Home > Press > NextIO Names Virage Logic as Its Trusted IP Partner for 65-Nanometer Embedded Memories
Abstract:
Early Silicon Success with Virage Logic Semiconductor IP Drives Expanded Partnership to Advanced Process Node
NextIO Names Virage Logic as Its Trusted IP Partner for 65-Nanometer Embedded Memories
FREMONT, CA | Posted on September 29th, 2008
Virage Logic Corporation (NASDAQ:VIRL), the semiconductor industry's trusted IP partner, today announced that NextIO of Austin, Texas, having achieved first-pass silicon success using Virage Logic's semiconductor intellectual property (IP), has expanded its license to advance to 65-nanometer (nm) process technology. NextIO has selected Virage Logic's SiWare™ 65GP High-Density Memory Compilers and the Self-Test and Repair (STAR™) Memory System for use in its next-generation product portfolio.
"As a leader in the I/O virtualization marketplace, we need to deliver advanced products that meet customers' time-to-market requirements," said Rich Warwick, vice president of engineering and operations, NextIO. "We achieved first-pass success on our 130-nm Nexsis N2100 using Virage Logic IP and that first silicon is still in production with no changes two years later. To a startup company, first pass success is vital which means we must reduce risk with solid IP from companies like Virage Logic. Our track record combined with Virage Logic's reputation as a trusted IP partner gave us confidence to continue using them as we moved ahead to 65nm with our new designs. Using Virage Logic's silicon-proven memory IP portfolio, we can streamline development, lower costs, control risk, and plan for faster time-to-market."
NextIO is using Virage Logic's SiWare 65GP and DP High Density Memory Compilers, as well as the STAR Memory System, to design the 65nm next-generation NextIO I/O Virtualization (IOV) products that will be manufactured at TSMC. The aggressive design schedule calls for tape-out by the end of 2008.
"We measure our success using customer-oriented criteria, including successful first silicon, migration to more advanced semiconductor processes, and the expansion of our trusted partnerships. NextIO is accomplishing all three at once," said Brani Buric, executive vice president of marketing, Virage Logic. "We recognize the success NextIO has had with the Nexsis N2100 and are proud to partner with them as they advance into 65nm devices."
About Virage Logic SiWare Memory Compilers and STAR Memory System
Virage Logic's SiWare products help IC designers to manage the tradeoffs in performance, device area, power consumption and statistical yield to identify the optimal balance for their specific design, select the ideal solution and proceed with confidence to silicon. The STAR Memory System integrates an embedded test-and-repair infrastructure to speed system-on-chip (SoC) time-to-volume and boost the yield percentages of good die per wafer. The STAR Memory System is proven to reduce tape-out schedules for new complex SoCs by weeks to help reduce overall time-to-volume production.
About NextIO
NextIO, Inc. is the premier provider of I/O gateway virtualization solutions for the data center and other dense computing environments. Led by a team of industry veterans, NextIO is based in Austin, Texas. NextIO recently announced its new AdaptiveConnect Architecture. For more information, call 512-439-5350 or visit www.nextio.com.
####
About Virage Logic Corporation
Virage Logic is a leading provider of semiconductor intellectual property (IP) for the design of complex integrated circuits. The company’s highly differentiated product portfolio includes embedded SRAMs, embedded NVMs, embedded test and repair, logic libraries, memory development software, and DDR memory controller subsystems. As the industry’s trusted semiconductor IP partner, foundries, IDMs and fabless customers rely on Virage Logic to achieve higher performance, lower power, higher density and optimal yield, as well as shorten time-to-market and time-to-volume.
All trademarks are the property of their respective owners and are protected herein.
For more information, please click here
Contacts:
Virage Logic Corporation
Sabina Burns
510-743-8115
or
NextIO
Paul JJ Payack
512-439-8500
Copyright © Business Wire 2008
If you have a comment, please
Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Bookmark:
News and information
Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013
NanoInk, Inc. Assets To Be Sold May 18th, 2013
Beautiful "flowers" self-assemble in a beaker: Elaborate nanostructures blossom from a chemical reaction perfected at Harvard May 17th, 2013
Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013
Chip Technology
UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013
Nanometrics Announces Upcoming Investor Events May 14th, 2013
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013
Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013
Announcements
Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013
NanoInk, Inc. Assets To Be Sold May 18th, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013
Alliances/Partnerships/Distributorships
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013
Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013