Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > SEMATECH to Host 3D IC Workshop on Manufacturing and Reliability September 25-26

Abstract:
Experts to Address Critical Challenges for Introduction of 3D IC Products

SEMATECH to Host 3D IC Workshop on Manufacturing and Reliability September 25-26

Albany, NY and Austin, TX | Posted on August 18th, 2008

SEMATECH will host global experts representing a broad spectrum of the semiconductor industry at a workshop designed to explore manufacturing and reliability challenges for three-dimensional integrated circuit (3D IC) products. The forum, entitled "Manufacturing and Reliability Challenges for 3D ICs using TSVs," will be held in conjunction with the Advanced Metallization Conference, September 25 and 26, at the Del Mar Fairgrounds in San Diego, California.

The workshop will feature informative sessions on applications, manufacturing processes, and reliability issues of through silicon via (TSV) technology. Participants from various disciplines will have the opportunity to address and actively discuss challenges of 3D IC integration with TSV, including physical design, processing options, failure mechanisms, and practical issues that impact cost, schedule, and performance.

"We are very excited to support the growth of this enabling technology by bringing together some of the industry's leading researchers and practitioners to stimulate discussion on the real-world manufacturing and reliability challenges of TSVs," said Larry Smith, committee chairman and SEMATECH's 3D reliability and product interlock expert. "Our goals are to identify key challenges so that 3D IC products can be introduced on schedule with the expected cost, performance and reliability."

The workshop curriculum includes technical presentations and a poster session led by key representatives from IBM, Qualcomm, Atotech, TechSearch, SUSS MicroTech, Alchimer, AllVia, University of Texas at Austin, Rensselaer Polytechnic Institute, Fraunhofer IZM, SINTEF, NXP Semiconductors, Ebara, Tango, Air Products, STS, Applied Materials, EV Group and PVA-Tepla.

3D ICs using TSV have the potential to play a very important role in semiconductor manufacturing. TSVs can improve electrical performance, lower power consumption, enable the integration of heterogeneous devices, shrink device size, and reduce cost. SEMATECH hosts a variety of forums to accelerate the adoption of these technologies and to drive industry consensus on the different 3D options. SEMATECH's 3D program encompasses equipment evaluations, unit processes, integration and metrology.

Registration for this event is open to both SEMATECH members and the general public. For more information on the September workshop, including registration and other relevant information, please visit: www.sematech.org/meetings/announcements/8510/.

####

About SEMATECH
For 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
SEMATECH
Erica McGill
518-956-7446

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

First Observation of Electronic Structure in Ag-Rh Alloy Nanoparticles Having Hydrogen Absorbing: Storage Property –Attempting to solve the mystery of why Ag-Rh alloy nanoparticles have a similar property to Pd– October 30th, 2014

Iranians Present Model to Predict Photocatalytic Process in Removal of Pollutants October 30th, 2014

Production of Biocompatible Polymers in Iran October 30th, 2014

Amorphous Coordination Polymer Particles as alternative to classical nanoplatforms for nanomedicine October 30th, 2014

Chip Technology

Sussex physicists find simple solution for quantum technology challenge October 28th, 2014

Watching the hidden life of materials: Ultrafast electron diffraction experiments open a new window on the microscopic world October 27th, 2014

Breakthrough in molecular electronics paves the way for DNA-based computer circuits in the future: DNA-based programmable circuits could be more sophisticated, cheaper and simpler to make October 27th, 2014

QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014

Announcements

First Observation of Electronic Structure in Ag-Rh Alloy Nanoparticles Having Hydrogen Absorbing: Storage Property –Attempting to solve the mystery of why Ag-Rh alloy nanoparticles have a similar property to Pd– October 30th, 2014

Iranians Present Model to Predict Photocatalytic Process in Removal of Pollutants October 30th, 2014

Production of Biocompatible Polymers in Iran October 30th, 2014

Amorphous Coordination Polymer Particles as alternative to classical nanoplatforms for nanomedicine October 30th, 2014

Events/Classes

New Compact SIMS at 61st AVS | Visit us on Booth 311 October 28th, 2014

Iran to Hold 3rd Int'l Engineering Materials, Metallurgy Conference October 25th, 2014

Iran-Made Respiratory Nano Masks Provided to Hajj Pilgrims October 23rd, 2014

MEMS & Sensors Technology Showcase: Finalists Announced for MEMS Executive Congress US 2014 October 23rd, 2014

NanoNews-Digest
The latest news from around the world, FREE





  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE