Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > SEMATECH Reports Resist and Mask Progress at EUVL Symposium

Abstract:
SEMATECH engineers and the industry at large have made significant advances in moving forward the infrastructure that will prepare extreme ultraviolet lithography (EUVL) for cost-effective manufacturing, according to papers presented at the 2008 International EUVL Symposium in Lake Tahoe, California.

SEMATECH Reports Resist and Mask Progress at EUVL Symposium

Albany, NY and Austin, TX | Posted on October 14th, 2008

At the seventh EUVL Symposium, an outstanding set of 52 technical papers and 106 posters covering all aspects of EUVL technology, reported excellent progress in many key areas. At the same time, presenters highlighted various technology, infrastructure, and business challenges that the industry needs to address to successfully insert EUVL into manufacturing at the 22 nm half-pitch node.

The forum keynote addresses - "EUV Lithography's Future," by Dr. Harry Levinson of AMD, and "Samsung's Lithography Strategy," from Dr. Woosung Han of Samsung - emphasized that EUVL technology has transitioned from the research phase to the development phase, and is now focused on early device and yield learning and pre-production tooling to prepare EUVL for pilot line insertion in the 2010-2012 timeframe.

Experts reported, for the first time 45 nm node yielding full-field SRAM's produced using EUV lithography. A presentation by a chip manufacturer illustrated how EUVL contact hole printing for 3X nm half-pitch nodes and line and space printing for 2X nm hp nodes are significantly more cost effective than competing technologies, in part because little or no optical proximity correction (OPC) is needed.

Full field tool imaging, using conventional illumination, has demonstrated 28 nm half-pitch line and space resolution and 28 nm 1:1 contact hole resolution without using OPC. Further data showing approximately 1 nm intrawafer critical dimension uniformity (CDU) for 35 nm hp 1:1 lines and spaces clearly demonstrate the excellent imaging performance of EUVL alpha tools.

Critical progress has also been made in EUV sources. A fully integrated laser produced plasma (LPP) source collector module with effective mitigation of tin deposition and ion erosion was demonstrated with 3 to 4 W at intermediate focus (IF). Also, generated EUV power for discharge produced plasma (DPP) sources — the type that currently is used in alpha tools — has tripled to 500W.

SEMATECH researchers and research partners highlighted the key role the consortium has played in achieving significant advances in EUV resists in papers presented at the symposium. Specifically, SEMATECH researchers have demonstrated 20 nm resolution images and 30 nm 1:1 contact hole images and have achieved feature resolution for both, as confirmed by cross-section scanning electron microscopy images.

The resist technology research leading to these accomplishments has been enabled by SEMATECH's EUV Resist Test Center (RTC) at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex in Albany, NY, and by its micro-exposure tool (MET) located at the Berkley Advanced Light Source (ALS) Lab at University of California, Berkeley. Supported by SEMATECH's MET exposure capabilities, resist suppliers have been able to address the challenges of simultaneously meeting resolution, line edge roughness (LER), and sensitivity targets in a systematic way.

"Good progress has been made toward achieving resist resolution and sensitivity targets, with some improvement in line edge roughness, and now chip manufacturers are demonstrating post-exposure resist processes that lead to significantly reduced line edge roughness," said Stefan Wurm, EUVL Symposium chair and SEMATECH's associate director of Lithography. "With the world's leading-edge exposure tool for EUV resists learning, SEMATECH continues to enable the development of high performance resists required to demonstrate EUV manufacturability to our member companies and the industry."

Furthermore, SEMATECH also reported it has significantly reduced printable substrate defects with its development of a new and fast defect-removing cleans process. Combining a 6X faster two-hour defect smoothing process, this constitutes a major step forward in enabling cost efficient low-defect mask blank manufacturing solutions. EUV mask blanks are now commercially available with approximately 5 defects at 73 nm size. To achieve the pilot line target of eight defects at 18 nm, the industry will require more sensitive defect inspection tools for mask substrates and blanks.

Lastly, SEMATECH's aerial imaging and inspection research tool (AIT) at the Berkeley ALS Lab demonstrated that it is capable of resolving 88 nm mask features (22 nm half-pitch on the wafer). It is the only tool, world-wide, that allows chip manufacturers to characterize mask defect in an aerial imaging mode at this high resolution. However, to support pilot line operation and EUVL transition into manufacturing, a commercial EUV aerial imaging tool will be required for patterned mask defect review.

Given these significant advances, the EUVL Symposium Steering Committee identified at the conclusion of the conference three remaining focus areas that the industry needs to work on to enable EUVL manufacturing insertion:

1. Long-term source operation with 100 W at the IF and 5 megajoule per day
2. Availability of defect-free masks, throughout a mask lifecycle, and the need to address critical mask infrastructure tool gaps, specifically in the defect inspection and defect review area
3. Simultaneous resist resolution sensitivity and LER

The 2008 EUVL Symposium, held Sept. 29-Oct. 1, was organized by SEMATECH in cooperation with Selete, EUVA, and the EUV Cluster Steering Council.

####

About SEMATECH
For 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
SEMATECH
Erica McGill
518-956-7446

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Nano-supercapacitors for electric cars July 25th, 2014

New imaging agent provides better picture of the gut July 25th, 2014

Breakthrough laser experiment reveals liquid-like motion of atoms in an ultra-cold cluster: University of Leicester research team unlocks insights into creation of new nano-materials July 25th, 2014

Scientists Test Nanoparticle "Alarm Clock" to Awaken Immune Systems Put to Sleep by Cancer July 25th, 2014

Chip Technology

A*STAR and industry form S$200M semiconductor R&D July 25th, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

Discoveries

New imaging agent provides better picture of the gut July 25th, 2014

Breakthrough laser experiment reveals liquid-like motion of atoms in an ultra-cold cluster: University of Leicester research team unlocks insights into creation of new nano-materials July 25th, 2014

Scientists Test Nanoparticle "Alarm Clock" to Awaken Immune Systems Put to Sleep by Cancer July 25th, 2014

Iranian Scientists Produce Transparent Nanocomposite Coatings with Longer Lifetime July 24th, 2014

Announcements

Nano-supercapacitors for electric cars July 25th, 2014

New imaging agent provides better picture of the gut July 25th, 2014

Breakthrough laser experiment reveals liquid-like motion of atoms in an ultra-cold cluster: University of Leicester research team unlocks insights into creation of new nano-materials July 25th, 2014

Scientists Test Nanoparticle "Alarm Clock" to Awaken Immune Systems Put to Sleep by Cancer July 25th, 2014

Events/Classes

NNCO Announces an Interactive Webinar: Progress Review on the Coordinated Implementation of the National Nanotechnology Initiative 2011 Environmental, Health, and Safety Research Strategy July 23rd, 2014

Harris & Harris Group to Host Conference Call on Second-Quarter 2014 Financial Results on August 15, 2014 July 23rd, 2014

Deadline Announced for Registration in 7th Int'l Nanotechnology Festival in Iran July 23rd, 2014

Iran to Hold 3rd Int'l Forum on Nanotechnology Economy July 22nd, 2014

Printing/Lithography/Inkjet/Inks

Martini Tech Inc. becomes the exclusive distributor for Yoshioka Seiko Co. porous chucks for Europe and North America July 20th, 2014

University of Illinois researchers demonstrate novel, tunable nanoantennas July 14th, 2014

Haydale Announces Collaboration Agreement with Swansea University’s Welsh Centre for Printing and Coatings (WCPC) July 12th, 2014

Leti to Present Technological Platforms Targeting Industry’s Needs for the Future at Semicon West Workshop: Presentation at STS Session to Focus on Leti Advanced Lithography Programs for 1x Nodes and on Silicon Photonics at TechXPot June 25th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE