Research Center at the University Hospital of Erlangen in Germany uses the ZetaView from Particle Metrix to quantify extracellular vesicles such as exosomes April 28th, 2016

Possible Futures

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Personal cooling units on the horizon April 29th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

Hybrid nanoantennas -- next-generation platform for ultradense data recording April 28th, 2016

Chip Technology

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

Researchers create a first frequency comb of time-bin entangled qubits: Discovery is a significant step toward multi-channel quantum communication and higher capacity quantum computers April 28th, 2016

NREL theory establishes a path to high-performance 2-D semiconductor devices April 27th, 2016

Announcements

Cooling graphene-based film close to pilot-scale production April 30th, 2016

Personal cooling units on the horizon April 29th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

The Translational Research Center at the University Hospital of Erlangen in Germany uses the ZetaView from Particle Metrix to quantify extracellular vesicles such as exosomes April 28th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic