Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips with Extensa PVD System

The Applied Endura Extensa PVD system's unique titanium/titanium nitride process technology delivers the essential barrier films needed for fabricating copper interconnects in sub-55nm memory chips. (Photo: Business Wire)
The Applied Endura Extensa PVD system's unique titanium/titanium nitride process technology delivers the essential barrier films needed for fabricating copper interconnects in sub-55nm memory chips. (Photo: Business Wire)

Abstract:
Applied Materials, Inc. today announced its Applied Endura® Extensa™ PVD1, the industry's only production-worthy system for depositing the critical barrier films for copper interconnects in sub-55nm memory chips. The Extensa system's unique titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with benchmark step coverage and <3% film thickness non-uniformity across the wafer, while achieving best-in-class defectivity and >25% lower CoC2 than competing systems.

Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips with Extensa PVD System

SANTA CLARA, CA | Posted on July 15th, 2008

"The introduction of copper in memory devices presents unique film integration challenges due to the high voltages and dense packing requirements of memory cells," said Prabu Raja, vice president and general manager of Applied's Metal Deposition Products division. "Manufacturers are adopting new liner/barrier schemes as the most cost-effective way to get the performance benefits of copper. The Extensa system enables the robust integration of these critical new diffusion barriers with a proven, single-system solution that allows memory makers to realize high device yields down to the 32nm technology node and beyond."

The Applied Extensa system's outstanding performance, already proven at multiple customer sites, is the result of several innovations in PVD technology that are implemented on the Extensa Ti/TiN deposition chamber. A novel dual-magnet PVD source with flux-shaping side electromagnets enables unmatched step coverage and defectivity below 10 particles at ≥0.12 micrometer. The proprietary source technology also makes more efficient use of deposition material, delivering a 30% improvement in target life. In addition, the single piece chamber kit features Applied's proprietary CleanCoat™ technology for ease of maintenance and particle control.

Integrated on the highly successful Applied Endura platform, the Extensa technology offers Ti/TiN deposition solutions to support two key technology transitions in memory: the replacement of tantalum with Ti-based dielectric barriers in copper barrier/seed applications, and the introduction of copper-aluminum and copper-tungsten diffusion barriers that enable the most cost effective integration of copper with aluminum layers and tungsten vias.

Additional applications include contact liner for memory devices and, for logic customers, metal gate and silicide cap barrier deposition. The unique flexibility of the Endura architecture enables the industry's only integrated copper-aluminum barrier and aluminum fill solution on a single system. For more information, visit appliedmaterials.com/products/endura_extensa.html.

1 PVD = physical vapor deposition

2 CoC = cost of consumables

####

About Applied Materials, Inc.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live.

For more information, please click here

Contacts:
Applied Materials, Inc.
Betty Newboe
408-563-0647 (editorial/media)
Linda Heller
408-986-7977 (financial community)

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

CubeSat Structures Competition Opens Space Design to Students of the World December 16th, 2017

Record high photoconductivity for new metal-organic framework material December 15th, 2017

Error-free into the quantum computer age December 15th, 2017

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Chip Technology

Error-free into the quantum computer age December 15th, 2017

Columbia engineers create artificial graphene in a nanofabricated semiconductor structure: Researchers are the first to observe the electronic structure of graphene in an engineered semiconductor; finding could lead to progress in advanced optoelectronics and data processing December 13th, 2017

UCLA chemists synthesize narrow ribbons of graphene using only light and heat: Tiny structures could be next-generation solution for smaller electronic devices December 8th, 2017

Device makes power conversion more efficient: New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid December 8th, 2017

Announcements

CubeSat Structures Competition Opens Space Design to Students of the World December 16th, 2017

Record high photoconductivity for new metal-organic framework material December 15th, 2017

Error-free into the quantum computer age December 15th, 2017

Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones: Fitted on a Mass-Market Microcontroller, 360Fusion Software Technology Detects any Dynamic Obstacle and Helps Guide Drones Away from Collisions December 15th, 2017

Tools

Perking up and crimping the 'bristles' of polyelectrolyte brushes December 13th, 2017

Untangling DNA: Researchers filter the entropy out of nanopore measurements December 8th, 2017

JPK Instruments announce partnership with Swiss company, Cytosurge AG. The partnership makes Cytosurge’s FluidFM® technology available on the JPK NanoWizard® AFM platform December 8th, 2017

Researchers advance technique to detect ovarian cancer: Rice, MD Anderson use fluorescent carbon nanotube probes to achieve first in vivo success November 30th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project