Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Intermolecular and AMD Develop Self-Assembly Technology for Next-Generation Logic Devices

Abstract:
Intermolecular, Inc. today announced that they have collaborated with AMD to develop advanced interconnect technology for next-generation, high-performance logic devices based on the process of molecular self-assembly.

Intermolecular and AMD Develop Self-Assembly Technology for Next-Generation Logic Devices

San Jose, CA | Posted on November 19th, 2008

Shrinking semiconductor device geometries and the reduction of copper interconnect feature sizes have increased certain types of reliability failures. For nearly a decade, the industry has tried to develop a breakthrough remedy by applying a copper-capping layer to improve electromigration reliability performance.

Working on a Collaborative Development Program (CDP) for the past year, Intermolecular and AMD have developed an innovative solution that enables the implementation of a copper-capping layer in manufacturing advanced logic devices with copper interconnects and low-k dielectrics. The CDP was custom-designed to apply Intermolecular's High-Productivity Combinatorial™ (HPC) technology products and services to AMD's specific device architecture.

"Through a methodical, hierarchical, HPC screening approach, we have been able to not only identify a unique formulation, but more important, a simple, aqueous, room temperature, manufacturing-friendly process and associated integration scheme to facilitate and expand the manufacturability of metal capping at finer geometries, and with more challenging dielectrics," said Tony Chiang, CTO of Intermolecular.

The resulting material and processing technology, called the Molecular Masking LayerTM (MML), leverages molecular self-assembly to selectively alter the surface state of the dielectric regions of the incoming wafer to manage and facilitate integration of the metal capping process flow.

Dr. Chiang noted that Intermolecular's MML technology is an example of how the company's HPC™ systems and methods can help customers significantly improve R&D ROI by accelerating materials discovery, process development, and integration learning at reduced costs (including time, wafers and associated resources).

The MML has met AMD's criteria for general use in its high-volume manufacturing facility in Dresden, Germany, and is being evaluated by AMD for insertion into specific process flows.

"Working with Intermolecular, we have made significant progress in overcoming the performance challenges of interconnects at successively tighter design nodes," said Craig Sander, AMD's corporate Vice President for Technology Development.

Intermolecular is the semiconductor industry's only provider of fully integrated combinatorial R&D technology, powered by systems and methodologies that radically accelerate discovery and integration of new materials, new process technologies and new device structures. The company's Tempus™ HPC platform enables customers to maximize their R&D return on investment through economical high-speed development, integration and electrical testing of a large number of alternative solution sets.

####

About Intermolecular, Inc.
Intermolecular, Inc. delivers High Productivity Combinatorial™ (HPC) technology products and services that enable customers to maximize semiconductor R&D ROI. The company’s Tempus™ HPC™ Platform offers chipmakers, materials suppliers and equipment manufacturers integrated processing, characterization and informatics systems that exponentially accelerate learning in materials discovery, process development and IC device integration.

Customers apply Intermolecular’s technologies in their R&D projects through Collaborative Development Programs (CDPs) with Intermolecular’s multidisciplinary team, or through purchase of Tempus systems, or by licensing of IP developed and qualified by Intermolecular. By leveraging HPC technologies to quickly develop, integrate and electrically test multiple alternative solutions, at minimum cost and risk, customers obtain unique IP and time-to-market advantage.

Founded in 2004, Intermolecular is based in San Jose, California.

For more information, please click here

Contacts:
Loomis Group
Jennifer Anselmo
415-882-9494, ext. 330

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

UT Dallas engineers twist nanofibers to create structures tougher than bulletproof vests March 27th, 2015

Novel nanoparticle therapy promotes wound healing March 27th, 2015

Designer's toolkit for dynamic DNA nanomachines: Arm-waving nanorobot signals new flexibility in DNA origami March 27th, 2015

Using magnetic fields to understand high-temperature superconductivity: Los Alamos explores experimental path to potential 'next theory of superconductivity' March 27th, 2015

Self Assembly

Designer's toolkit for dynamic DNA nanomachines: Arm-waving nanorobot signals new flexibility in DNA origami March 27th, 2015

Four Scientists With Major Contributions to Research at Brookhaven Lab Named American Physical Society Fellows March 17th, 2015

Nanotubes self-organize and wiggle: Evolution of a nonequilibrium system demonstrates MEPP February 10th, 2015

Engineering self-assembling amyloid fibers January 26th, 2015

Announcements

UT Dallas engineers twist nanofibers to create structures tougher than bulletproof vests March 27th, 2015

Novel nanoparticle therapy promotes wound healing March 27th, 2015

Designer's toolkit for dynamic DNA nanomachines: Arm-waving nanorobot signals new flexibility in DNA origami March 27th, 2015

Using magnetic fields to understand high-temperature superconductivity: Los Alamos explores experimental path to potential 'next theory of superconductivity' March 27th, 2015

Alliances/Partnerships/Distributorships

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Young NTU Singapore spin-off clinches S$4.3 million joint venture with Chinese commercial giant March 23rd, 2015

Halas, Nordlander awarded Optical Society's R.W. Wood Prize: Rice University researchers recognized for pioneering nanophotonics March 21st, 2015

EU Funded PCATDES Project has completed its half-period with success March 19th, 2015

Research partnerships

SUNY Poly & M+W Make Major Announcement: Major Expansion To Include M+W Owned Gehrlicher Solar America Corporation That Will Create up to 400 Jobs to Develop Solar Power Plants at SUNY Poly Sites Across New York State March 26th, 2015

ORNL-led team demonstrates desalination with nanoporous graphene membrane March 25th, 2015

New kind of 'tandem' solar cell developed: Researchers combine 2 types of photovoltaic material to make a cell that harnesses more sunlight March 24th, 2015

UW scientists build a nanolaser using a single atomic sheet March 24th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE