Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips with Extensa PVD System

The Applied Endura Extensa PVD system's unique titanium/titanium nitride process technology delivers the essential barrier films needed for fabricating copper interconnects in sub-55nm memory chips. (Photo: Business Wire)
The Applied Endura Extensa PVD system's unique titanium/titanium nitride process technology delivers the essential barrier films needed for fabricating copper interconnects in sub-55nm memory chips. (Photo: Business Wire)

Abstract:
Applied Materials, Inc. today announced its Applied Endura® Extensa™ PVD1, the industry's only production-worthy system for depositing the critical barrier films for copper interconnects in sub-55nm memory chips. The Extensa system's unique titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with benchmark step coverage and <3% film thickness non-uniformity across the wafer, while achieving best-in-class defectivity and >25% lower CoC2 than competing systems.

Applied Materials Delivers Critical Copper Barrier Technology for Memory Chips with Extensa PVD System

SANTA CLARA, CA | Posted on July 15th, 2008

"The introduction of copper in memory devices presents unique film integration challenges due to the high voltages and dense packing requirements of memory cells," said Prabu Raja, vice president and general manager of Applied's Metal Deposition Products division. "Manufacturers are adopting new liner/barrier schemes as the most cost-effective way to get the performance benefits of copper. The Extensa system enables the robust integration of these critical new diffusion barriers with a proven, single-system solution that allows memory makers to realize high device yields down to the 32nm technology node and beyond."

The Applied Extensa system's outstanding performance, already proven at multiple customer sites, is the result of several innovations in PVD technology that are implemented on the Extensa Ti/TiN deposition chamber. A novel dual-magnet PVD source with flux-shaping side electromagnets enables unmatched step coverage and defectivity below 10 particles at ≥0.12 micrometer. The proprietary source technology also makes more efficient use of deposition material, delivering a 30% improvement in target life. In addition, the single piece chamber kit features Applied's proprietary CleanCoat™ technology for ease of maintenance and particle control.

Integrated on the highly successful Applied Endura platform, the Extensa technology offers Ti/TiN deposition solutions to support two key technology transitions in memory: the replacement of tantalum with Ti-based dielectric barriers in copper barrier/seed applications, and the introduction of copper-aluminum and copper-tungsten diffusion barriers that enable the most cost effective integration of copper with aluminum layers and tungsten vias.

Additional applications include contact liner for memory devices and, for logic customers, metal gate and silicide cap barrier deposition. The unique flexibility of the Endura architecture enables the industry's only integrated copper-aluminum barrier and aluminum fill solution on a single system. For more information, visit appliedmaterials.com/products/endura_extensa.html.

1 PVD = physical vapor deposition

2 CoC = cost of consumables

####

About Applied Materials, Inc.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live.

For more information, please click here

Contacts:
Applied Materials, Inc.
Betty Newboe
408-563-0647 (editorial/media)
Linda Heller
408-986-7977 (financial community)

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Advantest to Exhibit at SEMICON Korea in Seoul, South Korea February 4-6 Showcasing Broad Portfolio of Semiconductor Products, Technologies and Solutions January 29th, 2015

Park Systems Announces Innovations in Bio Cell Analysis with the Launch of Park NX-Bio, the only 3-in-1 Imaging Nanoscale Tool Available for Life Science Researchers January 29th, 2015

2015 Nanonics Image Contest January 29th, 2015

Iranian Scientists Use MOFs to Eliminate Dye Pollutants January 29th, 2015

Chip Technology

Creating new materials with quantum effects for electronics January 29th, 2015

Advantest to Exhibit at SEMICON Korea in Seoul, South Korea February 4-6 Showcasing Broad Portfolio of Semiconductor Products, Technologies and Solutions January 29th, 2015

Nanometrics to Present at the Stifel 2015 Technology, Internet and Media Conference January 27th, 2015

New pathway to valleytronics January 27th, 2015

Announcements

Advantest to Exhibit at SEMICON Korea in Seoul, South Korea February 4-6 Showcasing Broad Portfolio of Semiconductor Products, Technologies and Solutions January 29th, 2015

Park Systems Announces Innovations in Bio Cell Analysis with the Launch of Park NX-Bio, the only 3-in-1 Imaging Nanoscale Tool Available for Life Science Researchers January 29th, 2015

2015 Nanonics Image Contest January 29th, 2015

Iranian Scientists Use MOFs to Eliminate Dye Pollutants January 29th, 2015

Tools

Hiden Gas Analysers at PITTCON 2015 | Visit us on Booth No. 1127 January 29th, 2015

Advantest to Exhibit at SEMICON Korea in Seoul, South Korea February 4-6 Showcasing Broad Portfolio of Semiconductor Products, Technologies and Solutions January 29th, 2015

Park Systems Announces Innovations in Bio Cell Analysis with the Launch of Park NX-Bio, the only 3-in-1 Imaging Nanoscale Tool Available for Life Science Researchers January 29th, 2015

2015 Nanonics Image Contest January 29th, 2015

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE