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Home > Press > SEMATECH to Host 3D IC Workshop on Manufacturing and Reliability September 25-26

Abstract:
Experts to Address Critical Challenges for Introduction of 3D IC Products

SEMATECH to Host 3D IC Workshop on Manufacturing and Reliability September 25-26

Albany, NY and Austin, TX | Posted on August 18th, 2008

SEMATECH will host global experts representing a broad spectrum of the semiconductor industry at a workshop designed to explore manufacturing and reliability challenges for three-dimensional integrated circuit (3D IC) products. The forum, entitled "Manufacturing and Reliability Challenges for 3D ICs using TSVs," will be held in conjunction with the Advanced Metallization Conference, September 25 and 26, at the Del Mar Fairgrounds in San Diego, California.

The workshop will feature informative sessions on applications, manufacturing processes, and reliability issues of through silicon via (TSV) technology. Participants from various disciplines will have the opportunity to address and actively discuss challenges of 3D IC integration with TSV, including physical design, processing options, failure mechanisms, and practical issues that impact cost, schedule, and performance.

"We are very excited to support the growth of this enabling technology by bringing together some of the industry's leading researchers and practitioners to stimulate discussion on the real-world manufacturing and reliability challenges of TSVs," said Larry Smith, committee chairman and SEMATECH's 3D reliability and product interlock expert. "Our goals are to identify key challenges so that 3D IC products can be introduced on schedule with the expected cost, performance and reliability."

The workshop curriculum includes technical presentations and a poster session led by key representatives from IBM, Qualcomm, Atotech, TechSearch, SUSS MicroTech, Alchimer, AllVia, University of Texas at Austin, Rensselaer Polytechnic Institute, Fraunhofer IZM, SINTEF, NXP Semiconductors, Ebara, Tango, Air Products, STS, Applied Materials, EV Group and PVA-Tepla.

3D ICs using TSV have the potential to play a very important role in semiconductor manufacturing. TSVs can improve electrical performance, lower power consumption, enable the integration of heterogeneous devices, shrink device size, and reduce cost. SEMATECH hosts a variety of forums to accelerate the adoption of these technologies and to drive industry consensus on the different 3D options. SEMATECH's 3D program encompasses equipment evaluations, unit processes, integration and metrology.

Registration for this event is open to both SEMATECH members and the general public. For more information on the September workshop, including registration and other relevant information, please visit: www.sematech.org/meetings/announcements/8510/.

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About SEMATECH
For 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
SEMATECH
Erica McGill
518-956-7446

Copyright © Business Wire 2008

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