Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > IBM and NEC Electronics Sign Agreement for Joint Development of Next-Generation Semiconductor Process Technology

Abstract:
IBM Corporation (NYSE: IBM) and NEC Electronics Corporation (TSE: 6723) today announced they have entered into a multi-year joint development agreement under which they will develop next-generation semiconductor process technology.

IBM and NEC Electronics Sign Agreement for Joint Development of Next-Generation Semiconductor Process Technology

ARMONK, NY and KAWASAKI, JAPAN | Posted on September 11th, 2008

Under the agreement, NEC Electronics will participate in a joint development project for the next-generation core CMOS process, at the 32-nm node, and in advanced fundamental research for leading-edge semiconductor technologies of the future.

NEC Electronics will be the eighth major semiconductor manufacturer represented in the IBM joint development alliance aimed to further advance performance and power improvements for next generation silicon technologies.

"As the 'scaling' of semiconductors to ever smaller feature sizes continues, the cost of conducting basic research and development and the associated capital investment continues to rise," said Gary Patton, vice president, IBM Semiconductor Research & Development Center. "Our unique collaborative model for semiconductor research and development helps to mitigate individual investment while allowing for increased design complexity, shortened time-to-market and quicker integration of next-generation process materials and technology nodes."

NEC Electronics co-develops the 45-nm and 32-nm CMOS process technology nodes with Toshiba Corporation and is now extending that scope of collaboration to include the 32-nm and finer nodes with IBM and its alliance partners. NEC Electronics intends to work with IBM and its research partners to develop a common process platform, and strengthen development and design ability in System-on-Chip (SoC).

"At the highest levels of technology, it is becoming increasingly difficult for semiconductor companies to differentiate their products on the core CMOS process technologies alone. A better course is to share the development costs of a common process platform with leading semiconductor manufacturers from around the world," said Toshio Nakajima, President and CEO, NEC Electronics. "The new agreement with IBM means that NEC Electronics will develop a common semiconductor process with industry leaders, allowing us to focus on being first to market in areas of eDRAM products and SoC solutions that provide our customers with the added value, such as high reliability and low power consumption."

The work will be conducted at IBM's state-of-the-art 300 millimeter (mm) semiconductor fabrication facility in East Fishkill, N.Y. and at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, State University of New York. CNSE's Albany NanoTech is the world's most advanced university-based nanoelectronics research complex.

Earlier this year, IBM and its partners unveiled significant performance and power advantages over industry standards by using a breakthrough material known as "high-k/metal gate" (HKMG) on silicon manufactured at IBM's 300 millimeter semiconductor fabrication facility in East Fishkill, N.Y. By implementing "high-k/metal gate" technology into its leading edge 32-nm technology node, the alliance has assessed performance improvements in circuits of up to 35 percent over 45-nm technology at the same operating voltage. The 32-nm power reduction over 45-nm can be as much as 30 to 50 percent depending on the operating voltage.

IBM's other joint development partners include, Chartered Semiconductor Manufacturing Ltd. (Chartered), Freescale Inc., Infineon Technologies AG, Samsung Electronics Co., Ltd. (Samsung), STMicroelectronics N.V. and Toshiba Corporation.

####

For more information, please click here

Contacts:
Michael Loughran
IBM Media Relations
914-945-1613


Hisashi Saito
NEC Electronics Corporation
+81 44-435-1676 (Japan)

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Iran to Hold 3rd Int'l Engineering Materials, Metallurgy Conference October 25th, 2014

Haydale Secures Exclusive Development and Supply Agreement with Tantec A/S: New reactors to be built and commissioned by Tantec A/S represent another step forward towards the commercialisation of graphene October 24th, 2014

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

SUNY Polytechnic Institute Invites the Public to Attend its Popular Statewide 'NANOvember' Series of Outreach and Educational Events October 23rd, 2014

Chip Technology

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

Strengthening thin-film bonds with ultrafast data collection October 23rd, 2014

NIST offers electronics industry 2 ways to snoop on self-organizing molecules October 22nd, 2014

Materials for the next generation of electronics and photovoltaics: MacArthur Fellow develops new uses for carbon nanotubes October 21st, 2014

Announcements

Iran to Hold 3rd Int'l Engineering Materials, Metallurgy Conference October 25th, 2014

Haydale Secures Exclusive Development and Supply Agreement with Tantec A/S: New reactors to be built and commissioned by Tantec A/S represent another step forward towards the commercialisation of graphene October 24th, 2014

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

Strengthening thin-film bonds with ultrafast data collection October 23rd, 2014

Alliances/Partnerships/Distributorships

European Commission opens the gate towards the implementation of Nanomedicine Translation Hub October 16th, 2014

IRLYNX and CEA-Leti to Streamline New CMOS-based Infrared Sensing Modules Dedicated to Human-activities Characterization October 15th, 2014

New VDMA Association "Electronics, Micro and Nano Technologies" founded: Inaugural Meeting in Frankfurt/Main, Germany October 15th, 2014

VDMA photonics steering committee with new members stronger than ever October 14th, 2014

Research partnerships

NYU Researchers Break Nano Barrier to Engineer the First Protein Microfiber October 23rd, 2014

Nanoparticle technology triples the production of biogas October 23rd, 2014

RF Heating of Magnetic Nanoparticles Improves the Thawing of Cryopreserved Biomaterials October 23rd, 2014

Brookhaven Lab Launches Computational Science Initiative:Leveraging computational science expertise and investments across the Laboratory to tackle "big data" challenges October 22nd, 2014

NanoNews-Digest
The latest news from around the world, FREE





  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE