Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Technologists Assess 3D Interconnect Technologies and Equipment Readiness at SEMATECH Workshop during SEMICON West

Abstract:
A host of industry experts involved in the development and implementation of 3D interconnect technology gathered at a SEMATECH-led workshop to explore equipment challenges for 3D interconnect, comparing application requirements to those proposed by the International Technology Roadmap for Semiconductors (ITRS).

Technologists Assess 3D Interconnect Technologies and Equipment Readiness at SEMATECH Workshop during SEMICON West

Albany, NY | Posted on July 22nd, 2008

The workshop entitled "Equipment Challenges for 3D Interconnect," conducted on July 16th during SEMICON West, attracted approximately 70 IC manufacturers, equipment suppliers and industry experts. The goals of the workshop were to explore the challenges for making wafer processing equipment capable for 3D interconnects.

Presentations were given by technologists representing Qualcomm, EV Group, Accretech, Suss MicroTec, Sonix, NEXX Systems, and Applied Materials. Presenters focused on highlighting cost and performance challenges for the technology's viability, affordability, and schedule, including topics such as 3D lithography, wafer bonding/aligning, wafer polishing/grinding, 300mm bonded wafer metrology, 300mm wafer copper plating and 300mm wafer thru silicon via (TSV) integration.

"We are extremely encouraged that such high caliber companies and individuals participated in the event," said Sitaram Arkalgud, SEMATECH's 3D director. "Through SEMATECH's 3D Interconnect program and workshops such as this, attendees can compare progress and develop an assessment on integration approaches, process architectures, and tool sets that will make 3D-TSV commercially viable."

The 2007 ITRS roadmap forecasts high density TSV pitches ranging from approximately 4.5 microns in 2008 to approximately 2.5 microns in 2012. Through a panel discussion, the workshop provided extensive readiness assessments of 3D roadmaps and standards that are currently driving industry-wide initiatives. Specifically, although integrated device manufacturing participants acknowledged the ITRS density targets are aggressive, the equipment suppliers were generally positive about their ability to achieve these goals.

Andrew Rudack, SEMATECH's 3D equipment process engineer and workshop chair said, "We must have the 3D tooling infrastructure available, and address the equipment concerns that have to be resolved before volume manufacturing can take place."

SEMATECH's 3D Interconnect program was established to drive the semiconductor industry's most comprehensive investigation of the potentials of 3D interconnects using TSV. In effort to explore the different 3D options, including wafer-to-wafer and die-to-wafer integration, SEMATECH hosts a variety of forums and projects to help define and map 3D technology options, develop unit processes and metrology, and ultimately demonstrate 3D's manufacturability and reliability. To learn more about SEMATECH's 3D interconnect program and its upcoming meetings, please visit www.sematech.org/research/3D/index.htm.

####

About SEMATECH
For 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
SEMATECH
Erica McGill
518-956-7446

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Scientists open door to better solar cells, superconductors and hard-drives: Research enhances understanding of materials interfaces April 14th, 2014

Obducat has launched a new generation of SINDRE® Nano Imprint production system April 11th, 2014

Scientists in Singapore develop novel ultra-fast electrical circuits using light-generated tunneling currents April 10th, 2014

Clean Shot at Manufacturing Course…For Less April 9th, 2014

Announcements

UT Arlington physicist creates new nanoparticle for cancer therapy April 16th, 2014

Relieving electric vehicle range anxiety with improved batteries: Lithium-sulfur batteries last longer with nanomaterial-packed cathode April 16th, 2014

Aerotech X-Y ball-screw stage for economical high performance Planar positioning April 16th, 2014

Energy Research Facility Construction Project at Brookhaven Lab Wins U.S. Energy Secretary's Achievement Award April 16th, 2014

Tools

Aerotech X-Y ball-screw stage for economical high performance Planar positioning April 16th, 2014

Malvern reports on the publication of the 1000th peer-reviewed paper to cite NanoSight’s Nanoparticle Tracking Analysis, NTA April 16th, 2014

JPK announces expansion of its global sales and service activities in China and USA April 15th, 2014

Affordable High Precision XY Nanopositioning Piezo Stage April 15th, 2014

Events/Classes

'Life Redesigned: The Emergence of Synthetic Biology' Lecture at Brookhaven Lab on Wednesday, April 30: Biomedical Engineer James Collins to Speak for BSA Distinguished Lecture Series April 16th, 2014

ECHA Planning Workshop on Regulatory Challenges in the Risk Assessment of Nanomaterials April 16th, 2014

Engineers develop new materials for hydrogen storage April 15th, 2014

Near-field Nanophotonics Workshop in Boston April 14th, 2014

NanoNews-Digest
The latest news from around the world, FREE







  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE