Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > EV Group Realizes Continued Growth for Fiscal 2008

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company witnessed a more than 15-percent increase in overall revenue during fiscal 2008, ended September 30. EVG attributes this growth, in large part, to burgeoning demand in both the 3D interconnect/through-silicon via (TSV) and nanoimprint lithography (NIL) markets. Despite the current global economic slowdown, the company remains cautiously optimistic about its outlook for 2009 given the expected growth opportunities to ensue as these novel technologies gain market acceptance/penetration.

EV Group Realizes Continued Growth for Fiscal 2008

ST. FLORIAN, Austria | Posted on November 19th, 2008

According to EVG Founder and President Erich Thallner, EVG capitalizes on its technology and market leadership by continuously building upon its extensive experience in bringing new and innovative products to the market. "Our leading-edge solutions provide a true value add to our customers and are the cornerstone in strengthening our technology leadership position and market share. To this end, our strategy has always been to leverage our existing core capabilities and extend this knowledge and expertise into other synergistic markets that can truly benefit from us. This has allowed EVG to grow consistently over the years since our inception in 1980-ultimately enabling us to weather some of the effects associated with various cyclical industries like the semiconductor market, even at the most tumultuous of times, like we are seeing today."

Thallner added, "Looking ahead, even though the macroeconomic environment is expected to be more challenging in 2009, specifically in market segments that are automotive and consumer-product driven, we expect that new technologies, such as backside illuminated image sensors or even higher functional density cell phones, will drive continued growth for EVG's 3D IC lithography and wafer bonding equipment, among others."

As part of its quest to bring novel technologies to market, EVG will continue to invest in 3D/TSVs and NIL in order to help its customers overcome the yield and performance challenges as they scale down to 32- and 22-nm geometries. Citing its success to date with NIL, the company recently announced that it has shipped its 100th NIL system. The milestone shipment reinforces the company's leadership in the NIL market, of which EVG holds an approximate 30-percent market share with the most systems in the field. The company also credits increasing order wins among leading universities for advanced research and development activities as another key 2008 milestone. In its most recent win last month, EVG reported that three European universities-Southampton University, University of Ulster and Technische Universitat Braunschweig-had placed orders for multiple next-generation EVG systems for leading-edge MEMS research, totaling in excess of US$2.9 million.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

For more information, please click here

Contacts:
EV Group
E. Thallner GmbH
DI Erich Thallner Strasse 1
A-4782 St.Florian am Inn
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Princess Margaret scientists convert microbubbles to nanoparticles: Harnessing light to advance tumor imaging, provide platform for targeted treatment March 30th, 2015

Wrapping carbon nanotubes in polymers enhances their performance: Scientists at Japan's Kyushu University say polymer-wrapped carbon nanotubes hold much promise in biotechnology and energy applications March 30th, 2015

Tokyo Institute of Technology research: Catalyst redefines rate limitations in ammonia production March 30th, 2015

Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015

MEMS

ASIC Development for MEMS Applications: A Platform Approach March 25th, 2015

STMicroelectronics Executive Vice-President Benedetto Vigna Awarded IEEE Frederik Philips Award March 12th, 2015

MIG Takes a Roll-Up-Your-Sleeves Approach with Revamped MEMS/Sensors Technical Event -- MIG welcomes technologists to MEMS Technical Congress, emphasizes working groups and breakout sessions on emerging MEMS & sensors, tech transfer and integration March 6th, 2015

French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer March 5th, 2015

Chip Technology

Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015

State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015

SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Announcements

Princess Margaret scientists convert microbubbles to nanoparticles: Harnessing light to advance tumor imaging, provide platform for targeted treatment March 30th, 2015

Wrapping carbon nanotubes in polymers enhances their performance: Scientists at Japan's Kyushu University say polymer-wrapped carbon nanotubes hold much promise in biotechnology and energy applications March 30th, 2015

Tokyo Institute of Technology research: Catalyst redefines rate limitations in ammonia production March 30th, 2015

Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015

Tools

'Atomic chicken-wire' is key to faster DNA sequencing March 30th, 2015

LAMDAMAP 2015 hosted by the University March 26th, 2015

FEI Technology Award of the German Neuroscience Society Goes to Benjamin Judkewitz of the University of Berlin: Bi-annual award honors excellence in brain research during the German Neuroscience Society’s Annual Meeting, held 18-21 March 2015 March 26th, 2015

Square ice filling for a graphene sandwich March 26th, 2015

Financial Reports

Harris & Harris Group Reports Financial Statements as of December 31, 2014 and Posts Annual Letter to Shareholders on Website March 17th, 2015

Aspen Aerogels, Inc. Schedules Fourth Quarter and Fiscal 2014 Earnings Release and Conference Call for February 26, 2015 February 11th, 2015

Arrowhead to Report Fiscal 2015 First Quarter Financial Results February 2nd, 2015

Graphenea sales more than double in 2014 January 29th, 2015

Printing/Lithography/Inkjet/Inks

Haydale Announce Dedicated Graphene Inks Manufacturing Capability March 25th, 2015

NC State researchers create 'nanofiber gusher': Report method of fabricating larger amounts of nanofibers in liquid March 19th, 2015

'Additive manufacturing' could greatly improve diabetes management March 17th, 2015

Advantest to Exhibit at SEMICON China in Shanghai, China, March 17-19: Showcasing Broad Portfolio of Semiconductor Products, Technologies and Solutions March 10th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE