Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > EV Group Realizes Continued Growth for Fiscal 2008

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company witnessed a more than 15-percent increase in overall revenue during fiscal 2008, ended September 30. EVG attributes this growth, in large part, to burgeoning demand in both the 3D interconnect/through-silicon via (TSV) and nanoimprint lithography (NIL) markets. Despite the current global economic slowdown, the company remains cautiously optimistic about its outlook for 2009 given the expected growth opportunities to ensue as these novel technologies gain market acceptance/penetration.

EV Group Realizes Continued Growth for Fiscal 2008

ST. FLORIAN, Austria | Posted on November 19th, 2008

According to EVG Founder and President Erich Thallner, EVG capitalizes on its technology and market leadership by continuously building upon its extensive experience in bringing new and innovative products to the market. "Our leading-edge solutions provide a true value add to our customers and are the cornerstone in strengthening our technology leadership position and market share. To this end, our strategy has always been to leverage our existing core capabilities and extend this knowledge and expertise into other synergistic markets that can truly benefit from us. This has allowed EVG to grow consistently over the years since our inception in 1980-ultimately enabling us to weather some of the effects associated with various cyclical industries like the semiconductor market, even at the most tumultuous of times, like we are seeing today."

Thallner added, "Looking ahead, even though the macroeconomic environment is expected to be more challenging in 2009, specifically in market segments that are automotive and consumer-product driven, we expect that new technologies, such as backside illuminated image sensors or even higher functional density cell phones, will drive continued growth for EVG's 3D IC lithography and wafer bonding equipment, among others."

As part of its quest to bring novel technologies to market, EVG will continue to invest in 3D/TSVs and NIL in order to help its customers overcome the yield and performance challenges as they scale down to 32- and 22-nm geometries. Citing its success to date with NIL, the company recently announced that it has shipped its 100th NIL system. The milestone shipment reinforces the company's leadership in the NIL market, of which EVG holds an approximate 30-percent market share with the most systems in the field. The company also credits increasing order wins among leading universities for advanced research and development activities as another key 2008 milestone. In its most recent win last month, EVG reported that three European universities-Southampton University, University of Ulster and Technische Universitat Braunschweig-had placed orders for multiple next-generation EVG systems for leading-edge MEMS research, totaling in excess of US$2.9 million.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

For more information, please click here

Contacts:
EV Group
E. Thallner GmbH
DI Erich Thallner Strasse 1
A-4782 St.Florian am Inn
Phone: +43 7712 5311 0
Fax: +43 7712 5311 4600

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Creation of coherent states in molecules by incoherent electrons October 21st, 2017

Novel 'converter' heralds breakthrough in ultra-fast data processing at nanoscale: Invention bagged four patents and could potentially make microprocessor chips work 1,000 times faster October 20th, 2017

Strange but true: turning a material upside down can sometimes make it softer October 20th, 2017

Leti Coordinating Project to Develop Innovative Drivetrains for 3rd-generation Electric Vehicles: CEA Techís Contribution Includes Litenís Knowhow in Magnetic Materials and Simulation And Letiís Expertise in Wide-bandgap Semiconductors October 20th, 2017

MEMS

First Capacitive Transducer with 13nm Gap July 27th, 2017

Bosch announces high-performance MEMS acceleration sensors for wearables June 27th, 2017

Smart multi-layered magnetic material acts as an electric switch: New study reveals characteristic of islands of magnetic metals between vacuum gaps, displaying tunnelling electric current March 1st, 2017

Engineers shrink microscope to dime-sized device February 17th, 2017

Chip Technology

Novel 'converter' heralds breakthrough in ultra-fast data processing at nanoscale: Invention bagged four patents and could potentially make microprocessor chips work 1,000 times faster October 20th, 2017

MIPT scientists revisit optical constants of ultrathin gold films October 20th, 2017

Bringing the atomic world into full color: Researchers turn atomic force microscope measurements into color images October 19th, 2017

Spin current detection in quantum materials unlocks potential for alternative electronics October 15th, 2017

Announcements

Creation of coherent states in molecules by incoherent electrons October 21st, 2017

Novel 'converter' heralds breakthrough in ultra-fast data processing at nanoscale: Invention bagged four patents and could potentially make microprocessor chips work 1,000 times faster October 20th, 2017

Strange but true: turning a material upside down can sometimes make it softer October 20th, 2017

Leti Coordinating Project to Develop Innovative Drivetrains for 3rd-generation Electric Vehicles: CEA Techís Contribution Includes Litenís Knowhow in Magnetic Materials and Simulation And Letiís Expertise in Wide-bandgap Semiconductors October 20th, 2017

Tools

Creation of coherent states in molecules by incoherent electrons October 21st, 2017

Bringing the atomic world into full color: Researchers turn atomic force microscope measurements into color images October 19th, 2017

Nanometrics Announces Preliminary Results for the Third Quarter of 2017: Quarterly Results Impacted by Delays in Revenue Recognition on Multiple Systems into Japan October 12th, 2017

Seeing the next dimension of computer chips: Researchers image perfectly smooth side-surfaces of 3-D silicon crystals with a scanning tunneling microscope, paving the way for smaller and faster computing devices October 11th, 2017

Financial Reports

Nanometrics Announces Preliminary Results for the Third Quarter of 2017: Quarterly Results Impacted by Delays in Revenue Recognition on Multiple Systems into Japan October 12th, 2017

Arrowhead Pharmaceuticals to Webcast Fiscal 2017 Third Quarter Results July 27th, 2017

Nanometrics to Announce Second Quarter Financial Results on August 1, 2017 July 14th, 2017

Arrowhead Pharmaceuticals to Webcast Fiscal 2017 Second Quarter Results April 27th, 2017

Printing/Lithography/Inkjet/Inks/Bio-printing

Creation of coherent states in molecules by incoherent electrons October 21st, 2017

Graphene based terahertz absorbers: Printable graphene inks enable ultrafast lasers in the terahertz range September 13th, 2017

Researchers printed graphene-like materials with inkjet August 17th, 2017

Simultaneous Design and Nanomanufacturing Speeds Up Fabrication: Method enhances broadband light absorption in solar cells August 5th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project