Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Nextreme Raises $13 Million in Series B Financing

Abstract:
New Funding Sets the Stage for High-Volume Manufacturing of Thin-Film Thermoelectric Devices…

Nextreme Raises $13 Million in Series B Financing

DURHAM, NC | Posted on August 6th, 2008

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced securing $13 million in Series B financing. The round was led by Chart Venture Partners and included previous investors Redshift Venture Partners, Harris & Harris Group, Inc., In-Q-Tel and RTI International as well as Japan-based ITOCHU Corporation (JP:8001) and ITOCHU Technology Ventures, Inc. The funding will be used to ramp Nextreme's products into full production in 2009 in response to demand from the photonics and military markets, and to develop new products for the computing, consumer and mobile markets.

Nextreme is focused on solving the thermal issues that are becoming more widespread in the electronics industry. As an example, a major producer of graphics processors said recently that some of its notebook-use graphics chips failed because the packaging materials could not withstand the "extreme thermal environments" brought about by a combination of inadequate thermal management and frequent power cycling seen in notebook computers. This environment is particularly challenging for complex graphics processors. The company will take a one-time charge of $150M-$200M during its second quarter (2008) to resolve the problem with its customers.

"There are very few breakthrough innovations in the market today addressing these industry-wide thermal issues," said Ted Hobart, partner with Chart Venture Partners (CVP). CVP is a $100M early stage venture capital fund investing in security-related technologies with government and commercial applications. "Nextreme is managed by an accomplished start-up team and offers a highly differentiated technology backed by a very strong intellectual property position."

Nextreme began shipping its first product in October of 2007 and recently brought up production in a new facility.

"We are very pleased with where we are now positioned," said Jesko von Windheim, CEO of Nextreme. "We are seeing strong interest in the OptoCooler UPF4 and UPF40 products and anticipate design wins in the telecom industry this year. With financing in place and production up and running, we can concentrate fully on making that happen."

Extremely Thin Thermoelectrics

Nextreme's thin-film thermoelectric products are manufactured in volume with the Thermal Copper Pillar Bump process, an established electronic packaging approach that scales well into large arrays. The Thermal Copper Pillar Bump process integrates thin-film thermoelectric material into the solder bumped interconnects that provide mechanical and electrical connections for today's high performance/high density integrated circuits.

"Customer adoption is always a risk for a new product," said Kristin Abkemeier, Ph.D., analyst at Lux Research, Inc., in the August 11, 2008 Lux Research Nanomaterials Journal. "Enabling it to be incorporated into existing designs with as little change as possible is a good strategy for getting through the customer's front door - and inspiring further redesigns later on. Companies that have bumped up against performance limitations due to thermal management issues should engage with Nextreme to find a possible way to sidestep these issues."

In addition to the $13M Series B funding, Nextreme raised $14M in Series A financing ending in 2007.

For more information, contact Nextreme at 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031; call (919)-597-7300; e-mail ; or go to www.nextreme.com.

####

About Nextreme Thermal Solutions™, Inc.
Nextreme Thermal Solutions designs and manufactures microscale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. The company has embedded cooling, temperature control and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Nextreme’s breakthrough addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme will change the future of thermal and power management for the entire electronics industry.

Nextreme is managed by an experienced start-up team and world-renowned experts in electronic packaging, thermal management and pillar bump technology. The company has 38 employees and is based near Research Triangle Park, North Carolina.

For additional information or to request the electronic image, please email or call 919-872-8172.

For more information, please click here

Contacts:
Nextreme Thermal Solutions, Inc.
Karl von Gunten
919-597-7348

or
BtB Marketing Communications
Beth Gaddy
919-872-8172

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Finding a new formula for concrete: Researchers look to bones and shells as blueprints for stronger, more durable concrete May 26th, 2016

Deep Space Industries and SFL selected to provide satellites for HawkEye 360’s Pathfinder mission: The privately-funded space-based global wireless signal monitoring system will be developed by Deep Space Industries and UTIAS Space Flight Laboratory May 26th, 2016

Thin films

Light can 'heal' defects in new solar cell materials: Defects in some new electronic materials can be removed by making ions move under illumination May 24th, 2016

Graphene: A quantum of current - When current comes in discrete packages: Viennese scientists unravel the quantum properties of the carbon material graphene May 20th, 2016

New research shows how silver could be the key to gold-standard flexible gadgets: Silver nanowires are an ideal material for current and future flexible touch-screen technologies May 13th, 2016

Solliance realizes first up-scaled Perovskite based PV modules with 10% efficiency: Holst Centre, imec and ECN pave the road to upscaling Perovskite PV modules May 10th, 2016

Flipping a chemical switch helps perovskite solar cells beat the heat April 26th, 2016

VC/Funding/Angel financing/Loans/Leases/Crowdfunding

Oxford Nanoimaging to provide desktop super-resolution microscopes May 10th, 2016

ORIG3N Added to Companies Presenting at Harris & Harris Group's Annual Meeting, Tuesday June 7, 2016, the New York Genome Center April 27th, 2016

Chip Technology

Gigantic ultrafast spin currents: Scientists from TU Wien (Vienna) are proposing a new method for creating extremely strong spin currents. They are essential for spintronics, a technology that could replace today's electronics May 25th, 2016

Diamonds closer to becoming ideal semiconductors: Researchers find new method for doping single crystals of diamond May 25th, 2016

Dartmouth team creates new method to control quantum systems May 24th, 2016

Attosecond physics: A switch for light-wave electronics May 24th, 2016

Announcements

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Finding a new formula for concrete: Researchers look to bones and shells as blueprints for stronger, more durable concrete May 26th, 2016

Deep Space Industries and SFL selected to provide satellites for HawkEye 360’s Pathfinder mission: The privately-funded space-based global wireless signal monitoring system will be developed by Deep Space Industries and UTIAS Space Flight Laboratory May 26th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic