Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > FEI’s New TrueCrystal Package Provides Rapid, Accurate Strain Profiling for Semiconductor Manufacturing  

Abstract:
Automated strain analysis package combines ease of use with reduced time to data

FEI’s New TrueCrystal Package Provides Rapid, Accurate Strain Profiling for Semiconductor Manufacturing  

Hillsboro, OR | Posted on November 3rd, 2008

FEI Company (Nasdaq: FEIC), a leading provider of atomic-scale imaging and analysis systems, today released its new TrueCrystal Strain Analysis package that can be installed on a Titan™ or Tecnai™ scanning/transmission electron microscope (S/TEM) system. The new, automated strain analysis package allows engineers to achieve highly-accurate measurements in a fraction of the time of existing techniques.

"Silicon strain engineering is an important process innovation in advanced semiconductor manufacturing; it allows for improved device performance and efficiency at advanced technology nodes. Currently, only TEM has proven capable of measuring these induced lattice strains at the required spatial resolution," said Joseph Race, product marketing manager, Electronics Division at FEI. "TrueCrystal Strain Analysis is a complete analytical package for the determination of strain along any line in a crystalline sample, at the nanometer level."

Tony Edwards, vice president and general manager of FEI's Electronics Division, adds, "FEI's TrueCrystal Strain Analysis package is an example of our corporate commitment to providing customers with comprehensive, application-specific solutions that aim to maximize TEM productivity, reduce data acquisition times and lower overall cost of analysis."

TrueCrystal leverages a combination of nano-beam diffraction (NBD) in the TEM, and a powerful off-line data analysis package, to quickly and easily generate the high-quality data required for advanced strained silicon process development.

The NBD technique is not subject to the limitations observed in more traditional methods, such as high-resolution TEM (HRTEM) and convergent beam electron diffraction (CBED). The on-line software component works within the microscope user interface, and the straightforward line-scan workflow will be familiar to anyone who has undertaken chemical analysis on a TEM. The off-line software component allows for strain analysis of each individual diffraction peak of the acquired diffraction patterns. The resulting data is then used to automatically generate a plot of the strain profile across the acquired line scan. From experiment, through final data reduction, to presentation of results, the TrueCrystal Strain Analysis package combined with a Titan or Tecnai TEM will allow rapid, accurate strain profile determination in a broad range of samples.

####

About FEI Company
FEI (Nasdaq: FEIC) is the world leader in pioneering technologies and applications that deliver imaging solutions for 3D characterization, analysis and modification/prototyping with resolutions down to the sub-Ångström level. Our customers, working in advanced research and manufacturing, are supported by field-experienced applications specialists. They have open access to FEI’s prestigious global user network so they can succeed in accelerating nanoscale discovery and contribute to better living through new product commercialization. FEI’s NanoPorts in North America, Europe and Asia provide centers of technical excellence where our world-class community of customers and specialists collaborate on the ongoing development of new ideas and innovative solutions. FEI has sales and service operations in more than 50 countries around the world.

FEI Safe Harbor Statement
This press release contains forward-looking statements about the introduction of the Xplore3D software package. Factors that could affect these forward-looking statements include, but are not limited to, the failure of the general release to replicate beta results for the product, the failure of the product or technology to perform as expected and achieve anticipated results, and unexpected technical problems. Please also refer to the company's Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update any forward- looking statements.

The FEI logo, Tecnai and Titan Krios are trademarks of FEI Company.

For more information, please click here

Contacts:
FEI Company
Fletcher Chamberlin
(investors and analysts)
Investor Relations
+1 503 726 7710


Media Contact:
Sandy Fewkes, Principal
MindWrite Communications, Inc
+1 408 224 4024

Copyright © FEI Company

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Imaging

FEI Technology Award of the German Neuroscience Society Goes to Benjamin Judkewitz of the University of Berlin: Bi-annual award honors excellence in brain research during the German Neuroscience Society’s Annual Meeting, held 18-21 March 2015 March 26th, 2015

News and information

Hong Kong Investors Bullish on Dais Analytic Invest $5.75M, Provide $60M Contract, and Create New Joint Venture Company March 26th, 2015

Industrial Nanotech, Inc. Announces Next Large Order from the Oil and Gas Industry March 26th, 2015

Quantum compute this -- WSU mathematicians build code to take on toughest of cyber attacks: Revamped knapsack code offers online security for the future March 26th, 2015

Thousands of atoms entangled with a single photon: Result could make atomic clocks more accurate March 26th, 2015

Chip Technology

SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Building shape inspires new material discovery March 24th, 2015

EEE Photonics Society’s Fourth Annual Optical Interconnects Conference Seeks to Bring Together the Latest Advanced Optical Interconnect Technologies, Systems & Architectures for the Next Generation of Supercomputers & Datacenters March 23rd, 2015

Announcements

Industrial Nanotech, Inc. Announces Next Large Order from the Oil and Gas Industry March 26th, 2015

Quantum compute this -- WSU mathematicians build code to take on toughest of cyber attacks: Revamped knapsack code offers online security for the future March 26th, 2015

Thousands of atoms entangled with a single photon: Result could make atomic clocks more accurate March 26th, 2015

Square ice filling for a graphene sandwich March 26th, 2015

Tools

FEI Technology Award of the German Neuroscience Society Goes to Benjamin Judkewitz of the University of Berlin: Bi-annual award honors excellence in brain research during the German Neuroscience Society’s Annual Meeting, held 18-21 March 2015 March 26th, 2015

Square ice filling for a graphene sandwich March 26th, 2015

Renishaw reports on the use of Raman spectroscopy at CNRS Orléans to study materials under extreme conditions March 25th, 2015

Nanorobotic agents open the blood-brain barrier, offering hope for new brain treatments March 25th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE