Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > SUSS MicroTec Announces ISO 9001:2000 Certification

Abstract:

GARCHING, Germany - (Business Wire) SUSS MicroTec.(FWB:SMH)(GER:SMH), a leading supplier for process and test solutions for the semiconductor industry announces that SUSS MicroTec Inc., manufacturer and supplier of production and process wafer bonding systems, now holds the globally recognized ISO 9001 certification for having established a high level process and system-oriented quality management (QM) based on ISO 9001 standards. Proceeding the ISO certification of SUSS MicroTec Lithography GmbH in 2007, another division of the SUSS MicroTec group has been certified for international quality standards. This is in line with on-going efforts to increase efficiency and alignment within the SUSS MicroTec group.

SUSS MicroTec Announces ISO 9001:2000 Certification

GARCHING, Germany | Posted on September 18th, 2008

SUSS MicroTec Inc., based in Vermont, is the Bonder Division headquarters and North American sales and service site for all SUSS products. The fastest growing division of the SUSS MicroTec group, the Bonder Division develops and manufactures wafer bonders for high-volume MEMS and Semiconductor markets.

The ISO 9000 series of standards represents an international consensus of quality management practices. Providing a consistent set of criteria for the development and acceptance of corrective action and responses is a part of the audit process. This has assisted SUSS MicroTec in their drive to managing their manufacturing process effectively and giving customers continued confidence. The ISO certification validates the effectiveness and strength of SUSS MicroTec's quality management systems as well as their assurance of continuous improvement.

"Achieving ISO 9001-2000 certification reflects our dedication and on-going commitment.", said Wilfried Bair, VP Business Development and General Manager, Bonder Division, "It shows our customers that we are producing leading-edge and top quality wafer processing equipment covering all steps from design and development, to manufacturing, installation and after-sales support."

####

About SUSS MicroTec.
SUSS MicroTec listed in Deutsche Börse AG’s Prime Standard is one of the world’s leading suppliers of process and testing solutions for markets such as 3D Integration, advanced packaging, MEMS, nanotechnology and compound semiconductor. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions.

SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service.

For more information, please click here

Contacts:
SUSS MicroTec AG
Sabine Radeboldt
+49 (0) 89 32007-395
Corporate Marketing Manager

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

CiQUS researchers design an artificial nose to detect DNA differentiation with single nucleotide resolution September 18th, 2014

Big Results Require Big Ambitions: Three young UCSB faculty receive CAREER awards from the National Science Foundation September 18th, 2014

FEI Opens New Technology Center in Czech Republic: FEI expands its presence in Brno with the opening of a new, larger facility September 18th, 2014

Biosensors Get a Boost from Graphene Partnership: $5 Million Investment Supports Dozens of Jobs and Development of 300mm Fabrication Process and Wafer Transfer Facility September 18th, 2014

Chip Technology

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

‘Small’ transformation yields big changes September 16th, 2014

Excitonic Dark States Shed Light on TMDC Atomic Layers: Berkeley Lab Discovery Holds Promise for Nanoelectronic and Photonic Applications September 11th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

Announcements

Wear-resistant ceramic powder maximises component lifespan in high-stress applications: Innovnano’s nanostructured 3YSZ offers improved tribological performance for manufacturing components September 18th, 2014

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

FEI Opens New Technology Center in Czech Republic: FEI expands its presence in Brno with the opening of a new, larger facility September 18th, 2014

Biosensors Get a Boost from Graphene Partnership: $5 Million Investment Supports Dozens of Jobs and Development of 300mm Fabrication Process and Wafer Transfer Facility September 18th, 2014

Tools

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

FEI Opens New Technology Center in Czech Republic: FEI expands its presence in Brno with the opening of a new, larger facility September 18th, 2014

New NPZ100-403 Piezo Stage from nPoint Inc. September 17th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE