Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > EV Group Introduces New Suite of Aligners and Measurement Systems for 3D IC and Other Advanced Semiconductor, MEMS and Nanotechnology Device Manufactu

Abstract:
The 'NT' Series Significantly Increases Both Alignment and Measurement Accuracy to Enable Better Device Performance and Lower Manufacturing Costs

EV Group Introduces New Suite of Aligners and Measurement Systems for 3D IC and Other Advanced Semiconductor, MEMS and Nanotechnology Device Manufactu

ST. FLORIAN, Austria | Posted on December 1st, 2008

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the NT series -- a new, yet already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measurement systems -- to address increased demand for higher precision alignment accuracy. The shift to smaller geometries along with more feature-dense packages adds a host of challenges, surrounding precision alignment capabilities, which can greatly impact device failure intolerance and, ultimately, yield and cost. The new EVG-NT series offers dramatically increased alignment accuracy -- in the range of 1 um down to 0.1 um -- for the manufacture of advanced MEMS, compound semiconductor, silicon-based power, 3D IC and nanotechnology devices -- unlike anything else on the market. First units of the new NT systems have already been installed at customer sites worldwide and passed the acceptance tests.

"Structural integrity and, ultimately, device performance is impacted by alignment inaccuracies throughout the production process, increasing the total cost of manufacturing," said Paul Lindner, EVG's executive technology director. "There are a host of variables to consider in the manufacturing process that can affect alignment accuracy -- including temperature and substrate materials -- and the movement to smaller, more feature-dense packages greatly exacerbates the problem. In fulfilling our commitment to enabling our customers, we have introduced the EVG-NT series to solve these issues. We're pleased to report that customers have already qualified our first systems in the field, and that data have confirmed our quoted specifications. This is testament to our triple 'i' philosophy of invent, innovate and implement, and we look forward to pushing the envelope in enabling next-generation manufacturing needs."

The EVG-NT series features next-generation alignment and measurement systems with significantly increased alignment precision. The series is composed of the following mask aligners, a W2W bond aligner, and an alignment measurement system.

Mask Aligners: EVG620NT and EVG6200NT

The EVG620NT and EVG6200NT mask aligners -- which handle sizes of substrates starting from less than 5 mm up to 150 mm and from 3 inches up to 200 mm, respectively -- offer new state-of-the-art features, including a granite base, active vibration isolation and linear motors to meet higher precision and throughput requirements. Built upon EVG's most flexible and versatile aligner platforms, these new systems enable manufacturers to easily scale between R&D efforts to volume manufacturing in a simple one-to-one process transfer from manual mode to full automation. The ramp-up ease to volume manufacturing coupled with alignment accuracies improvements -- down to 0.1 um -- deliver significant cost-of-ownership (CoO) benefits.

W2W Bonder Aligner: SmartViewNT

Multiple wafer stacking and bonding processes require an alignment accuracy of <1 um. To meet this challenge, the SmartViewNT utilizes a revolutionary high-precision alignment stage that comprises top- and bottom-side microscopes to ensure the highest degree of accuracy. This versatile bond aligner can also handle all types of alignments, including W2W, backside and infrared transparent. Initial results for W2W alignments demonstrated <0.3 um face-to-face alignment accuracy, eliminating the need for post-processing steps such as generating backside alignment keys and double-sided polishing -- enabling lower CoO. In a side-by-side comparison of the SmartViewNT to its predecessor, alignment accuracies increased by more than 60%, 300%, and 40% for SmartView, backside and transparent alignments, respectively -- enabling the system to effectively address stringent precision requirements.

Alignment Measurement System: EVG40NT

The EVG40NT is designed to perform highly accurate non-destructive alignment accuracy measurement of single- and double-sided structured wafers, as well as bond interfaces. This new system overcomes the limitation of conventional double-view microscope and infrared systems, which rely on a cumbersome and time-consuming procedure to calibrate the optical axis. The EVG40NT is a highly flexible tool that can quickly provide an unlimited number of measurement points across the wafer surface. Compared to the previous generation, the NT series' throughput improves up to five fold, offering 200-300 measurements per hour. Additionally, while process dependent, results have shown a 60% accuracy increase producing a measurement accuracy of <0.2 um. These results are highly repeatable and reproducible with a statistic probability of >99%.

EVG reports that each system from its NT family has already been installed and qualified by leading-edge manufacturers globally.

Editors interested in learning more about the new NT suite of tools are invited to visit EVG's booth located in Hall 4A, Booth #206 at SEMICON Japan 2008 held December 3-5 in Chiba, Japan.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

For more information, please click here

Contacts:
EVG Headquarters
Austria - Europe/Middle East/Africa
Sales
EV Group
E. Thallner GmbH
DI Erich Thallner Strasse 1
A-4782 St.Florian am Inn
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Leti IEDM 2016 Paper Clarifies Correlation between Endurance, Window Margin and Retention in RRAM for First Time: Paper Presented at IEDM 2016 Offers Ways to Reconcile High-cycling Requirements and Instability at High Temperatures in Resistive RAM December 6th, 2016

Tokyo Institute of Technology research: 3D solutions to energy savings in silicon power transistors December 6th, 2016

Physicists decipher electronic properties of materials in work that may change transistors December 6th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

MEMS

Vesper a Finalist for Two ACE Awards: Ultimate Products and Innovator of the Year -- Industry’s first piezoelectric MEMS microphone and Vesper CTO Bobby Littrell recognized for prestigious electronics-industry awards November 10th, 2016

Semiconductor-free microelectronics are now possible, thanks to metamaterials November 9th, 2016

Researchers surprised at the unexpected hardness of gallium nitride: A Lehigh University team discovers that the widely used semiconducting material is almost as wear-resistant as diamonds October 31st, 2016

Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration October 18th, 2016

Chip Technology

Leti IEDM 2016 Paper Clarifies Correlation between Endurance, Window Margin and Retention in RRAM for First Time: Paper Presented at IEDM 2016 Offers Ways to Reconcile High-cycling Requirements and Instability at High Temperatures in Resistive RAM December 6th, 2016

Tokyo Institute of Technology research: 3D solutions to energy savings in silicon power transistors December 6th, 2016

Physicists decipher electronic properties of materials in work that may change transistors December 6th, 2016

Construction of practical quantum computers radically simplified: Scientists invent ground-breaking new method that puts quantum computers within reach December 5th, 2016

Announcements

Leti IEDM 2016 Paper Clarifies Correlation between Endurance, Window Margin and Retention in RRAM for First Time: Paper Presented at IEDM 2016 Offers Ways to Reconcile High-cycling Requirements and Instability at High Temperatures in Resistive RAM December 6th, 2016

Tokyo Institute of Technology research: 3D solutions to energy savings in silicon power transistors December 6th, 2016

Physicists decipher electronic properties of materials in work that may change transistors December 6th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Tools

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Controlled electron pulses November 30th, 2016

Scientists shrink electron gun to matchbox size: Terahertz technology has the potential to enable new applications November 25th, 2016

News from Quorum: The Agricultural Research Service of the USDA uses a Quorum Cryo-SEM preparation system for the study of mites, ticks and other soft bodied organisms November 22nd, 2016

Events/Classes

IEDM: Leti CEO Marie Semeria to Give Opening-day Keynote on Impact of ‘Hyperconnectivity’ and IoT: Speech to Portray Key Role Nonprofit Research and Technology Organizations Play in Making Technology More Efficient and Ensuring Safety and Security November 29th, 2016

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications November 28th, 2016

Cutting-edge nanotechnologies are breaking into industries November 18th, 2016

IEDM: CEO Marie Semeria to Deliver Opening Day Keynote at IEDM 2016; Institute to Present 13 Papers November 17th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project