Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > IMEC demonstrates 3D stacked integrated circuits

Test-chip taped for assessing design rules and models for 3D-SIC technology.
Test-chip taped for assessing design rules and models for 3D-SIC technology.

Abstract:
IMEC Annual Research Review Meeting - Leuven - Belgium

IMEC demonstrates 3D stacked integrated circuits

Leuven, Belgium | Posted on October 13th, 2008

IMEC, Europe's leading independent nanoelectronics research institute today announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5Ķm Cu through-silicon vias (TSV). It will now further develop 3D SIC chips on 200mm and 300mm wafers, integrating test circuits from partners participating in its 3D integration research program.



IMEC reported a first-time demonstration of 3D integrated circuits obtained by die-to-die stacking and using 5Ķm Cu through-silicon vias (TSV). The dies were realized on 200mm wafers in IMEC's reference 0.13μm CMOS process with an added Cu-TSVs process. For stacking, the top die was thinned down to 25μm and bonded to the landing die by Cu-Cu thermocompression. IMEC is upscaling the process for die-to-wafer bonding and is on track for migrating the process to its 300mm platform.



To evaluate the impact of the 3D SIC flow on the characteristics of the stacked layers, both the top and landing wafers contained CMOS circuits. Extensive tests confirmed that the performance of the circuits does not degrade with adding Cu TSVs and stacking. And to test the integrity and performance of the 3D stack, ring oscillators with varying configurations were made, distributed over the two chip layers and connected with the Cu TSVs. Tested after the TSV and stacking process, these circuits demonstrated the chips excellent integrity.



"With these tests, we have demonstrated that our technology allows designing and fabricating fully functional 3D SIC chips. We are now ready to accept reference test circuits from our industry partners," commented Eric Beyne, IMEC Scientific Director for 3D Technologies, "This will enable the industry to gain early insight and experience with 3D SIC design, using their own designs".

####

About IMEC
IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. IMEC vzw is headquartered in Leuven, Belgium, has a sister company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan, and representatives in Japan. Its staff of more than 1600 people includes more than 500 industrial residents and guest researchers. In 2007, its revenue (P&L) was EUR 244.5 million.

IMECís More Moore research aims at semiconductor scaling towards sub-32nm nodes. With its More than Moore research, IMEC looks into technologies for nomadic embedded systems, wireless autonomous transducer solutions, biomedical electronics, photovoltaics, organic electronics and GaN power electronics.

IMECís research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network worldwide position IMEC as a key partner for shaping technologies for future systems.

For more information, please click here

Contacts:
Katrien Marent
Director of External Communications
T: +32 16 28 18 80
Mobile : +32 474 30 28 66

Copyright © IMEC

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Shape matters when light meets atom: Mapping the interaction of a single atom with a single photon may inform design of quantum devices December 4th, 2016

UTSA study describes new minimally invasive device to treat cancer and other illnesses: Medicine diffusion capsule could locally treat multiple ailments and diseases over several weeks December 3rd, 2016

Novel Electrode Structure Provides New Promise for Lithium-Sulfur Batteries December 3rd, 2016

Research Study: MetaSOLTM Shatters Solar Panel Efficiency Forecasts with Innovative New Coating: Coating Provides 1.2 Percent Absolute Enhancement to Triple Junction Solar Cells December 2nd, 2016

Chip Technology

Shape matters when light meets atom: Mapping the interaction of a single atom with a single photon may inform design of quantum devices December 4th, 2016

Quantum obstacle course changes material from superconductor to insulator December 1st, 2016

Bumpy surfaces, graphene beat the heat in devices: Rice University theory shows way to enhance heat sinks in future microelectronics November 29th, 2016

Scientists shrink electron gun to matchbox size: Terahertz technology has the potential to enable new applications November 25th, 2016

Nanoelectronics

Supersonic spray yields new nanomaterial for bendable, wearable electronics: Film of self-fused nanowires clear as glass, conducts like metal November 23rd, 2016

What a twist: Silicon nanoantennas turn light around: The theoretical results will allow scientists to design nanodevices with extraordinary features for use in optoelectronics November 21st, 2016

2-D material a brittle surprise: Rice University researchers finds molybdenum diselenide not as strong as they thought November 14th, 2016

UCR researchers discover new method to dissipate heat in electronic devices: By modulating the flow of phonons through semiconductor nanowires, engineers can create smaller and faster devices November 13th, 2016

Discoveries

Shape matters when light meets atom: Mapping the interaction of a single atom with a single photon may inform design of quantum devices December 4th, 2016

UTSA study describes new minimally invasive device to treat cancer and other illnesses: Medicine diffusion capsule could locally treat multiple ailments and diseases over several weeks December 3rd, 2016

Novel Electrode Structure Provides New Promise for Lithium-Sulfur Batteries December 3rd, 2016

Research Study: MetaSOLTM Shatters Solar Panel Efficiency Forecasts with Innovative New Coating: Coating Provides 1.2 Percent Absolute Enhancement to Triple Junction Solar Cells December 2nd, 2016

Announcements

Shape matters when light meets atom: Mapping the interaction of a single atom with a single photon may inform design of quantum devices December 4th, 2016

UTSA study describes new minimally invasive device to treat cancer and other illnesses: Medicine diffusion capsule could locally treat multiple ailments and diseases over several weeks December 3rd, 2016

Novel Electrode Structure Provides New Promise for Lithium-Sulfur Batteries December 3rd, 2016

Research Study: MetaSOLTM Shatters Solar Panel Efficiency Forecasts with Innovative New Coating: Coating Provides 1.2 Percent Absolute Enhancement to Triple Junction Solar Cells December 2nd, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project