Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Ultratech Acquires Patents From IBM for Semiconductor Wafer Annealing

Abstract:
Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced that it has acquired the rights to a collection of patents from IBM -- these include fundamental patents around the area of rapid thermal annealing. Representing both U.S. and foreign patents, the portfolio includes hardware for thermal processing (annealing) of semiconductor wafers, as well as patents for temperature control and metrology. This acquisition strengthens and broadens Ultratech's annealing technology capability for ultra-shallow junction (USJ) formation -- a critical step in semiconductor manufacturing.

Ultratech Acquires Patents From IBM for Semiconductor Wafer Annealing

San Jose, CA | Posted on October 9th, 2008

"Ultratech has periodically purchased patents that it views are key to our business," noted Ultratech Chairman and CEO Arthur W. Zafiropoulo. "The acquisition of these patents from IBM is the continuation of that strategy to ensure that our customers receive the highest technology content in their products. This acquisition reinforces our commitment to remain at the forefront of providing equipment with leading-edge technology and low cost-of-ownership advantages for our global customer base."

Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "intends," "will," "could," "believes," "estimates," "continue," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; delays, deferrals and cancellations of orders by customers; cyclicality in the semiconductor and nanotechnology industries; general economic and financial market conditions including impact on capital spending; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; changes to financial accounting standards; changes in pricing by us, our competitors or suppliers; customer concentration; international sales; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; ability and resulting costs to attract or retain sufficient personnel to achieve our targets for a particular period; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon us achieving and maintaining profitability and the market price of our stock; mix of products sold; rapid technological change and the importance of timely product introductions; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2007 and Quarterly Report on Form 10Q for the quarter ended June 28, 2008. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to affect any event or circumstance that may arise after the date of this release.

####

About Ultratech, Inc.
Ultratech, Inc. (NASDAQ: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography, in addition to being a pioneer of laser processing. Its advanced-packaging lithography systems deliver strong cost-of-ownership, repeatability and throughput advantages, and are widely used worldwide in the fabrication of semiconductors and FPDs. Ultratech’s advanced laser processing technology is designed to enhance yields, while enabling a cost-effective transfer to 65-nm and below production, and is being integrated into the manufacturing lines of leading- edge semiconductor manufacturers.

For more information, please click here

Contacts:
Ultratech
3050 Zanker Road
San Jose, CA 95134
(800) 222-1213
(408) 321-8835
(408) 325-6444 Fax

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Iran Exports Nanodrugs to Syria November 24th, 2014

Iranian Experts Clean Uranium-Contaminated Water by Nano-Particles November 23rd, 2014

Novel Method Found for Connection of Metallic Alloys to Polymers November 23rd, 2014

New research project supports internationalisation in nano-research: Launch of new “Baltic Sea Network” November 22nd, 2014

Chip Technology

Nanometrics Announces Upcoming Investor Events November 19th, 2014

A novel method for identifying the body’s ‘noisiest’ networks November 19th, 2014

Researchers create & control spin waves, lifting prospects for enhanced info processing November 17th, 2014

VDMA Electronics Production Equipment: Growth track for 2014 and 2015 confirmed: Business climate survey shows robust industry sector November 14th, 2014

Announcements

Iran Exports Nanodrugs to Syria November 24th, 2014

Iranian Experts Clean Uranium-Contaminated Water by Nano-Particles November 23rd, 2014

Novel Method Found for Connection of Metallic Alloys to Polymers November 23rd, 2014

New research project supports internationalisation in nano-research: Launch of new “Baltic Sea Network” November 22nd, 2014

Patents/IP/Tech Transfer/Licensing

Dicerna Announces License Agreement with Tekmira to Advance Dicerna’s PH1 Development Program November 17th, 2014

First genetic-based tool to detect circulating cancer cells in blood: NanoFlares light up individual cells if breast cancer biomarker is present November 17th, 2014

Ki-Bum Lee Patents Technology To Advance Stem Cell Therapeutics November 13th, 2014

'Direct writing' of diamond patterns from graphite a potential technological leap November 5th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More












ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE